Steel-mushy Al-20Sn alloy bonding was studied for the first time. The relationship model about preheat temperature of steel plate, solid fraction of Al-20Sn alloy mushy, rolling speed and interfacial shear strength of...Steel-mushy Al-20Sn alloy bonding was studied for the first time. The relationship model about preheat temperature of steel plate, solid fraction of Al-20Sn alloy mushy, rolling speed and interfacial shear strength of bonding plate could be established by artificial neural networks perfectly. This model could be optimized with a genetic algorithm. The optimum bonding parameters were: 505 degreesC for preheat temperature of steel plate, 34.3% for solid fraction of Al-20Sn alloy mushy and 10 mm/s for rolling speed, and the largest interfacial shear strength of bonding plate was 71.2 MPa.展开更多
To address the problem of floating and aggregation of Ag-GNSs in the molten pool during the traditional reflow soldering process,Cu/SAC/Ag-GNSs/Cu sandwich joints were prepared under an applied current density(1.0...To address the problem of floating and aggregation of Ag-GNSs in the molten pool during the traditional reflow soldering process,Cu/SAC/Ag-GNSs/Cu sandwich joints were prepared under an applied current density(1.0×10^(4) A/cm^(2))for a few hundred milliseconds to produce Ag-coated graphene-reinforced Sn-Ag-Cu(SAC/AgGNSs)solder joints.The experimental results showed that Ag-GNSs were homogenously dispersed in the solder joints,providing more Cu6 Sn5 grain nucleation sites,which refined these grains and reduced the thickness difference at the anode and cathode.In addition,the Cu6 Sn5 morphology changed from rod-like to plate-shaped because of the uniform distribution of Ag-GNSs and constitutional supercooling.The significantly increased shear strength of the transient current bonding and the change in the fracture mechanism were due to the uniformly distributed Ag-GNSs and the microstructural changes.展开更多
文摘Steel-mushy Al-20Sn alloy bonding was studied for the first time. The relationship model about preheat temperature of steel plate, solid fraction of Al-20Sn alloy mushy, rolling speed and interfacial shear strength of bonding plate could be established by artificial neural networks perfectly. This model could be optimized with a genetic algorithm. The optimum bonding parameters were: 505 degreesC for preheat temperature of steel plate, 34.3% for solid fraction of Al-20Sn alloy mushy and 10 mm/s for rolling speed, and the largest interfacial shear strength of bonding plate was 71.2 MPa.
基金financial support from the National Natural Science Foundation of China(No.51974198)。
文摘To address the problem of floating and aggregation of Ag-GNSs in the molten pool during the traditional reflow soldering process,Cu/SAC/Ag-GNSs/Cu sandwich joints were prepared under an applied current density(1.0×10^(4) A/cm^(2))for a few hundred milliseconds to produce Ag-coated graphene-reinforced Sn-Ag-Cu(SAC/AgGNSs)solder joints.The experimental results showed that Ag-GNSs were homogenously dispersed in the solder joints,providing more Cu6 Sn5 grain nucleation sites,which refined these grains and reduced the thickness difference at the anode and cathode.In addition,the Cu6 Sn5 morphology changed from rod-like to plate-shaped because of the uniform distribution of Ag-GNSs and constitutional supercooling.The significantly increased shear strength of the transient current bonding and the change in the fracture mechanism were due to the uniformly distributed Ag-GNSs and the microstructural changes.
