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A bounding surface visco-plasticity model considering generalized spacing ratio of soils
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作者 Xiaosen Kang Hongjian Liao +1 位作者 Qiangbing Huang Jianbing Peng 《Journal of Rock Mechanics and Geotechnical Engineering》 SCIE CSCD 2024年第5期1832-1846,共15页
The non-unique critical state of soils with time-dependent behaviors is a significant issue in geotechnical engineering problems.However,previous bounding surface plasticity models cannot predict accurately the non-un... The non-unique critical state of soils with time-dependent behaviors is a significant issue in geotechnical engineering problems.However,previous bounding surface plasticity models cannot predict accurately the non-unique critical state of soils,because the distance between the compression line and critical state line charged by strain-rate effect is basically neglected.To fill this gap,a generalized spacing ratio of soils is defined in the elasto-viscoplastic framework,and a bounding surface visco-plasticity model is formulated and verified,which can consider the generalized spacing ratio.Specifically,the generalized spacing ratio of soils reflects the distance between the compression line and the critical state line of soils with time-dependent behaviors.Then,the generalized spacing ratio is introduced into an improved anisotropic bounding surface.A new expression of the visco-plastic multiplier is derived by solving the consistency equation of an anisotropic bounding surface.In the expression,a strain rate index is proposed to account for the strain-rate effect on visco-plastic strain increment,and a visco-plastic hardening modulus is derived to predict the visco-plastic response of soils in overconsolidation conditions.The model is then verified through constant strain rate tests and creep tests.Notably,it can capture the non-unique critical states of soils with time-dependent behaviors due to the generalized spacing ratio and the creep rupture of soils due to the visco-plastic multiplier that considers the stress ratio and visco-plastic strain rate. 展开更多
关键词 Soil Constitutive model visco-plastic behavior Strain rate CREEP ANISOTROPIC
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基于Anand模型的BGA封装热冲击循环分析及焊点疲劳寿命预测
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作者 张惟斌 申坤 +1 位作者 姚颂禹 江启峰 《电子与封装》 2024年第3期45-49,共5页
BGA封装在电子元器件中的互连、信息传输等方面起着重要作用,研究封装元件的可靠性以及内部焊点在高温、高湿、高压等极限条件下的稳定性显得尤为重要。基于Anand模型分析了封装元件在热冲击下的塑性变形和应力分布,同时对不同空间位置... BGA封装在电子元器件中的互连、信息传输等方面起着重要作用,研究封装元件的可靠性以及内部焊点在高温、高湿、高压等极限条件下的稳定性显得尤为重要。基于Anand模型分析了封装元件在热冲击下的塑性变形和应力分布,同时对不同空间位置焊点的最大应力与主要失效位置进行了对比,并运用Darveaux模型计算出焊点最危险单元的裂纹萌生、裂纹扩展速率和疲劳寿命。结果表明,在热冲击极限载荷下,封装元件的温度呈现对称分布,表面温度与内部温度差较大,约为15℃;最大变形为0.038 mm,最大变形位置为外侧镀膜处;最大应力为222.18 MPa,内部其余部分的应力值为20 MPa左右。对于内部焊点,最大应力为19.02 MPa (250 s),应力最大位置在锡球下方边缘,预估其疲劳寿命为6.29天。 展开更多
关键词 BGA封装 anand模型 焊点 热冲击 疲劳寿命
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Fractional-order visco-plastic constitutive model for uniaxial ratcheting behaviors 被引量:5
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作者 Wenjie ZHAO Shaopu YANG +1 位作者 Guilin WEN Xuehong REN 《Applied Mathematics and Mechanics(English Edition)》 SCIE EI CSCD 2019年第1期49-62,共14页
