Effect of wire diameter compression ratio on drawing deformation of micro copper wire

A crystal plasticity finite element model was developed for the drawing deformation of pure copper micro wire,based on rate-dependent crystal plasticity theory.The impact of wire diameter compression ratio on the micro-mechanical deformation behavior during the wire drawing process was investigated.Results indicate that the internal deformation and slip of the drawn wire are unevenly distributed,forming distinct slip and non-slip zones.Additionally,horizontal strain concentration bands develop within the drawn wire.As the wire diameter compression ratio increases,the strength of the slip systems and the extent of slip zones inside the deformation zone also increase.However,the fluctuating stress state,induced by contact pressure and frictional stress,results in a rough and uneven wire surface and diminishes the stability of the drawing process.

Texture evolution and its simulation of cold drawing copper wires produced by continuous casting

The texture evolution of cold drawing copper wires produced by continuous casting was measured by X-ray diffractometry and electron back-scatter diffractometry,and was simulated using Taylor model.The results show that in the drawn poly-crystal copper wires produced by traditional continuous casting,111 and 100 duplex fiber texture forms,and with increasing strain,the intensities of 111 and 100 increase.In the drawn single-crystal copper wires produced by Ohno continuous casting,100 rotates to 111,and there is inhomogeneous distribution of fiber texture along radial direction of the wires,which is caused by the distribution of shear deformation.Compared with 100,111 fiber texture is more stable in the drawn copper wires.Comparison of the experimental results with the simulated results shows that the simulation by Taylor model can analyze the texture evolution of drawn copper wires.

Temperature dependence of microstructure and texture in cold drawn aluminum wire

The effect of strain and drawing temperature on the evolution of microstructure and fiber textures of aluminum wiresdrawn at room temperature and cryogenic temperature was investigated by TEM and EBSD observations.The results show that lowangle boundaries frequency increases and high angle boundaries frequency decreases with strain increasing when the strain is low.Athigh strain,most of grain and dislocation boundaries are parallel to the drawn direction and low angle boundaries frequencydecreases and high angle boundaries frequency increases with strain increasing.The decrease of deformation temperature leads tomicrostructure finer and low angle boundaries frequency increasing.Texture analysis indicates that volume fraction of complextexture component decreases with strain increasing and a mixture of?111?and?100?fiber texture forms at high strain.?111?is stableat low strains but?100?becomes stable at high strain.The decrease of temperature can enhance the stability of?111?orientation athigh strain.

EFFECT OF RARE EARTH ON CONDUCTANCE OF ALUMINUM WIRE

Effects of Rare Earth(Hereafter RE)on the conductance of high-purity and industrial-purity aluminum wires have been studied.RE increases the resistivity of the high-purity aluminum.No evidence has been found that RE will decrease the resistivity of industrial-pure aluminum under various RE content including 0.3%Ce.The individual role of RE and its combined effects with Fe and Si have been discussed too.

Expansion of Plasma of Electrically Exploding Single Copper Wire Under 4.5kA～9.5kA/Wire

The experimental system for electrically exploding single metal wire has been designed and manufactured. Expansion of the dense plasma column formed from an electrically exploding Cu wire of diameter 30 μm has been studied with a high-speed photographer to obtain the time-dependent radius (R-t) curve. The experimental results demonstrate that the mean expansion rate of the dense plasma column is 1.94 μm/ns, 2.6 μm/ns and 3.75 μm/ns according to the peak pulse current 4.5 kA, 7 kA and 9.5 kA respectively. The results can be beneficial to giving a profound understanding of the early stage of wire-array Z-pinch physics and to improvement on their design.

Modified Coated Copper Wire as a New Fiber for SPME-GC Analysis of Some Polycyclic Aromatic Hydrocarbons

In this study for the first time, a novel copper Solid Phase Microextraction (SPME) fiber has been introduced for removal of naphthalene, phenanthrene and anthracene from aqueous solution. Copper was used as a solid support, which was at first coated by 3-mercaptopropyltrimethoxysi- lane. A stationary phase of oxidized multi walled carbon nanotube (MWCNTs)) was bonded to the surface of the copper wire. The developed SPME was characterized by IR and Scanning Electron Microscopy (SEM) and coupled to gas chromatography for separation of the analytes. Stability of the fiber, the effect of coating thickness and recovery time were optimized. The MWCNTs film thickness was about 5 μm which was perfect for a rapid mass transfer. The detection limits were at the range of 0.005 to 0.1 μg·L-1. The calibration curves were linear R2 > 0.9813 in the range of 0.01 to 5 μg·L-1. The method has been successfully applied for real samples with standard addition of 5 μL-1 of each sample. Stability study of the fiber to acid and alkali shows that it can be used for more than 50 times.

Effects of grain boundaries on electrical property of copper wires

By means of annealing at different temperatures, the copper wires with various numbers of grain boundaries were achieved. And the resistivity of copper wires was measured. The results show that with increasing the number of grain boundaries, the resistivity of copper wires increases, the relationship between the number of grain boundaries and the resistivity of cooper wires can be expressed as y =1.86×10 -8 e -0.90/ x . Unlike dislocation and lattice vacant sites, the curve of the grain boundary vs the resistivity is not linear. Grain boundary controls the general trend of the curve, but the type and the quantity of impurity controls the details of the curve.

