With the development of 3D integration technology, microsystems with vertical interconnects are attracting attention from researchers and industry applications. Basic elements of integrated passive devices （IPDs）, i...With the development of 3D integration technology, microsystems with vertical interconnects are attracting attention from researchers and industry applications. Basic elements of integrated passive devices （IPDs）, including inductors, capacitors, and resistors, could dramatically save the tbotprint of the system, optimize the form factor, and improve the performance of radio frequency （RF） systems. In this paper, IPDs using thin film built-up technology are introduced, and the design and characterization of coplanar waveguides （CPWs）, inductors, and capacitors are presented.展开更多
基金Project (No. 2009ZX02038) supported by the National Science and Technology Major Project of China
文摘With the development of 3D integration technology, microsystems with vertical interconnects are attracting attention from researchers and industry applications. Basic elements of integrated passive devices （IPDs）, including inductors, capacitors, and resistors, could dramatically save the tbotprint of the system, optimize the form factor, and improve the performance of radio frequency （RF） systems. In this paper, IPDs using thin film built-up technology are introduced, and the design and characterization of coplanar waveguides （CPWs）, inductors, and capacitors are presented.