This paper proposes a novel unified visco-plastic constitutive model for uniaxial ratcheting behaviors. The cyclic deformation of the material presents remarkable time-dependence and history memory phenomena. The frac... This paper proposes a novel unified visco-plastic constitutive model for uniaxial ratcheting behaviors. The cyclic deformation of the material presents remarkable time-dependence and history memory phenomena. The fractional(fractional-order)derivative is an efficient tool for modeling these phenomena. Therefore, we develop a cyclic fractional-order unified visco-plastic(FVP) constitutive model. Specifically, within the framework of the cyclic elasto-plastic theory, the fractional derivative is used to describe the accumulated plastic strain rate and nonlinear kinematic hardening rule based on the Ohno-Abdel-Karim model. Moreover, a new radial return method for the back stress is developed to describe the unclosed hysteresis loops of the stress-strain properly.The capacity of the FVP model used to predict the cyclic deformation of the SS304 stainless steel is verified through a comparison with the corresponding experimental data found in the literature(KANG, G. Z., KAN, Q. H., ZHANG, J., and SUN, Y. F. Timedependent ratcheting experiments of SS304 stainless steel. International Journal of Plasticity, 22(5), 858–894(2006)). The FVP model is shown to be successful in predicting the rate-dependent ratcheting behaviors of the SS304 stainless steel. 展开更多
关键词 cyclic visco-plastic CONSTITUTIVE fractional DERIVATIVE FRACTIONAL-ORDER uni-fied visco-plastic(FVP)model rate-dependent RATCHETING
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Study on the Deformation Behavior of Mg-Gd-Y-Zn-Mn Wrought Magnesium Alloys by Visco-plastic Self-consistent Modeling 被引量:1
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作者 WANG Yuye ZHANG Junfa +5 位作者 WANG Shiwei KANG Jing MENG Jiajie WANG Yanbo XU Yuling ZHOU Haitao 《上海航天(中英文)》 CSCD 2022年第1期77-83,136,共8页
The plastic deformation behavior of new Mg-Gd-Y-Zn-Mn magnesium alloys gains great necessity to clarify and understand the mechanism deeply. In the present work,the tensile mechanical property test and visco-plastic s... The plastic deformation behavior of new Mg-Gd-Y-Zn-Mn magnesium alloys gains great necessity to clarify and understand the mechanism deeply. In the present work,the tensile mechanical property test and visco-plastic self-consistent (VPSC) model are used to investigate the activities of deformation modes of VW84M and VW94M magnesium alloys during the tensile deformation. The results show that the mechanical properties of the above extruded alloys are similar but VW94M has higher strength than VW84M after the same aging process. Compared with the extruded alloys,the as-aged alloys have significantly higher activation of pyramidal slip at the later stage of plastic deformation. In addition,the as-aged VW94M alloy with higher strength has the largest activity of pyramidal slip. In summary,the addition of Gd increases the critical resolved shear stress (CRSS)in each slip system of VW94M,while the increase in the strength and the decrease in the elongation of as-aged alloys are associated with the significant activation of pyramidal slip. 展开更多
