To investigate the reliability of electrode materials for chalcogenide random access memory （C-RAM） applications, the geometry and time evolution of the worm-like delamination patterns on a tungsten/Sb2Te3 bilayer s...To investigate the reliability of electrode materials for chalcogenide random access memory （C-RAM） applications, the geometry and time evolution of the worm-like delamination patterns on a tungsten/Sb2Te3 bilayer system surface are observed by field emission scanning electronic microscope （FESEM） and optical microscopy. The tungsten film stress and interface toughness are estimated using a straight-side model. After confirming the instability of this system being due to large compressive stress stored in the tungsten film and relative poor interface adhesion, a preliminary solution as the inset of a TiN adhesion layer is presented to improve the system performances.展开更多
Differences in wear rate, morphology of the worn surface and debris, and the microstructure in subsurface of the Ti 6Al 4V alloy after wear in air and vacuum were compared. The wear rate of Ti 6Al 4V alloy in air is h...Differences in wear rate, morphology of the worn surface and debris, and the microstructure in subsurface of the Ti 6Al 4V alloy after wear in air and vacuum were compared. The wear rate of Ti 6Al 4V alloy in air is higher than that in vacuum in all the ranges of sliding velocities and applied loads. The wear of Ti 6Al 4V alloy in air is controlled by a combination of abrasion, oxidation and delamination with micro cracks remaining in subsurface. Under the vacuum condition, the surface layer of Ti 6Al 4V alloy experiences a severe plastic deformation on a great scale, which results in an ultra fine microstructure.展开更多
文摘To investigate the reliability of electrode materials for chalcogenide random access memory （C-RAM） applications, the geometry and time evolution of the worm-like delamination patterns on a tungsten/Sb2Te3 bilayer system surface are observed by field emission scanning electronic microscope （FESEM） and optical microscopy. The tungsten film stress and interface toughness are estimated using a straight-side model. After confirming the instability of this system being due to large compressive stress stored in the tungsten film and relative poor interface adhesion, a preliminary solution as the inset of a TiN adhesion layer is presented to improve the system performances.
文摘Differences in wear rate, morphology of the worn surface and debris, and the microstructure in subsurface of the Ti 6Al 4V alloy after wear in air and vacuum were compared. The wear rate of Ti 6Al 4V alloy in air is higher than that in vacuum in all the ranges of sliding velocities and applied loads. The wear of Ti 6Al 4V alloy in air is controlled by a combination of abrasion, oxidation and delamination with micro cracks remaining in subsurface. Under the vacuum condition, the surface layer of Ti 6Al 4V alloy experiences a severe plastic deformation on a great scale, which results in an ultra fine microstructure.
