Characterization of Crystalline Nanoparticles/Nanorods Synthesized by Atmospheric Plasma Enhanced Chemical Vapor Deposition of Perfluorohexane

A mass of nanoparticles/nanorods were formed on a simultaneously deposited gran- ular film by plasma enhanced chemical vapor deposition （PECVD） of perfluorohexane at atmo- spheric pressure without any catalysts or templates. Scanning electron microscopy （SEM） and X-ray photoelectron spectroscopy （XPS） were used to characterize the morphology and the chem- ical compositions of nanoparticles. The average size of particles is about 100 nm and the length of synthesized nanorods is between 1 μm and 2.5/tm. The analyses of transmission electron microscopy （TEM）, high-resolution transmission electron microscopy （HRTEM）, selected area electron diffraction（SAED） and X-ray diffraction （XRD） reveals that the nanoparticles and nanorods are crystalline.

The Effect of Pressure on the Dissociation of H_2/CH_4Gas Mixture during Diamond Films Growth via Chemical Vapor Deposition

Monte Carlo simulations are adopted to study the electron motion in the mixture of H2 and CH4 during diamond synthesis via Glow Plasma-assisted Chemical Vapor Deposition (GPCVD). The non-uniform electric field is used and the avalanche of electrons is taken into account in this simulation. The average energy distribution of electrons and the space distribution of effective species such as CH3, CH+3, CH+ and H at various gas pressures are given in this paper, and optimum experimental conditions are inferred from these results.

Room Temperature and Reduced Pressure Chemical Vapor Deposition of Silicon Carbide on Various Materials Surface

At room temperature, 300 K, silicon carbide film was formed using monomethylsilane gas on the reactive surface prepared using argon plasma. Entire process was performed at reduced pressure of 10 Pa in the argon plasma etcher, without a substrate transfer operation. By this process, the several-nanometer-thick amorphous thin film containing silicon-carbon bonds was obtained on various substrates, such as semiconductor silicon, aluminum and stainless steel. It is concluded that the room temperature silicon carbide thin film formation is possible even at significantly low pressure, when the substrate surface is reactive.

Cleaning of nitrogen-containing carbon contamination by atmospheric pressure plasma jet

Atmospheric pressure plasma jet(APPJ)was used to clean nitrogen-containing carbon films(C–N)fabricated by plasma-assisted chemical vapor deposition method employing the plasma surface interaction linear device at Sichuan University(SCU-PSI).The properties of the contaminated films on the surface of pristine and He-plasma pre-irradiated tungsten matrix,such as morphology,crystalline structure,element composition and chemical structure were characterized by scanning electron microscopy,grazing incidence x-ray diffraction and x-ray photoelectron spectroscopy.The experimental results revealed that the removal of C–N film with a thickness of tens of microns can be realized through APPJ cleaning regardless of the morphology of the substrates.Similar removal rates of 16.82 and 13.78μm min^(-1)were obtained for C–N films deposited on a smooth pristine W surface and rough fuzz-covered W surface,respectively.This is a remarkable improvement in comparison to the traditional cleaning method.However,slight surface oxidation was found after APPJ cleaning,but the degree of oxidation was acceptable with an oxidation depth increase of only 3.15 nm.Optical emission spectroscopy analysis and mass spectrometry analysis showed that C–N contamination was mainly removed through chemical reaction with reactive oxygen species during APPJ treatment using air as the working gas.These results make APPJ cleaning a potentially effective method for the rapid removal of C–N films from the wall surfaces of fusion devices.

Arc Discharge Device Working at Atmospheric Pressure

Arc in vacuum is one of the important methods used to prepare carbon materials. However, the use of vacuum increases the cost of the arc method. This paper introduces an arc discharge device working at atmospheric pressure. The current-limiting resistor, capacitor and inductor make the discharge gentle. The electrode temperature can be adjusted from 2040 K to 3673 K. Carbon nanofibres were prepared at the electrode temperature of 3645 K by using this device.

