Incomplete charge transfer in CMOS image sensor caused by Si/SiO_(2)interface states in the TG channel

CMOS image sensors produced by the existing CMOS manufacturing process usually have difficulty achieving complete charge transfer owing to the introduction of potential barriers or Si/SiO_(2)interface state traps in the charge transfer path,which reduces the charge transfer efficiency and image quality.Until now,scholars have only considered mechanisms that limit charge transfer from the perspectives of potential barriers and spill back effect under high illumination condition.However,the existing models have thus far ignored the charge transfer limitation due to Si/SiO_(2)interface state traps in the transfer gate channel,particularly under low illumination.Therefore,this paper proposes,for the first time,an analytical model for quantifying the incomplete charge transfer caused by Si/SiO_(2)interface state traps in the transfer gate channel under low illumination.This model can predict the variation rules of the number of untransferred charges and charge transfer efficiency when the trap energy level follows Gaussian distribution,exponential distribution and measured distribution.The model was verified with technology computer-aided design simulations,and the results showed that the simulation results exhibit the consistency with the proposed model.

Dark output characteristic of γ-ray irradiated CMOS digital image sensors

The quality of dark output images from the CMOS (complementarymetal oxide semiconductor) black and white (B & W) digital imagesensors captured before and after γ-ray irradiation was studied. Thecharacteristic parameters of the dark output images captured atdifferent radiation dose, e.g. average brightness and itsnon-uniformity of dark out- put images, were analyzed by our testsoftware. The primary explanation for the change of the parameterswith the radi- ation dose was given.

A nano-metallic-particles-based CMOS image sensor for DNA detection

In this paper we report on a study of the CMOS image sensor detection of DNA based on self-assembled nano- metallic particles, which are selectively deposited on the surface of the passive image sensor. The nano-metallic particles effectively block the optical radiation in the visible spectrum of ordinary light source. When such a technical method is applied to DNA detection, the requirement for a special UV light source in the most popular fluorescence is eliminated. The DNA detection methodology is tested on a CMOS sensor chip fabricated using a standard 0.5 gm CMOS process. It is demonstrated that the approach is highly selective to detecting even a signal-base mismatched DNA target with an extremely-low-concentration DNA sample down to 10 pM under an ordinary light source.

Modeling random telegraph signal noise in CMOS image sensor under low light based on binomial distribution

The random telegraph signal noise in the pixel source follower MOSFET is the principle component of the noise in the CMOS image sensor under low light. In this paper, the physical and statistical model of the random telegraph signal noise in the pixel source follower based on the binomial distribution is set up. The number of electrons captured or released by the oxide traps in the unit time is described as the random variables which obey the binomial distribution. As a result,the output states and the corresponding probabilities of the first and the second samples of the correlated double sampling circuit are acquired. The standard deviation of the output states after the correlated double sampling circuit can be obtained accordingly. In the simulation section, one hundred thousand samples of the source follower MOSFET have been simulated,and the simulation results show that the proposed model has the similar statistical characteristics with the existing models under the effect of the channel length and the density of the oxide trap. Moreover, the noise histogram of the proposed model has been evaluated at different environmental temperatures.

Difference in electron-and gamma-irradiation effects on output characteristic of color CMOS digital image sensors

Changes of the average brightness and non-uniformity of dark output images,and quality of pictures captured under natural lighting for the color CMOS digital image sensorsirradiated at different electron doses have been studied in comparison to those from theγ-irradiated sensors. For the electron-irradiated sensors, the non-uniformity increases obviouslyand a small bright region on the dark image appears at the dose of 0.4 kGy. The average brightnessincreases at 0.4 kGy, increases sharply at 0.5 kGy. The picture is very blurry only at 0.6 kGy,showing the sensor undergoes severe performance degradation. Electron radiation damage is much moresevere than γ radiation damage for the CMOS image sensors. A possible explanation is presented inthis paper.

