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An Easy Way to Quantify the Adhesion Energy of Nanostructured Cu/X(X=Cr,Ta,Mo,Nb,Zr) Multilayer Films Adherent to Polyimide Substrates 被引量:3
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作者 Kai Wu Jin-Yu Zhang +3 位作者 Gang Liu Jiao Li Guo-Jun Zhang Jun Sun 《Acta Metallurgica Sinica(English Letters)》 SCIE EI CAS CSCD 2016年第2期181-187,共7页
An approach based on film buckling under simple uniaxial tensile testing was utilized in this paper to quan- titatively estimate the interfacial energy of the nanostructured multilayer films (NMFs) adherent to flexi... An approach based on film buckling under simple uniaxial tensile testing was utilized in this paper to quan- titatively estimate the interfacial energy of the nanostructured multilayer films (NMFs) adherent to flexible substrates. The interfacial energies of polyimide-supported NMFs are determined to be ~ 5.0 J/m2 for Cu/Cr, ~4.1 J/m2 for Cu/Ta, ~ 2.8 J/m2 for Cu/Mo, ~ 1.1 J/m2 for Cu/Nb, and ~ 1.2 J/m2 for Cu/Zr NMFs. Furthermore, a linear relationship between the adhesion energy and the interfacial shear strength is clearly demonstrated for the Cu-based NMFs, which is highly indicative of the applicability and reliability of the modified models. 展开更多
关键词 Uniaxial tensile testing Nanostructured multilayer films Flexible substrates bucklingbehaviors Adhesion energy
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