Fabrication of Copper Wire Using Glyoxylic Acid Copper Complex and Laser Irradiation in Air

Preparation of a glyoxylic acid copper complex and fabrication of fine copper wire by CO2 laser irradiation in air to a thin film of that complex have been investigated. Irradiating laser to the complex thin film spin-coated on a glass substrate, thin film of metallic copper was fabricated in areas that were subjected to laser irradiation in air. The thickness of this thin copper film was approx. 30 to 40 nm, and as non-irradiated areas were etched and removed by a soluble solvent of the copper complex, fine copper wire with 200 μm width was formed by laser direct patterning. The resistivity of this thin copper film depended on the irradiation intensity of the laser and was 3.0 × 10–5 Ω·cm at 12 W intensity (sweep speed: 20 mm/s). This method enables the high-speed deposition of copper wiring in air by a printing process, indicating an inexpensive and useful process for fabricating copper wiring.

Bonding mechanism of ultrasonic wedge bonding of copper wire on Au/Ni/Cu substrate

The ultrasonic wedge bonding with d25 μm copper wire was achieved on Au/Ni plated Cu substrate at ambient temperature.Ultrasonic wedge bonding mechanism was investigated by using SEM/EDX,pull test,shear test and microhardness test.The results show that the thinning of the Au layer occurs directly below the center of the bonding tool with the bonding power increasing.The interdiffusion between copper wire and Au metallization during the wedge bonding is assumed negligible,and the wedge bonding is achieved by wear action induced by ultrasonic vibration.The ultrasonic power contributes to enhance the deformation of copper wire due to ultrasonic softening effect which is then followed by the strain hardening of the copper wedge bonding.

9R structure in drawn industrial single crystal copper wires

By using transmission electron microscopy, the microstructures of drawn industrial single crystal copper wires produced by Ohno Continuous Casting(OCC) process were analyzed. The results show that the typical microstructures in the wires mainly include extended planar dislocation boundaries, a small fraction of twins and some dislocation cells sharing boundaries parallel to drawn direction. Besides the typical microstructures, 9R structure configurations were observed in the wires. The formation of 9R polytypes may be caused by the coupled emission of Shockley dislocations from a boundary.

Shearing Mechanism of Straight Thin Copper Wires at Connecting Terminal due to Lightning Current

When a lightning current is impressed through a copper wire, the copper wire would be melted. A straight thin copper wire with a diameter of 0.1 mm,~ is melted due to the specific melting Joule heating （j^2t）m in an adiabatic condition. However, it has been recognized in the experiment that the thicker copper wires of φ1 mm are not completely melted, but sheared mainly at the connecting terminal by a relatively low impulse current. Electro-magnetic mechanical shearing stress, etc. are discussed in addition to the conventional Joule heating. New broken mechanisms were presumed and proved in the additional experiments.

Predicting size effect on diffusion-limited current density of oxygen reduction by copper wire

The size effect of copper wire radius (0.04–0.82 mm) on the diffusion-limited current density of an oxygen reduction reaction in stagnant simulated seawater (naturally aerated 0.5 mol/L NaCl) is investigated by potentiodynamic polarization and electrochemical impedance spectroscopy (EIS) and compared with the results obtained in 0.5 mol/L H2SO4. In the oxygen diffusion-limited range, size effect is found to occur independent of electrolytes, which is attributed to non-linear diffusion. Additionally, to satisfy application in a marine setting, an empirical equation correlating oxygen diffusion-limited current density to copper wire radius is proposed by fitting experimental data.

The Largest Copper, Aluminum Wire and Cable Production Enterprise in the Northwestern Region Lands in Qinghai

The largest wire and cable production enterprise in the northwestern region-Qinghai Xingming Electric Power Material Co.,Ltd.has been officially put into production,meaning that Qinghai will be able to selfproduce medium and high voltage or even EHV crosslinked power cables and develop and produce differentiated new products such as high-altitude cold-resistant photovoltaic

Effect of stress profile on microstructure evolution of cold-drawn commercially pure aluminum wire analyzed by finite element simulation

The evolution of microstructure in the drawing process of commercially pure aluminum wire （CPAW） does not only depend on the nature of materials, but also on the stress profile. In this study, the effect of stress profile on the texture evolution of the CPAW was systematically investigated by combining the numerical simulation and the microstructure observation. The results show that the tensile stress at the wire center promotes the formation of 〈111〉 texture, whereas the shear stress nearby the rim makes little contribution to the texture formation. Therefore, the 〈111 〉 texture at the wire center is stronger than that in the surface layer, which also results in a higher microhardness at the center of the CPAW under axial loading.2017 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science ＆ Technology.