Column readout circuit with improved offset mismatch and charge sharing for CMOS image sensor

High linearity and low noise column readout chain are two key factors in CMOS image sensor.However,offset mismatch and charge sharing always exist in the conventional column wise readout implementation,even adopting the technology of correlated double sample.A simple column readout circuit with improved offset mismatch and charge sharing for CMOS image sensor is proposed in this paper.Based on the bottom plate sampling and fixed common level method,this novel design can avoid the offset nonuniformity between the two buffers.Also,the single buffer and switched capacitor technique can effectively suppress the charge sharing caused by the varied operating point.The proposed approach is experimentally verified in a 1024×1024 prototype chip designed and fabricated in 55 nm low power CMOS process.The measurement results show that the linear range is extended by 20%,the readout noise of bright and dark fields is reduced by 40%and 30%respectively,and the improved photo response nonuniformity is up to 1.16%.Finally,a raw sample image taken by the prototype sensor shows the excellent practical performance.

A low-power high-quality CMOS image sensor using 1.5 V 4T pinned photodiode and dual-CDS column-parallel single-slope ADC

This paper presents a low-power high-quality CMOS image sensor(CIS)using 1.5 V 4T pinned photodiode(4T-PPD)and dual correlated double sampling(dual-CDS)column-parallel single-slope ADC.A five-finger shaped pixel layer is proposed to solve image lag caused by low-voltage 4T-PPD.Dual-CDS is used to reduce random noise and the nonuniformity between columns.Dual-mode counting method is proposed to improve circuit robustness.A prototype sensor was fabricated using a 0.11μm CMOS process.Measurement results show that the lag of the five-finger shaped pixel is reduced by 80%compared with the conventional rectangular pixel,the chip power consumption is only 36 mW,the dynamic range is 67.3 dB,the random noise is only 1.55 e^(-)_(rms),and the figure-of-merit is only 1.98 e^(-)·nJ,thus realizing low-power and high-quality imaging.

Novel CMOS image sensor pixel to improve charge transfer speed and efficiency by overlapping gate and temporary storage diffusing node

A novel CMOS image sensor(CIS) pinned photodiode(PPD) pixel, named as O-T pixel, is proposed and investigated by TCAD simulations. Compared with the conventional PPD pixel, the proposed pixel features the overlapping gate(OG)and the temporary storage diffusing(TSD) region, based on which the several-nanosecond-level charge transfer could be achieved and the complete charge transfer from the PPD to the floating node(FD) could be realized. And systematic analyses of the influence of the doping conditions of the proposed processes, the OG length, and the photodiode length on the transfer performances of the proposed pixel are conducted. Optimized simulation results show that the total charge transfer time could reach about 5.862 ns from the photodiode to the sensed node and the corresponding charge transfer efficiency could reach as high as 99.995% in the proposed pixel with 10 μm long photodiode and 2.22 μm long OG. These results demonstrate a great potential of the proposed pixel in high-speed applications.

Modeling the photon counting and photoelectron counting characteristics of quanta image sensors

A signal chain model of single-bit and multi-bit quanta image sensors(QISs)is established.Based on the proposed model,the photoresponse characteristics and signal error rates of QISs are investigated,and the effects of bit depth,quantum efficiency,dark current,and read noise on them are analyzed.When the signal error rates towards photons and photoelectrons counting are lower than 0.01,the high accuracy photon and photoelectron counting exposure ranges are determined.Furthermore,an optimization method of integration time to ensure that the QIS works in these high accuracy exposure ranges is presented.The trade-offs between pixel area,the mean value of incident photons,and integration time under different illuminance level are analyzed.For the 3-bit QIS with 0.16 e-/s dark current and 0.21 e-r.m.s.read noise,when the illuminance level and pixel area are 1 lux and 1.21μm^(2),or 10000 lux and 0.21μm^(2),the recommended integration time is 8.8 to 30 ms,or 10 to21.3μs,respectively.The proposed method can guide the design and operation of single-bit and multi-bit QISs.

Exploration of high-speed 3.0 THz imaging with a 65 nm CMOS process

This paper describes a promising route for the exploration and development of 3.0 THz sensing and imaging with FET-based power detectors in a standard 65 nm CMOS process.Based on the plasma-wave theory proposed by Dyakonov and Shur,we designed high-responsivity and low-noise multiple detectors for monitoring a pulse-mode 3.0 THz quantum cascade laser(QCL).Furthermore,we present a fully integrated high-speed 32×32-pixel 3.0 THz CMOS image sensor(CIS).The full CIS measures 2.81×5.39 mm^(2) and achieves a 423 V/W responsivity(Rv)and a 5.3 nW integral noise equivalent power(NEP)at room temperature.In experiments,we demonstrate a testing speed reaching 319 fps under continuous-wave(CW)illumina-tion of a 3.0 THz QCL.The results indicate that our terahertz CIS has excellent potential in cost-effective and commercial THz imaging and material detection.