重掺硅片表面APCVD法生长SiO_(2)薄膜的致密性

在硅片加工过程中,金属杂质的存在会增大pn结器件的漏电流,甚至直接导致pn结禁带宽度变窄,为防止出现硅外延过程中造成的自掺杂现象,通常在硅片表面生长一层高致密性的SiO_(2)薄膜。基于常压化学气相沉积(APCVD)法在6英寸(1英寸≈2.54 cm)n型硅片表面生长SiO_(2)薄膜,首先研究不同沉积温度、SiH_(4)和O_(2)的体积流量比对沉积速率和SiO_(2)薄膜致密性的影响,进一步探究了不同退火温度对SiO_(2)薄膜致密性的影响,以期获得致密性较高的SiO_(2)薄膜。采用HF腐蚀速率法表征其致密性,采用扫描电子显微镜(SEM)观察SiO_(2)薄膜的表面形貌,采用F50膜厚测试仪测试SiO_(2)薄膜的厚度。结果表明,沉积温度为400℃,SiH_(4)和O_(2)的体积流量比为1∶10,退火温度为1100℃时,制备的SiO_(2)薄膜的致密性为0.096 nm/s(采用体积分数为1%的HF腐蚀)。

Growth of large-area atomically thin MoS2 film via ambient pressure chemical vapor deposition

Atomically thin MoS2 films have attracted significant attention due to excellent electrical and optical properties.The development of device applications demands the production of large-area thin film which is still an obstacle.In this work we developed a facile method to directly grow large-area MoS2 thin film on Si O2 substrate via ambient pressure chemical vapor deposition method. The characterizations by spectroscopy and electron microscopy reveal that the as-grown MoS2 film is mainly bilayer and trilayer with high quality. Back-gate field-effect transistor based on such MoS2 thin film shows carrier mobility up to 3.4 cm2V-1s-1 and on/off ratio of 105. The large-area atomically thin MoS2 prepared in this work has the potential for wide optoelectronic and photonic device applications.

Characterization of the heteroepitaxial growth of 3C-SiC on Si during low pressure chemical vapor deposition

3C-SiC heteroepitaxial layers were grown on Si substrates using a horizontal,hot-wall low pressure chemical vapor deposition system.The crystal quality,surface morphology and thickness uniformity of the layers were characterized by X-ray diffraction,atomic force microcopy and Fourier transform infrared spectroscopy,respectively.Growth of the epitaxial layer was determined to follow a three-dimensional island mode initially and then switch to a step-flow mode as the growth time increases.

Effect of pressure on the semipolar GaN(10-11) growth mode on patterned Si substrates

In this paper, we investigate the effect of pressure on the growth mode of high quality （10-11） GaN using an epi- taxial lateral over growth （ELO） technique by metal organic chemical vapor deposition （MOCVD）. Two pressure growth conditions, high pressure （HP） 1013 mbar and low pressure growth （LP） 500 mbar, are employed during growth. In the high pressure growth conditions, the crystal quality is improved by decreasing the dislocation and stack fault density in the strip connection locations. The room temperature photoluminescence measurement also shows that the light emission intensity increases three times using the HP growth condition compared with that using the LP growth conditions. In the low temperature （77 K） photoluminescence, the defects-related peaks are very obvious in the low pressure growth samples. This result also indicates that the crystal quality is improved using the high pressure growth conditions.

Preparation of rutile TiO_(2) thin films by laser chemical vapor deposition method

TiO_(2) thin films were prepared on Pt/Ti/SiO_(2)/Si substrate by laser chemical vapor deposition(LCVD)method.The effects of laser power(P_(L))and total pressure(p_(tot))on the microstructure of TiO_(2) thin films were investigated.The deposition temperature(T_(dep))was mainly affected by P_(L),increasing with P_(L) increasing.The single-phase rutile TiO_(2) thin films with different morphologies were obtained.The morphologies of TiO_(2) thin films were classified into three typical types,including the powdery,Wulff-shaped and granular microstructures.p_(tot) and T_(dep) were the two critical factors that could be effectively used for controlling the morphology of the films.

