基于p型衬底的DG SOI MOSFET器件,分析了PSP-SOI,BSIM-IMG和HiSIM-SOTB模型器件建模的可适用性。对3种模型的物理机理和数学方程进行研究,提取器件的直流特性及参数值。实验数据对比结果表明:相比PSP-SOI和HiSIM-SOTB,BSIM-IMG的仿真精...基于p型衬底的DG SOI MOSFET器件,分析了PSP-SOI,BSIM-IMG和HiSIM-SOTB模型器件建模的可适用性。对3种模型的物理机理和数学方程进行研究,提取器件的直流特性及参数值。实验数据对比结果表明:相比PSP-SOI和HiSIM-SOTB,BSIM-IMG的仿真精度分别提高了2.08%和7.10%。所以,BSIM-IMG更适用于DG SOI MOSFET器件直流特性建模。展开更多
BSIM （Berkeley Short-Channel IGFET） became the first international industry standard model for simulation of MOS integrated circuits in 1997. The cumulative sales of ICs that have been designed with the aid of BSIM ...BSIM （Berkeley Short-Channel IGFET） became the first international industry standard model for simulation of MOS integrated circuits in 1997. The cumulative sales of ICs that have been designed with the aid of BSIM and produced for computing, communication, consumer, and industrial applications is estimated to be around 400 billion US dollars. From 0.35μm CMOS to multi-gate FinFET, BSIM serves a wide range of technologies. Many China educated researchers have contributed to its success.展开更多
文摘基于p型衬底的DG SOI MOSFET器件,分析了PSP-SOI,BSIM-IMG和HiSIM-SOTB模型器件建模的可适用性。对3种模型的物理机理和数学方程进行研究,提取器件的直流特性及参数值。实验数据对比结果表明:相比PSP-SOI和HiSIM-SOTB,BSIM-IMG的仿真精度分别提高了2.08%和7.10%。所以,BSIM-IMG更适用于DG SOI MOSFET器件直流特性建模。
基金Sponsored by SRC and MICROData in Figure 4 are supplied by TI and TSMC
文摘BSIM （Berkeley Short-Channel IGFET） became the first international industry standard model for simulation of MOS integrated circuits in 1997. The cumulative sales of ICs that have been designed with the aid of BSIM and produced for computing, communication, consumer, and industrial applications is estimated to be around 400 billion US dollars. From 0.35μm CMOS to multi-gate FinFET, BSIM serves a wide range of technologies. Many China educated researchers have contributed to its success.