A quantum efficiency analytical model for complementary metal–oxide–semiconductor image pixels with a pinned photodiode structure

A quantum efficiency analytical model for complementary metal–oxide–semiconductor（CMOS） image pixels with a pinned photodiode structure is developed. The proposed model takes account of the non-uniform doping distribution in the N-type region due to the impurity compensation formed by the actual fabricating process. The characteristics of two boundary PN junctions located in the N-type region for the particular spectral response of a pinned photodiode, are quantitatively analyzed. By solving the minority carrier steady-state diffusion equations and the barrier region photocurrent density equations successively, the analytical relationship between the quantum efficiency and the corresponding parameters such as incident wavelength, N-type width, peak doping concentration, and impurity density gradient of the N-type region is established. The validity of the model is verified by the measurement results with a test chip of 160×160 pixels array,which provides the accurate process with a theoretical guidance for quantum efficiency design in pinned photodiode pixels.

Two-dimensional pixel image lag simulation and optimization in a 4-T CMOS image sensor

Pixel image lag in a 4-T CMOS image sensor is analyzed and simulated in a two-dimensional model.Strategies of reducing image lag are discussed from transfer gate channel threshold voltage doping adjustment,PPD N-type doping dose/implant tilt adjustment and transfer gate operation voltage adjustment for signal electron transfer.With the computer analysis tool ISE-TCAD,simulation results show that minimum image lag can be obtained at a pinned photodiode n-type doping dose of 7.0×10^12 cm^-2,an implant tilt of -2°,a transfer gate channel doping dose of 3.0×10^12 cm^-2 and an operation voltage of 3.4 V.The conclusions of this theoretical analysis can be a guideline for pixel design to improve the performance of 4-T CMOS image sensors.

A linear stepping PGA used in CMOS image sensors

A low power linear stepping digital programming gain amplifier （PGA） is designed for CMOS image sensors. The PGA consists of three stages with gain range from one to nine, The gain is divided into four regions and each range has 128 linear steps. Power consumption of the PGA is saved by good tradeoff between variation of amplifier feedback coefficient, pipeline stages and gain regions. With thermometer-binary mixed coding and linear pipeline gain stepping, the load capacitance keeps constant when the gain of one stage is changed. The PGA is designed in the SMIC 0.18 μm process. Simulation results show that the power consumption is 3.2 mW with 10 bit resolution and 10 MSPS sampling rate. The PGA has been embedded in a 0.3 megapixel CMOS image sensors and fabricated successfully.

Process techniques of charge transfer time reduction for high speed CMOS image sensors

This paper proposes pixel process techniques to reduce the charge transfer time in high speed CMOS image sensors. These techniques increase the lateral conductivity of the photo-generated carriers in a pinned photodiode （PPD） and the voltage difference between the PPD and the floating diffusion （FD） node by controlling and optimizing the N doping concentration in the PPD and the threshold voltage of the reset transistor, respectively. The techniques shorten the charge transfer time from the PPD diode to the FD node effectively. The proposed process techniques do not need extra masks and do not cause harm to the fill factor. A sub array of 32 x 64 pixels was designed and implemented in the 0.18 #m CIS process with five implantation conditions splitting the N region in the PPD. The simulation and measured results demonstrate that the charge transfer time can be decreased by using the proposed techniques. Comparing the charge transfer time of the pixel with the different implantation conditions of the N region, the charge transfer time of 0.32 μs is achieved and 31% of image lag was reduced by using the proposed process techniques.

Analysis of incomplete charge transfer effects in a CMOS image sensor

Abs A method to judge complete charger transfer is proposed for a four-transistor CMOS image sensor with a large pixel size. Based on the emission current theory, a qualitative photoresponse model is established to the preliminary prediction. Further analysis of noise for incomplete charge transfer predicts the noise variation. The test pixels were fabricated in a specialized 0.18 #m CMOS image sensor process and two different processes of buried N layer implantation are compared. The trend prediction corresponds with the test results, especially as it can distinguish an unobvious incomplete charge transfer. The method helps us judge whether the charge transfer time satisfies the requirements of the readout circuit for the given process especially for pixels of a large size.

