Effect of C：F deposition on SiCOH etching in a CHF3 dual-frequency capacitively couple plasma, driven by a high-frequency source of 60 MHz （HF） and a low-frequency source of 2 MHz （LF） simultaneously, is investig...Effect of C：F deposition on SiCOH etching in a CHF3 dual-frequency capacitively couple plasma, driven by a high-frequency source of 60 MHz （HF） and a low-frequency source of 2 MHz （LF） simultaneously, is investigated. With the increase in LF power, the change of C：F layer from dense C：F layer to porous C：F layer and further to C：F filling gaps was observed, which led to the transition from films deposition to films etching. The change of C：F layer is related to the bombardment by energetic ions and CF2 concentration in the plasma. As the LF power increased to 35 - 40 W, the energetic ions and the low CF2 concentration led to a suppression of C：F deposition. Therefore, the SiCOH films can be etched at higher LF power.展开更多
Fluorinated amorphous carbon （a-C：F） films were deposited at room temperature using C4Fs and CH4 as precursor gases by electron cyclotron resonance chemical vapour deposition （ECR-CVD）. Chemical structures were a...Fluorinated amorphous carbon （a-C：F） films were deposited at room temperature using C4Fs and CH4 as precursor gases by electron cyclotron resonance chemical vapour deposition （ECR-CVD）. Chemical structures were analysed using X-ray photoelectron spectroscopy （XPS）. The current conduction shows ohmic behaviour and the leakage current increases with the content of C sp2 in the deposited a-C：F films at a low electric field. The behaviour of the leakage current is well e^plained by the Poole-Frankel mechanism at a high electric field. The interface traps, rather than chemical structures, of a-C：F films determine the PF emission current.展开更多
基金supported by National Natural Science Foundation of China (Nos.10575074, 10635010)
文摘Effect of C：F deposition on SiCOH etching in a CHF3 dual-frequency capacitively couple plasma, driven by a high-frequency source of 60 MHz （HF） and a low-frequency source of 2 MHz （LF） simultaneously, is investigated. With the increase in LF power, the change of C：F layer from dense C：F layer to porous C：F layer and further to C：F filling gaps was observed, which led to the transition from films deposition to films etching. The change of C：F layer is related to the bombardment by energetic ions and CF2 concentration in the plasma. As the LF power increased to 35 - 40 W, the energetic ions and the low CF2 concentration led to a suppression of C：F deposition. Therefore, the SiCOH films can be etched at higher LF power.
基金supported by the Key Laboratory Foundation of Electron Devices Reliability Physics and Applications(No.51433020205DZ01)the Xi'an Applied Materials Innovation Fund(No.XA-AM-200501)
文摘Fluorinated amorphous carbon （a-C：F） films were deposited at room temperature using C4Fs and CH4 as precursor gases by electron cyclotron resonance chemical vapour deposition （ECR-CVD）. Chemical structures were analysed using X-ray photoelectron spectroscopy （XPS）. The current conduction shows ohmic behaviour and the leakage current increases with the content of C sp2 in the deposited a-C：F films at a low electric field. The behaviour of the leakage current is well e^plained by the Poole-Frankel mechanism at a high electric field. The interface traps, rather than chemical structures, of a-C：F films determine the PF emission current.