关键词 Mg-RE alloy wrought magnesium alloy visco-plastic self-consistent(VPSC)model deformation behavior
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Application of Anand's constitutive model on twin roll casting process of AZ31 magnesium alloy 被引量:2
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作者 胡小东 巨东英 《中国有色金属学会会刊:英文版》 CSCD 2006年第B02期586-590,共5页
Twin-roll thin strip casting process combines casting and hot rolling into a single process, in which thermal stress and thermal mechanical stress were involved. Considering the high temperature gradient, the existing... Twin-roll thin strip casting process combines casting and hot rolling into a single process, in which thermal stress and thermal mechanical stress were involved. Considering the high temperature gradient, the existing of liquid and solid regions and rolling deformation, suitable constitutive model is the key to describe the process. Anand's model is a temperature-dependent, rate-dependent and unified of creep and plasticity model and the Jaumann derivative was employed in Anand's model which makes the constitutive model frame-indifferent or objective, therefore the highly nonlinearities behavior in the twin-roll casting process can be simulated. The parameters of the Anand's model were regressed based on the compression tests of AZ31 magnesium alloy. The simulation results reveal that the Anand's model can well describe the deformation characteristics of twin-roll casting process. Based on the simulation results, the form of evolution equations in Anand's model was discussed. 展开更多
关键词 AZ31镁合金 薄带 双辊铸造过程 anand成分模型 粘弹性
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无铅焊料的力学性能研究及ANAND本构参数确定 被引量:7
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作者 陈雪凡 梁利华 +1 位作者 刘勇 王强 《应用力学学报》 CAS CSCD 北大核心 2009年第2期248-252,共5页
根据ASTM E8M-04标准,对两种无铅焊料91.5Sn8.5Sb和95.5Sn3.8Ag0.7Cu分别在15℃、75℃、150℃温度下和10-5s^10-2s十种应变速率下进行了一系列恒定应变速率的拉伸试验。分析了这两种无铅焊料的粘塑性力学行为。实验表明这两种无铅焊料... 根据ASTM E8M-04标准,对两种无铅焊料91.5Sn8.5Sb和95.5Sn3.8Ag0.7Cu分别在15℃、75℃、150℃温度下和10-5s^10-2s十种应变速率下进行了一系列恒定应变速率的拉伸试验。分析了这两种无铅焊料的粘塑性力学行为。实验表明这两种无铅焊料具有温度和应变速率相关性。采用统一型Anand粘塑性本构式,描述了这两种无铅焊料的非弹性率相关的变形行为,并基于非线性拟合程序确定了Anand粘塑性本构式的九个材料常数。结果表明Anand式能有效描述无铅焊料的粘塑性行为,可应用于电子封装无铅焊点的可靠性模拟和失效分析。 展开更多
关键词 anand 本构模型 无铅焊料 粘塑性
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Anand模型预测63Sn37Pb焊锡钎料的应力应变行为 被引量:18
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作者 张莉 陈旭 +1 位作者 Nose H Sakane M 《机械强度》 CAS CSCD 北大核心 2004年第4期447-450,共4页
通过在温度 3 13K~ 3 98K、应变率 10 - 3% s~ 10 % s内的一系列恒应变率拉伸实验 ,研究 63Sn3 7Pb焊锡钎料的力学行为 ,发现该材料的应力应变关系与温度和应变率有很大的相关性。采用统一型Anand粘塑性本构方程对该材料在较大温度... 通过在温度 3 13K~ 3 98K、应变率 10 - 3% s~ 10 % s内的一系列恒应变率拉伸实验 ,研究 63Sn3 7Pb焊锡钎料的力学行为 ,发现该材料的应力应变关系与温度和应变率有很大的相关性。采用统一型Anand粘塑性本构方程对该材料在较大温度和应变率范围内的应力应变行为进行数值模拟。结果表明Anand粘塑性方程可以有效地描述 63Sn3 7Pb焊锡钎料在 10 %应变下的温度和应变率相关粘塑性本构行为。 展开更多
关键词 63Sn37Pb焊锡钎料 anand粘塑性模型 应力应变行为
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Anand本构方程在焊点可靠性研究中的应用 被引量:4
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作者 王旭艳 徐仁春 刘刚 《电焊机》 北大核心 2012年第12期66-69,共4页
