A low-power-consumption 9bit 10MS/s pipeline ADC,used in a CMOS image sensor,is proposed. In the design, the decrease of power consumption is achieved by applying low-power-consumption and large-output-swing amplifier...A low-power-consumption 9bit 10MS/s pipeline ADC,used in a CMOS image sensor,is proposed. In the design, the decrease of power consumption is achieved by applying low-power-consumption and large-output-swing amplifiers with gain boost structure, and biasing all the cells with the same voltage bias source, which requires careful layout design and large capacitors. In addition,capacitor array DAC is also applied to reduce power consumption,and low threshold voltage MOS transistors are used to achieve a large signal processing range. The ADC was implemented in a 0.18μm 4M-1 P CMOS process,and the experimental results indicate that it consumes only 7mW, which is much less than general pipeline ADCs. The ADC was used in a 300000 pixels CMOS image sensor.展开更多
The quality of dark output images from the CMOS (complementarymetal oxide semiconductor) black and white (B & W) digital imagesensors captured before and after γ-ray irradiation was studied. Thecharacteristic par...The quality of dark output images from the CMOS (complementarymetal oxide semiconductor) black and white (B & W) digital imagesensors captured before and after γ-ray irradiation was studied. Thecharacteristic parameters of the dark output images captured atdifferent radiation dose, e.g. average brightness and itsnon-uniformity of dark out- put images, were analyzed by our testsoftware. The primary explanation for the change of the parameterswith the radi- ation dose was given.展开更多
CMOS image sensors produced by the existing CMOS manufacturing process usually have difficulty achieving complete charge transfer owing to the introduction of potential barriers or Si/SiO_(2)interface state traps in t...CMOS image sensors produced by the existing CMOS manufacturing process usually have difficulty achieving complete charge transfer owing to the introduction of potential barriers or Si/SiO_(2)interface state traps in the charge transfer path,which reduces the charge transfer efficiency and image quality.Until now,scholars have only considered mechanisms that limit charge transfer from the perspectives of potential barriers and spill back effect under high illumination condition.However,the existing models have thus far ignored the charge transfer limitation due to Si/SiO_(2)interface state traps in the transfer gate channel,particularly under low illumination.Therefore,this paper proposes,for the first time,an analytical model for quantifying the incomplete charge transfer caused by Si/SiO_(2)interface state traps in the transfer gate channel under low illumination.This model can predict the variation rules of the number of untransferred charges and charge transfer efficiency when the trap energy level follows Gaussian distribution,exponential distribution and measured distribution.The model was verified with technology computer-aided design simulations,and the results showed that the simulation results exhibit the consistency with the proposed model.展开更多
Changes of the average brightness and non-uniformity of dark output images,and quality of pictures captured under natural lighting for the color CMOS digital image sensorsirradiated at different electron doses have be...Changes of the average brightness and non-uniformity of dark output images,and quality of pictures captured under natural lighting for the color CMOS digital image sensorsirradiated at different electron doses have been studied in comparison to those from theγ-irradiated sensors. For the electron-irradiated sensors, the non-uniformity increases obviouslyand a small bright region on the dark image appears at the dose of 0.4 kGy. The average brightnessincreases at 0.4 kGy, increases sharply at 0.5 kGy. The picture is very blurry only at 0.6 kGy,showing the sensor undergoes severe performance degradation. Electron radiation damage is much moresevere than γ radiation damage for the CMOS image sensors. A possible explanation is presented inthis paper.展开更多
An addition scheme applicable to time-delay integration (TDI) CMOS image sensor is proposed,which adds signals in the charge domain in the pixel array.A two-shared pixel structure adopting two-stage charge transfer is...An addition scheme applicable to time-delay integration (TDI) CMOS image sensor is proposed,which adds signals in the charge domain in the pixel array.A two-shared pixel structure adopting two-stage charge transfer is introduced,together with the rolling shutter with an undersampling readout timing.Compared with the conventional TDI addition methods,the proposed scheme can reduce the addition operations by half in the pixel array,which decreases the power consumption of addition circuits outside the pixel array.The timing arrangement and pixel structure are analyzed in detail.The simulation results show that the proposed pixel structure can achieve the charge addition with negligible nonlinearity,therefore the power consumption of the periphery addition circuits can be reduced by half theoretically.展开更多