APCVD法SiH_4-NH_3-CO_2系统制备氧氮玻璃薄膜的研究

在６６０℃下以ＳｉＨ４－ＮＨ３－ＣＯ２作为反应气体利用常压ＣＶＤ（ＡＰＣＶＤ）设备沉积得到了氧氮玻璃薄膜．此温度比文献报道的ＡＰＣＶＤ法低２００℃以上，有效地降低了沉积温度．实验发现ＮＨ３中水汽对沉积反应的显著影响．初步研究表明：运用ＡＰＣＶＤ法将这种薄膜应用于普通钠钙硅玻璃的表面改性。

基于大厚度六方氮化硼中子探测器的制备

六方氮化硼是一种中子敏感材料。介绍了使用低压气相化学沉积在1673K下以大约20μm/h的生长速率制备了高质量203μm厚的六方氮化硼。在氮化硼的两侧沉积厚度为100nm的金电极,制备了垂直结构的六方氮化硼中子探测器。该器件的电学性质表明制备的六方氮化硼材料的迁移率寿命的乘积(μτ)为2.8×10^(-6)cm^(2)/V,电阻率为1.5×10^(14)Ω·cm。在850V电压下,该探测器对热中子的探测效率为34.5%,电荷收集效率为60%。

铝基APCVD沉积SiO_x膜层的光学性能研究

采用低温常压化学气相沉积(APCVD)的方法在铝基底上制备硅氧化物陶瓷膜层.采用XPS、XRD、HRTEM、UV-VAS和NIRS等技术分析膜层的成分、结构组织和形貌特征,并测试了膜层的光学吸收性能.研究结果表明,SiOx中的硅氧原子比为1∶1.60～1∶1.75,硅氧化物陶瓷膜层大部分为非晶态组织,包含少量局部有序区域.SiOx陶瓷膜层沉积在铝基上后具有很高的紫外-可见光吸收率和较高的近红外光吸收率,产生机制是硅氧化物陶瓷膜层中氧空位存在局域电子态,电子吸收能量产生能级跃迁.

喷涂距离对APCVD制备的TiN薄膜性能的影响(英文)

以TiCl4和NH3为原料,用常压化学气相沉积法在玻璃基板表面沉积得到了TiN薄膜。采用X射线衍射、场发射扫描电子显微镜、电阻仪、紫外-可见光谱仪等研究了喷涂距离(输入TiCl4管道末端到基板之间的距离)对沉积的TiN薄膜的结晶性能和表面形貌,以及薄膜的电学性能和光学性能的影响。结果表明:当喷涂距离为5cm和10cm时,玻璃基板表面形成电阻较高、反射率较低的较疏松薄膜。当喷涂距离增加到13cm和15cm时,可以得到结晶良好、低电阻、高反射、致密的TiN薄膜。当喷涂距离进一步增加到20cm以上,得到的薄膜的电阻率随之升高而反射率下降。对喷涂距离对薄膜性能的影响机理进行了分析,认为喷涂距离的变化会影响扩散到达并吸附在基板表面的反应物分子数量比例,进而影响沉积薄膜的性能。