焊点可靠性直接决定了电子产品的使用寿命。因此,在微电子领域,对焊点可靠性提出了更高的要求。有限元模拟技术是研究焊点可靠性的重要手段。综合评述了一种统一了蠕变和塑性变形的非线性本构方程——Anand本构模型;概述了其发展演变过... 焊点可靠性直接决定了电子产品的使用寿命。因此,在微电子领域,对焊点可靠性提出了更高的要求。有限元模拟技术是研究焊点可靠性的重要手段。综合评述了一种统一了蠕变和塑性变形的非线性本构方程——Anand本构模型;概述了其发展演变过程及研究现状;介绍了该本构方程中9个参数的计算规则,并进一步分析了目前国内外对于本构方程参数的确定以及进一步的改进情况。在焊点可靠性研究方面,评论了该模型在无铅QFP、BGA焊点应力-应变分析及焊点疲劳寿命预测方面的应用,为焊点可靠性的研究提供了理论指导。同时,为了更好的研究无铅焊点的可靠性,对该模型的构建及修正提出了新的需求。 展开更多
关键词 anand本构模型 蠕变 微电子焊接 焊点可靠性
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基于Anand本构关系的损伤模型及其在ABAQUS中的单元验证 被引量:3
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作者 高军 黄再兴 《力学季刊》 CSCD 北大核心 2011年第2期153-158,共6页
本文在粘塑性Anand本构方程中引入各向同性损伤变量,建立了基于Anand本构的损伤模型;使用通用有限元分析软件ABAQUS的用户子程序接口UMAT,编写了该损伤模型用户子程序,并将其接入ABAQUS。经过单元级的数值计算,验证了所建立的损伤模型... 本文在粘塑性Anand本构方程中引入各向同性损伤变量,建立了基于Anand本构的损伤模型;使用通用有限元分析软件ABAQUS的用户子程序接口UMAT,编写了该损伤模型用户子程序,并将其接入ABAQUS。经过单元级的数值计算,验证了所建立的损伤模型及其相关的用户子程序。结果表明基于Anand本构的损伤模型可以正确表现粘塑性材料的特征,并能反映材料因损伤而出现的刚度退化现象,可供电子封装及其元器件的可靠性评估参考。 展开更多
关键词 anand本构方程 损伤模型 ABAQUS 用户子程序
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基于Anand模型的柔性直流输电用IGBT模块焊接应力变形分析 被引量:3
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作者 王蕤 骆健 +3 位作者 姚二现 董长城 刘旭光 杨阳 《半导体技术》 CAS 北大核心 2021年第11期887-892,898,共7页
IGBT模块直接覆铜(DBC)基板与底板进行回流焊接过程中,由于材料热膨胀系数不匹配,会产生较大翘曲与残余应力,影响模块可靠性。针对某柔性直流(VSC-HVDC)输电用大功率IGBT模块,基于有限元法,根据实际真空回流焊温度曲线,对比分析了Al_(2)... IGBT模块直接覆铜(DBC)基板与底板进行回流焊接过程中,由于材料热膨胀系数不匹配,会产生较大翘曲与残余应力,影响模块可靠性。针对某柔性直流(VSC-HVDC)输电用大功率IGBT模块,基于有限元法,根据实际真空回流焊温度曲线,对比分析了Al_(2)O_(3)/Cu、AlN/AlSiC和Si_(3)N_(4)/AlSiC 3种陶瓷衬板与底板组合的焊接翘曲变形与残余应力分布。结果表明相对于Cu底板,采用AlSiC底板能有效降低底板翘曲与残余应力。相较于Si_(3)N_(4)陶瓷衬板,AlN陶瓷衬板与AlSiC底板的热膨胀系数匹配度更高,焊接后翘曲与残余应力最小。测试结果表明,AlN/AlSiC组合的仿真与实测变形量基本一致,测量范围内长边和短边方向误差分别为5.9%和5.6%。 展开更多
关键词 绝缘栅双极晶体管(IGBT) 回流焊 anand模型 陶瓷衬板 底板
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Pb_(90)Sn_(10)焊点硅基器件与PCB板组装的温循可靠性研究 被引量:1
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作者 张君直 凌显宝 +1 位作者 袁汉钦 田飞飞 《固体电子学研究与进展》 CAS 北大核心 2023年第4期370-374,共5页
采用有限元仿真和实验两者相结合的方法,对-40~70℃使用环境下的Pb_(90)Sn_(10)焊点硅基器件与PCB板组装的组件,选择-55~85℃温度循环条件进行可靠性分析和研究。Anand模型仿真分析焊点在温循下应力应变行为,提取模型焊点在最后一个温... 采用有限元仿真和实验两者相结合的方法,对-40~70℃使用环境下的Pb_(90)Sn_(10)焊点硅基器件与PCB板组装的组件,选择-55~85℃温度循环条件进行可靠性分析和研究。Anand模型仿真分析焊点在温循下应力应变行为,提取模型焊点在最后一个温度循环结束时的等效塑性应变分布并进行分析,确定最易发生热疲劳失效的关键焊点和关键位置。基于Coffin-Manson方程对热循环条件下焊点的服役寿命和失效模式进行预测。仿真结果表明焊点失效机理为热疲劳失效,失效模式为焊点开裂,失效循环周期为3984 cycles。实验表明:温度循环500次,未出现焊点裂纹、空洞等缺陷;温度循环2000次后焊点形貌由球形变为椭球形,焊点未出现明显缺陷。 展开更多
关键词 Pb_(90)Sn_(10)焊点 温度循环 anand模型仿真 寿命预测
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不同填胶方式对细间距器件焊点可靠性影响 被引量:1
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作者 鲍诺 王春洁 宋顺广 《材料科学与工艺》 EI CAS CSCD 北大核心 2013年第3期110-115,共6页
为了获得一种较好的填胶方式来增加3D PLUS组件焊点的可靠性,采用非线性有限元分析方法和统一型粘塑性Anand本构方程,分析热循环载荷下无胶、端封、底封三种状况焊点的应力、应变分布情况及危险点位置,得到焊点应力和塑性应变周期性累... 为了获得一种较好的填胶方式来增加3D PLUS组件焊点的可靠性,采用非线性有限元分析方法和统一型粘塑性Anand本构方程,分析热循环载荷下无胶、端封、底封三种状况焊点的应力、应变分布情况及危险点位置,得到焊点应力和塑性应变周期性累积叠加并逐渐趋于平缓的规律.比较三种状态下焊点的应力、塑性应变的最大值及其变化规律,分析结果表明底封方式能有效的改善焊点的应力、应变状况.改变底封方式胶粘剂的线膨胀系数,找到线膨胀系数对焊点应力、应变影响规律,选出较优线膨胀系数的胶粘剂. 展开更多
关键词 焊点 anand模型 填胶方式 等效应力 塑性应变 有限元法
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Sn57Bi0.1Sb钎料力学性能分析及Anand模型参数确定
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作者 杨浩 王小京 蔡珊珊 《电子与封装》 2024年第11期22-26,共5页