A high speed column-parallel CDS/ADC circuit with nonlinearity compensation is proposed in this paper.The correlated double sampling (CDS) and analog-to-digital converter (ADC) functions are integrated in a threephase...A high speed column-parallel CDS/ADC circuit with nonlinearity compensation is proposed in this paper.The correlated double sampling (CDS) and analog-to-digital converter (ADC) functions are integrated in a threephase column-parallel circuit based on two floating gate inverters and switched-capacitor network.The conversion rate of traditional single-slope ADC is speeded up by dividing quantization to coarse step and fine step.A storage capacitor is used to store the result of coarse step and locate the section of ramp signal of fine step,which can reduce the clock step from 2 n to 2 (n/2+1).The floating gate inverters are implemented to reduce the power consumption.Its induced nonlinear offset is cancelled by introducing a compensation module to the input of inverter,which can equalize the coupling path in three phases of the proposed circuit.This circuit is designed and simulated for CMOS image sensor with 640×480 pixel array using Chartered 0.18μm process.Simulation results indicate that the resolution can reach 10-bit and the maximum frame rate can reach 200 frames/s with a main clock of 10MHz.The power consumption of this circuit is less than 36.5μW with a 3.3V power supply.The proposed CDS/ADC circuit is suitable for high resolution and high speed image sensors.展开更多
A new photodetector--bipolar junction photogate transistor is presented for CMOS image sensor and its analytical model is also established.With the technical parameter of the 0.6μm CMOS process,the bipolar junction p...A new photodetector--bipolar junction photogate transistor is presented for CMOS image sensor and its analytical model is also established.With the technical parameter of the 0.6μm CMOS process,the bipolar junction photogate transistor is analyzed and simulated.The simulated results illustrate that the bipolar junction photogate transistor has the similar characteristics of the traditional photogate transistor.The photocurrent density of the bipolar junction photogate transistor increases exponentially with the incidence light power due to introducing the injection p+n junction.Its characteristic of blue response is rather improved compared to the traditional photogate transistor that benefits to increase the color photograph made up of the red,the green,and the blue.展开更多
A single CMOS image sensor based on a 0.35μm process along with its design and implementation is introduced. The architecture of an active pixel sensor is used in the chip. The fill factor of a pixel cell can reach 4...A single CMOS image sensor based on a 0.35μm process along with its design and implementation is introduced. The architecture of an active pixel sensor is used in the chip. The fill factor of a pixel cell can reach 43%,higher than the traditional factor of 30%. Moreover, compared with the conventional method whose fixed pattern noise （FPN） is around 0.5%, a dynamic digital double sampling technique is developed, which possesses simpler circuit architecture and a better FPN suppression outcome. The CMOS image sensor chip is implemented in the 0.35μm mixed signal process of a Chartered by MPW. The experimental results show that the chip operates welt,with an FPN of about 0.17%.展开更多
文摘A low-power-consumption 9bit 10MS/s pipeline ADC,used in a CMOS image sensor,is proposed. In the design, the decrease of power consumption is achieved by applying low-power-consumption and large-output-swing amplifiers with gain boost structure, and biasing all the cells with the same voltage bias source, which requires careful layout design and large capacitors. In addition,capacitor array DAC is also applied to reduce power consumption,and low threshold voltage MOS transistors are used to achieve a large signal processing range. The ADC was implemented in a 0.18μm 4M-1 P CMOS process,and the experimental results indicate that it consumes only 7mW, which is much less than general pipeline ADCs. The ADC was used in a 300000 pixels CMOS image sensor.
基金the National Natural Science Foundation of China (No.10075029).
文摘The quality of dark output images from the CMOS (complementarymetal oxide semiconductor) black and white (B & W) digital imagesensors captured before and after γ-ray irradiation was studied. Thecharacteristic parameters of the dark output images captured atdifferent radiation dose, e.g. average brightness and itsnon-uniformity of dark out- put images, were analyzed by our testsoftware. The primary explanation for the change of the parameterswith the radi- ation dose was given.
基金supported by the National Natural Science Foundation of China(62171172).