Radiation effects on scientific CMOS image sensor

A systemic solution for radiation hardened design is presented. Besides, a series of experiments have been carried out on the samples, and then the photoelectric response characteristic and spectral characteristic before and after the experiments have been comprehensively analyzed. The performance of the CMOS image sensor with the radiation hardened design technique realized total-dose resilience up to 300 krad（Si） and resilience to singleevent latch up for LET up to110 Me V cm^2/mg.

Measurement of charge transfer potential barrier in pinned photodiode CMOS image sensors

The charge transfer potential barrier （CTPB） formed beneath the transfer gate causes a noticeable image lag issue in pinned photodiode （PPD） CMOS image sensors （CIS）, and is difficult to measure straightforwardly since it is embedded inside the device. From an understanding of the CTPB formation mechanism, we report on an alternative method to feasibly measure the CTPB height by performing a linear extrapolation coupled with a horizontal left-shift on the sensor photoresponse curve under the steady-state illumination. The theoretical study was pertbrmed in detail on the principle of the proposed method. Application of the measurements oil a prototype PPD-CIS chip with an array of 160 ×160 pixels is demonstrated. Such a method intends to shine new light oil the guidance for the lag-free and high-speed sensors optimization based on PPD devices.

A 10-bit column-parallel cyclic ADC for high-speed CMOS image sensors

This paper presents a high-speed column-parallel cyclic analog-to-digital converter（ADC） for a CMOS image sensor.A correlated double sampling（CDS） circuit is integrated in the ADC,which avoids a stand-alone CDS circuit block.An offset cancellation technique is also introduced,which reduces the column fixed-pattern noise（FPN） effectively.One single channel ADC with an area less than 0.02 mm^2 was implemented in a 0.13μm CMOS image sensor process.The resolution of the proposed ADC is 10-bit,and the conversion rate is 1.6 MS/s. The measured differential nonlinearity and integral nonlinearity are 0.89 LSB and 6.2 LSB together with CDS, respectively.The power consumption from 3.3 V supply is only 0.66 mW.An array of 48 10-bit column-parallel cyclic ADCs was integrated into an array of CMOS image sensor pixels.The measured results indicated that the ADC circuit is suitable for high-speed CMOS image sensors.

A 10-bit ratio-independent cyclic ADC with offset canceling for a CMOS image sensor

A 10-bit ratio-independent switch-capacitor（SC） cyclic analog-to-digital converter（ADC） with offset cancelingforaCMOSimagesensorispresented.TheproposedADCcompletesanN-bitconversionin1.5N clock cycles with one operational amplifier. Combining ratio-independent and polarity swapping techniques, the conversioncharacteristicoftheproposedcyclicADCisinherentlyinsensitivebothtocapacitorratioandtoamplifieroffset voltage. Therefore, the circuit can be realized in a small die area and it is suitable to serve as the column-parallel ADC in CMOS image sensors. A prototype ADC is fabricated in 0.18- m one-poly four-metal CMOS technology.The measured results indicate that the ADC has a signal-to-noise and distortion ratio（SNDR） of 53.6 dB and a DNL of C0：12/0：14 LSB at a conversion rate of 600 kS/s. The standard deviation of the offset variation of the ADC is reduced from 2.5 LSB to 0.5 LSB. Its power dissipation is 250 W with a 1.8 V supply, and its area is0.030.8 mm2.

A study of radiation effects of 9 and 12 MeV protons on Chinese CMOS image sensor degradation

The 9 and 12 MeV proton irradiations of the Chinese CMOS Image Sensor in the fluence range from 1× 10^9 to 4×10^10 cm^-2 and 1 × 10^9 to 2×10^12 cm^-2 have been carried out respectively. The color pictures and dark output images are captured, and the average brightness of dark output images is calculated. The anti-irradiation fluence thresholds for 9 and 12 MeV protons are about 4×10^l0 and 2×10^12 cm^-2, respectively. These can be explained by the change of the concentrations of irradiation-induced electron-hole pairs and vacancies in the various layers of CMOS image sensor calculated by the TRIM simulation program.