Cordierite-based glass-ceramics with non-stoichiometric composition doped with rare earth oxide (REO_2) and heavy metal oxide (M_2O_3) respectively were fabricated from glass powders. After sintering and crystallizati...Cordierite-based glass-ceramics with non-stoichiometric composition doped with rare earth oxide (REO_2) and heavy metal oxide (M_2O_3) respectively were fabricated from glass powders. After sintering and crystallization heat treatment, various physical properties, including compact density and apparent porosity, were examined to evaluate the sintering behavior of cordierite-based glass-ceramics. Results show that the additives both heavy metal oxide and rare earth oxide promote the sintering and lower the phase temperature from μ- to α-cordierite as well as affect the dielectric properties of sintered glass-ceramics. The complete-densification temperature for samples is as low as 900 ℃. The materials have a low dielectric constant (≈5), a low thermal expansion coefficient ((2.80～3.52)×10^(-6) ℃^(-1)) and a low dissipation factor (≤0.2%) and can be co-fired with high conductivity metals such as Au, Cu, Ag/Pd paste at low temperature (below 950 ℃), which makes it to be a promising material for low-temperature co-fired ceramic substrates.展开更多
文摘Cordierite-based glass-ceramics with non-stoichiometric composition doped with rare earth oxide (REO_2) and heavy metal oxide (M_2O_3) respectively were fabricated from glass powders. After sintering and crystallization heat treatment, various physical properties, including compact density and apparent porosity, were examined to evaluate the sintering behavior of cordierite-based glass-ceramics. Results show that the additives both heavy metal oxide and rare earth oxide promote the sintering and lower the phase temperature from μ- to α-cordierite as well as affect the dielectric properties of sintered glass-ceramics. The complete-densification temperature for samples is as low as 900 ℃. The materials have a low dielectric constant (≈5), a low thermal expansion coefficient ((2.80～3.52)×10^(-6) ℃^(-1)) and a low dissipation factor (≤0.2%) and can be co-fired with high conductivity metals such as Au, Cu, Ag/Pd paste at low temperature (below 950 ℃), which makes it to be a promising material for low-temperature co-fired ceramic substrates.