分析了0.1Sb掺杂Sn57Bi钎料合金在不同温度(25、60、80、100、120℃)和应变速率(0.0001、0.001、0.005、0.01、0.05、0.1 s^(-1))下的单轴拉伸力学行为,实验结果表明,Sn57Bi0.1Sb钎料表现出显著的温度和应变速率相关性。随着温度的升高... 分析了0.1Sb掺杂Sn57Bi钎料合金在不同温度(25、60、80、100、120℃)和应变速率(0.0001、0.001、0.005、0.01、0.05、0.1 s^(-1))下的单轴拉伸力学行为,实验结果表明,Sn57Bi0.1Sb钎料表现出显著的温度和应变速率相关性。随着温度的升高,抗拉强度降低,而随着应变速率的提高,抗拉强度提高。在高温条件下,材料的初始强化阶段延长,且整体的强度增长速率减缓。在实验数据的基础上,采用非线性数据拟合方法对Anand本构模型进行参数确定,提取了描述材料黏塑性行为的9个重要参数。Anand模型通过内变量有效地捕捉了材料在不同条件下的应力-应变响应,包括温度、应变速率、硬化/软化效应等多重影响因素。模型的准确性通过实验数据得以验证,所得参数可以为后续的有限元模拟与工程应用中的材料设计提供可靠的参考依据。 展开更多
关键词 钎料 单轴拉伸 黏塑性 anand本构模型
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CSP封装Sn-3.5Ag焊点的热疲劳寿命预测 被引量:9
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作者 韩潇 丁汉 +1 位作者 盛鑫军 张波 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2006年第9期1695-1700,共6页
对芯片尺寸封装(CSP)中Sn-3.5Ag无铅焊点在热循环加速载荷下的热疲劳寿命进行了预测.首先利用ANSYS软件建立CSP封装的三维有限元对称模型,运用Anand本构模型描述Sn-3.5Ag无铅焊点的粘塑性材料特性;通过有限元模拟的方法分析了封装结构... 对芯片尺寸封装(CSP)中Sn-3.5Ag无铅焊点在热循环加速载荷下的热疲劳寿命进行了预测.首先利用ANSYS软件建立CSP封装的三维有限元对称模型,运用Anand本构模型描述Sn-3.5Ag无铅焊点的粘塑性材料特性;通过有限元模拟的方法分析了封装结构在热循环载荷下的变形及焊点的应力应变行为,并结合Darveaux疲劳寿命模型预测了无铅焊点的热疲劳寿命. 展开更多
关键词 芯片尺寸封装 无铅焊点 anand本构模型 疲劳寿命 有限元分析
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锡铅钎料粘塑性行为及其本构描述 被引量:4
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作者 邢睿思 王龙 +1 位作者 侯传涛 宋俊柏 《力学季刊》 CAS CSCD 北大核心 2022年第3期712-720,共9页
随着航天事业的发展,航天电子产品使用环境变得越来越复杂苛刻,对焊点可靠性要求日益提高,因此,研究焊点材料服役环境下的本构关系对于分析焊点性能、准确预测焊点可靠性具有重要意义.本文分析锡铅钎料Sn63Pb37在-45~150℃温度范围内和1... 随着航天事业的发展,航天电子产品使用环境变得越来越复杂苛刻,对焊点可靠性要求日益提高,因此,研究焊点材料服役环境下的本构关系对于分析焊点性能、准确预测焊点可靠性具有重要意义.本文分析锡铅钎料Sn63Pb37在-45~150℃温度范围内和10^(-5)~10^(-3)/s应变率范围内的粘塑性行为,在此基础上,建立了修正的Anand本构模型.通过构建材料参数与温度的函数关系,提升Anand本构模型在不同环境温度尤其是低温环境下对材料应力-应变关系的预测能力,为航天电子产品可靠性设计提供技术支撑. 展开更多
关键词 锡铅钎料 anand模型 粘塑性 本构模型
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Two-dimensional simulation on the rolling process of semi-solid 60Si2Mn by finite element method 被引量:4
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作者 Renbo Song, Yonglin Kang, Xueping Ren, Hongbo Dong, and Jiwen WangMaterials Science and Engineering School, University of Science and Technology Beijing, Beijing 100083, China 《Journal of University of Science and Technology Beijing》 CSCD 2002年第4期273-276,共4页
The effect of various process variables on the law of metal flow for semi-solid rolling 60Si2Mn was studied by finite element method. Semi-solid 60Si2Mn can be described as compressible rigid visco-plastic porous mate... The effect of various process variables on the law of metal flow for semi-solid rolling 60Si2Mn was studied by finite element method. Semi-solid 60Si2Mn can be described as compressible rigid visco-plastic porous material saturated with liquid. In terms of ther-mo-mechanical coupling condition, the distributions of stress, velocity and temperature were studied using software MARC. The simulation results show that the rigid visco-plastic model can accurately describe the semi-solid 60Si2Mn rolling process. The great deformation can achieve completely in view of low flow stress of semi-solid slurry. 展开更多
关键词 finite-element analysis SEMI-SOLID thermo-mechanical coupling compressible rigid visco-plastic model ROLLING
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Numerical and Experimental Investigations of the Thermal Fatigue Lifetime of CBGA Packages 被引量:1