Microstructure evolution of single crystal copper wires in cold drawing

The deformation microstructure evolution of single crystal copper wires produced by OCC method has been studied with the help of TEM, EBSD; OM. The results show that there are a small number of dendrites; twins in the undeformed single crystal copper wires. However, it is difficult to observe these dendrites in deformed single crystal copper wires. The structure evolution of deformed single crystal copper wires during drawing process can be divided into three stages. When the true strain is lower than 0.94, macroscopic subdivision of grains is not evident,; the microscopic evolution of deformed structure is that the cells are formed; elongated in drawn direction. When the true strain is between 0.94; 1.96, macroscopic subdivision of grains takes place,; the number of microbands located on {111}; cell blocks is much more than that with the true strain lower than 0.94. When the true strain is larger than 1.96, the macroscopic subdivision of grains becomes more evident than that with the true strain between 0.94; 1.96,; S-bands structure; lamellar boundaries will be formed. From EBSD analysis, it is found that part of 100 texture resulting from solidifying is transformed into 111; 112 due to shear deformation, but 100 texture component is still kept in majority. When the true strain is 0.94, the misorientation angle of dislocation boundaries resulting from deformation is lower than 14°. However, when the true strain arrives at 1.96, the misorientation angle of some boundaries will be greater than 50°,; the peak of misorientation angle distribution produced by texture evolution is located in the range between 25°; 30°.

Characteristic of laser-MIG hybrid welding with filling additional cold wire for aluminum alloy

The weld appearance, deposition rate, welding efficiency, stability of arc, laser keyhole characteristic, and weld property were studied by using a novel laser-MIG hybrid welding process with filling wire of aluminum alloy. The results were also compared with those by conventional laser-MIG hybrid welding process. It was found that with the suitable process parameters this novel welding process for aluminum alloy was stable and final weld bead had fine appearance. Compared to conventional laser-MIG hybrid welding process, during this novel welding process the stability of arc, the laser keyhole characteristic and the weld property were similar, while the keyhole cycle frequency and keyhole opening area had differences of 1.23% and 15.34%, respectively, and the welding efficiency increased by about 31% without increasing heat input.

Effect of wire mesh interlayer in explosive cladding of dissimilar grade aluminum plates

Explosive cladding of Al 5052–Al 1100 plate, interfaced with a stainless steel wire mesh interlayer, is attempted. Loading ratio and standoff distance were varied. An increase in loading ratio (R) and standoff distance (S) enhances the plate velocity (Vp), dynamic bend angle (β) and pressure developed (P). The interface morphology of the explosive clads confirms strong metallurgical bond between the wire mesh and aluminum plates. Further, a smooth transition from straight to undulating interlayered topography is witnessed. The introduction of a wire mesh, as interlayer, leads to an improvement in mechanical strength with a slender reduction in overall corrosion resistance of the “explosive clads”.

A STUDY OF CONTINUOUS EXTRUSION-CLADDING PROCESSFOR PRODUCTION OF ALUMINUM-CLADDING STEEL WIRE

In this study the process of cladding steel wires with aluminum is investigated experimentally. It is studied how the cladding process and the quality of products are influenced by the aluminum deformation temperature, the wheel speed, the temperature of steel wire, the wire speed and the steel wire tensile force. The relation among the process parameters above is discussed, and the effect of the aluminum deformation temperature on the coating microstructure is analyzed. This paper suggested a reasonable range of process parameters for producing aluminum cladding steel wires.

Corrosion resistance of aluminum alloy AA7022 wire fabricated by friction stir extrusion

Friction stir extrusion(FSE)is known as an innovative manufacturing technology that makes it possible to directly produce wire via consolidation and extrusion of metal chips or solid billets.In this study,wire samples were produced using aluminum alloy AA7022 machining chips by the use of the FSE.To this end,the microstructures and mechanical properties of the base material(BM)and the extruded samples were investigated.The corrosion resistance of the given samples was also determined using potentiodynamic polarization technique.The results showed that the samples manufactured at higher rotational speeds possessed good surface quality,the process temperature and the grain size similarly increased following the rise in rotational speed,and the mechanical properties consequently decreased.Using the FSE led to crystallite refinement,increase in volume fraction of grain boundaries,as well as re-distribution of precipitates affecting corrosion resistance.Furthermore,the findings of the corrosion tests revealed that the produced samples by the FSE had adequate corrosion resistance and the growth in die rotation rate augmented current density and subsequently reduced corrosion resistance.

TIG welding-brazing joint of aluminum to stainless steel with hot wire

TIG welding-brazing process with high frequency induction hot wire technology was presented to create joints between 5A06 aluminum alloy and SUS32! stainless steel using ER1100 filler wire with different temperature. The joints were evaluated by mechanical test and microstructural analyses. The welding procedure using hot fiUer wire （400 ℃ ） significantly increases strength stability by 71% and average value of tensile strength by 30. 8 % of the joints, compared with cold wire. The research of microstructures in interfaces and welded seams reveals that using 400 ℃ hot filler wire can decrease the thickness of intermetallic compounds （ IMCs ） from 6 to 3.5 txm approximately, which is the main reason of mechanical property improvement.