TOPCon太阳电池单面沉积Poly-Si的工艺研究

目前隧穿氧化层钝化接触(TOPCon)电池制造技术越来越成熟,所耗成本不断降低。行业内普遍采用低压化学气相沉积(LPCVD)方式进行双面沉积或单面沉积。单面沉积存在Poly-Si绕镀问题,严重影响电池片转化效率和外观质量,同时正面绕镀层去除难度较大,在用碱溶液去除绕镀层的同时,存在绕镀层去除不彻底或者非绕镀区域P^(+)层被腐蚀的风险,导致P^(+)发射极受损,严重影响电池片外观质量与性能。双面沉积可避免上述问题,但产能减少一半,制造成本增加。本文对单面沉积Poly-Si工艺及绕镀层去除工艺进行研究,在TOPCon电池正面及背面制作了一层合适厚度的氧化层掩膜,搭配合适的清洗工艺、去绕镀清洗工艺,既可有效地去除P^(+)层绕镀的Poly-Si,也可很好地保护正面P^(+)层及背面掺杂Poly-Si层不受破坏,同时可大幅提升产能。

培育大单晶金刚石的现状与未来

金刚石以其卓越的硬度和广泛的应用领域而闻名。由于天然金刚石的供应不足和高昂的价格,人工培育的大单晶金刚石成为了一种备受关注的替代品。文章首先阐述了金刚石的独特性质及其在科技领域的重要作用,解析了天然金刚石的稀缺性问题。然后详述了培育大单晶金刚石的发展历程,介绍了高温高压法和化学气相沉积法两种主要的合成方法及当前面临的技术难题。文章预测了培育大单晶金刚石的未来发展前景,分析了其在珠宝首饰、半导体、量子技术等领域的广阔应用空间及实现这些应用的技术挑战。最后,给出了加快培育大单晶金刚石技术成熟和产业化进程的几点建议。文章旨在全面系统地综述培育大单晶金刚石研究的现状与发展趋势,为该领域的科研工作者和产业界提供参考。

低压化学气相沉积氮化硅薄膜工艺研究

低压化学气相沉积法(Low-Pressure Chemical Vapor Deposition,LPCVD)沉积的氮化硅薄膜(LPSi_(3)N_(4))具有质量高、副产物少、厚度均匀性好等特性,常应用于局部氧化的掩蔽膜、电容的介质膜、层间绝缘膜等工艺制程。介绍低压化学气相沉积氮化硅薄膜(LPSi_(3)N_(4))的制备工艺,以及不同工艺参数的调试对氮化硅薄膜均匀性和沉积速率的影响。

APCVD法制备Nb∶TiO_2薄膜及其光电性能

透明导电氧化物（TCO）薄膜要求低电阻率和可见光区高透过率.目前最常用的是ITO薄膜存在着有毒、In成本高等难以克服的缺点.NTO薄膜是近年来新发现的一种具备广阔前景的TCO薄膜,但对它的认识还不充分.本文采用APCVD法在玻璃基板上成功制备出了颗粒均匀细小致密的NTO薄膜,探索出最佳反应温度为500℃～550℃,通过高真空退火的方式改善了薄膜晶体质量,光学透过率获得大幅提升,与经过掺杂但未经过H2退火的Nb∶TiO2薄膜和经过H2退火但未掺杂的TiO2薄膜相比较,经过掺杂和H2退火的Nb∶ TiO2薄膜其电学性能得到明显改善.

工作气体对APCVD石墨烯薄膜生长和性能的影响

以铜箔为基底,采用常压化学气相沉积(APCVD)方法制备石墨烯,控制总气体流量不变,改变甲烷流量(甲烷流量与总气体流量之比),利用RAMAN、SEM、分光光度计、四探针电阻率测试仪等对样品的形貌、结构、透光率及导电性能进行表征,讨论甲烷流量比改变对石墨烯生长过程和性能的影响。结果表明:甲烷流量比越大,甲烷分解出的碳原子越多,铜箔表面覆盖石墨烯越完整。当甲烷流量比增加到一定程度时,会得到过量的碳原子形成碳原子团聚集在铜箔表面。甲烷流量比越大,所制备的石墨烯I_D/I_G比值越大,缺陷越多,导电性降低。石墨烯的透光性受到层数和缺陷的制约,当甲烷流量比为20%时,透光率最高,波长550 nm处透光率达到86%。