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作者 Borui Yang Jun Luo +3 位作者 Bo Wan Yutai Su Guicui Fu Xu Long 《Computer Modeling in Engineering & Sciences》 SCIE EI 2022年第2期1113-1134,共22页
A thermal fatigue lifetime prediction model of ceramic ball grid array(CBGA)packages is proposed based on the Darveaux model.A finite element model of the CBGA packages is established,and the Anand model is used to de... A thermal fatigue lifetime prediction model of ceramic ball grid array(CBGA)packages is proposed based on the Darveaux model.A finite element model of the CBGA packages is established,and the Anand model is used to describe the viscoplasticity of the CBGA solder.The average viscoplastic strain energy density increment △Wave of the CBGA packages is obtained using a finite element simulation,and the influence of different structural parameters on theWave is analyzed.A simplified analytical model of the △Wave is established using the simulation data.The thermal fatigue lifetime of CBGA packages is obtained from a thermal cycling test.The Darveaux lifetime predictionmodel ismodified based on the thermal fatigue lifetime obtained fromthe experiment and the corresponding △Wave.A validation test is conducted to verify the accuracy of the thermal fatigue lifetime prediction model of the CBGA packages.This proposed model can be used in engineering to evaluate the lifetime of CBGA packages. 展开更多
关键词 CBGA packages lifetime prediction finite element method thermal fatigue anand model Darveaux model
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A coupled elastoplastic and visco-plastic damage model for hard clay and its application for the underground gallery excavation
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作者 Hanbing Bian Xiaotian Zhang Jianfu Shao 《Underground Space》 SCIE EI 2017年第1期60-72,共13页
The numerical modelling of the excavation of an underground gallery in hard clay has been discussed in current article.A constitutive model is proposed to describe poromechanical behaviour of the hard clay.The main fe... The numerical modelling of the excavation of an underground gallery in hard clay has been discussed in current article.A constitutive model is proposed to describe poromechanical behaviour of the hard clay.The main features of the hard clay observed in laboratory and in-situ experimental investigation have been taken into account in the proposed constitutive model,in particular the plastic deformation,the visco-plastic deformation,the damage,etc.The influence of the initial in-situ stress and the pore pressure has been taken into consideration.The numerical modelling of the underground excavation has been implemented by using a fully coupled hydro-mechanical finite element calculation code.The performance of the model is examined by comparing numerical simulations with in situ measurements.The proposed model and the calculation procedure for the modelling of the excavation of an underground gallery have the capacity to reproduce well the excavation damaged/distributed zone and other main features and phenomena observed during the excavation process.However,the in-situ observed convergence could not be reproduced correctly.More effort on the discontinuous problem should be made for the reproduce the observed convergence. 展开更多
