The basic force and bonding energy in wafer bonding have been revealed in this study. The basic cause for bonding contributes to the interatomic attractive forces between surfaces or the reduction of surface energies....The basic force and bonding energy in wafer bonding have been revealed in this study. The basic cause for bonding contributes to the interatomic attractive forces between surfaces or the reduction of surface energies. The amplitude of roughness component can not exceed the criterion if wafer pair is bondable. The bonding behavior and challenge during annealing have been investigated.展开更多
文摘The basic force and bonding energy in wafer bonding have been revealed in this study. The basic cause for bonding contributes to the interatomic attractive forces between surfaces or the reduction of surface energies. The amplitude of roughness component can not exceed the criterion if wafer pair is bondable. The bonding behavior and challenge during annealing have been investigated.
