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Complex microstructure fabrication by integrating silicon anisotropic etching and UV-LIGA technology
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作者 靖向萌 Chen Di Huang Chuang Chen Xiang Liu Jingquan Zhu Jun 《High Technology Letters》 EI CAS 2007年第4期369-372,共4页
A fabrication method which integrates silicon anisotropic etching micromachining with UV-LIGA technology to make complex microstmetures is presented. This proposed combined process enables the fabrication of high-aspe... A fabrication method which integrates silicon anisotropic etching micromachining with UV-LIGA technology to make complex microstmetures is presented. This proposed combined process enables the fabrication of high-aspect-ratio and three-dimensional (3D) microstructures, which cannot be fabricated by silicon bulk mieromachining or UV-LIGA alone. To demonstrate this combined method, the 100μm thick SU-8 micro gears were fabricated on the silicon convex square structure, which is 100μm × 100μm× 80μm in dimension. In the subsequent micro hot embossing process, a novel type of plastics polyethylene terephtalate glycol (PETG) was tried for use. Through optimizing process parameters, PETG shows the potential of being used as plastic replica in micro-electro-mechanical system (MEMS). This fabrication technology provides a new option for the increasing need of functionality, quality and economy of MEMS. 展开更多
关键词 UV-LIGA bulk silicon micro machining 3D microfabrication polyethylene terephtalate glycol (PETG)
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