关键词 Full coupled hydro-mechanical processes Elasto-plastic-damage model visco-plastic model Underground excavation
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Efect of Pre‑stretch Strain at High Temperatures on the Formability of AZ31 Magnesium Alloy Sheets
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作者 Yongqiao Li Lifei Wang +6 位作者 Xiaohuan Pan Qiang Zhang Guangsheng Huang Bin Xing Weili Cheng Hongxia Wang Kwang Seon Shin 《Acta Metallurgica Sinica(English Letters)》 SCIE EI CAS CSCD 2023年第1期48-60,共13页
High-temperature pre-stretching experiments were carried out on the AZ31 Mg alloy at 723 K with strain levels of 2.54%,6.48%,10.92%,and 19.2%to alter the microstructure and texture for improving room-temperature forma... High-temperature pre-stretching experiments were carried out on the AZ31 Mg alloy at 723 K with strain levels of 2.54%,6.48%,10.92%,and 19.2%to alter the microstructure and texture for improving room-temperature formability.The results showed that the strain-hardening coefcient increased,while the Lankford value decreased.In addition,the Erichsen values of all pre-stretch sheets were enhanced compared with that of the as-received sheet.The maximum Erichsen value increased from 2.38 mm for the as-received sample to 4.03 mm for the 10.92%-stretched sample,corresponding to an improvement of 69.32%.This improvement was mainly attributed to the gradual increase in grain size,and the(0001)basal texture was weakened due to the activated non-basal slip as the high-temperature pre-stretching strain levels increased.The visco-plastic self-consistent analysis was performed on the as-received and high-temperature pre-stretched samples.Results confrmed the higher activity of the prismatic slip in 10.92%-stretched sample,leading to divergence and weakening of basal texture components.This results in an augmentation of the Schmid factor under diferent slip systems.Therefore,it can be concluded that high-temperature pre-stretching technology provided an efective method to enhance the formability of Mg alloy sheets. 展开更多
关键词 High-temperature deformation Grain growth Magnesium alloys TEXTURE visco-plastic self-consistent modeling FORMABILITY
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Sn-Ag3.0-Cu0.5/Cu金属间化合物生长行为及其对PBGA焊点热疲劳可靠性的影响 被引量:3
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作者 肖革胜 杨雪霞 +2 位作者 李志刚 陈桐 树学峰 《稀有金属材料与工程》 SCIE EI CAS CSCD 北大核心 2013年第11期2315-2320,共6页
利用SMT全自动回流焊机和高温恒温试验箱,制备出经2次回流焊且不同时效处理时间的Sn-Ag3.0-Cu0.5/Cu焊点试件,对其金属间化合物(IMC)的厚度进行测量,发现其厚度的增长与时效时间的平方根近似成线性关系。采用统一粘塑性Anand本构模型来... 利用SMT全自动回流焊机和高温恒温试验箱,制备出经2次回流焊且不同时效处理时间的Sn-Ag3.0-Cu0.5/Cu焊点试件,对其金属间化合物(IMC)的厚度进行测量,发现其厚度的增长与时效时间的平方根近似成线性关系。采用统一粘塑性Anand本构模型来描述焊点的力学性能,运用有限元计算软件ANSYS对PBGA构件进行热循环模拟,对其在不同IMC厚度下的应力和应变响应进行分析。结果表明,芯片右下方焊点右上角热循环结束后累积的等效塑性应变最大,是整个PBGA构件的关键焊点;随着IMC厚度的增加,关键焊点热循环过程中的等效应力水平不断降低,相应剪切塑性应变范围Δγ不断增大,热疲劳寿命Nf则不断降低;升温和高温保温过程中剪切塑性应变的增加量构成了剪切塑性应变范围Δγ,且不同IMC厚度下升温段剪切塑性应变增加量占Δγ的比例基本维持在95%左右。 展开更多
关键词 金属间化合物 热循环模拟 剪切塑性应变 热疲劳寿命 anand本构模型
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