文摘CMOS image sensors produced by the existing CMOS manufacturing process usually have difficulty achieving complete charge transfer owing to the introduction of potential barriers or Si/SiO_(2)interface state traps in the charge transfer path,which reduces the charge transfer efficiency and image quality.Until now,scholars have only considered mechanisms that limit charge transfer from the perspectives of potential barriers and spill back effect under high illumination condition.However,the existing models have thus far ignored the charge transfer limitation due to Si/SiO_(2)interface state traps in the transfer gate channel,particularly under low illumination.Therefore,this paper proposes,for the first time,an analytical model for quantifying the incomplete charge transfer caused by Si/SiO_(2)interface state traps in the transfer gate channel under low illumination.This model can predict the variation rules of the number of untransferred charges and charge transfer efficiency when the trap energy level follows Gaussian distribution,exponential distribution and measured distribution.The model was verified with technology computer-aided design simulations,and the results showed that the simulation results exhibit the consistency with the proposed model.
基金This project is financially supported by the Narional Natural Science Foundation of China(Nos 10375034 and 10075029) and the Basic Research Foundation of Tsinghua University (No. JC2002058).
文摘Changes of the average brightness and non-uniformity of dark output images,and quality of pictures captured under natural lighting for the color CMOS digital image sensorsirradiated at different electron doses have been studied in comparison to those from theγ-irradiated sensors. For the electron-irradiated sensors, the non-uniformity increases obviouslyand a small bright region on the dark image appears at the dose of 0.4 kGy. The average brightnessincreases at 0.4 kGy, increases sharply at 0.5 kGy. The picture is very blurry only at 0.6 kGy,showing the sensor undergoes severe performance degradation. Electron radiation damage is much moresevere than γ radiation damage for the CMOS image sensors. A possible explanation is presented inthis paper.
基金Supported by National Natural Science Foundation of China (No.61036004 and No. 61076024)Ph.D. Programs Foundation of Ministry of Education of China (No. 20100032110031)
文摘An addition scheme applicable to time-delay integration (TDI) CMOS image sensor is proposed,which adds signals in the charge domain in the pixel array.A two-shared pixel structure adopting two-stage charge transfer is introduced,together with the rolling shutter with an undersampling readout timing.Compared with the conventional TDI addition methods,the proposed scheme can reduce the addition operations by half in the pixel array,which decreases the power consumption of addition circuits outside the pixel array.The timing arrangement and pixel structure are analyzed in detail.The simulation results show that the proposed pixel structure can achieve the charge addition with negligible nonlinearity,therefore the power consumption of the periphery addition circuits can be reduced by half theoretically.
基金Supported by National Natural Science Foundation of China (No.60806010,No.60976030)
文摘A high speed column-parallel CDS/ADC circuit with nonlinearity compensation is proposed in this paper.The correlated double sampling (CDS) and analog-to-digital converter (ADC) functions are integrated in a threephase column-parallel circuit based on two floating gate inverters and switched-capacitor network.The conversion rate of traditional single-slope ADC is speeded up by dividing quantization to coarse step and fine step.A storage capacitor is used to store the result of coarse step and locate the section of ramp signal of fine step,which can reduce the clock step from 2 n to 2 (n/2+1).The floating gate inverters are implemented to reduce the power consumption.Its induced nonlinear offset is cancelled by introducing a compensation module to the input of inverter,which can equalize the coupling path in three phases of the proposed circuit.This circuit is designed and simulated for CMOS image sensor with 640×480 pixel array using Chartered 0.18μm process.Simulation results indicate that the resolution can reach 10-bit and the maximum frame rate can reach 200 frames/s with a main clock of 10MHz.The power consumption of this circuit is less than 36.5μW with a 3.3V power supply.The proposed CDS/ADC circuit is suitable for high resolution and high speed image sensors.
文摘A new photodetector--bipolar junction photogate transistor is presented for CMOS image sensor and its analytical model is also established.With the technical parameter of the 0.6μm CMOS process,the bipolar junction photogate transistor is analyzed and simulated.The simulated results illustrate that the bipolar junction photogate transistor has the similar characteristics of the traditional photogate transistor.The photocurrent density of the bipolar junction photogate transistor increases exponentially with the incidence light power due to introducing the injection p+n junction.Its characteristic of blue response is rather improved compared to the traditional photogate transistor that benefits to increase the color photograph made up of the red,the green,and the blue.
文摘A single CMOS image sensor based on a 0.35μm process along with its design and implementation is introduced. The architecture of an active pixel sensor is used in the chip. The fill factor of a pixel cell can reach 43%,higher than the traditional factor of 30%. Moreover, compared with the conventional method whose fixed pattern noise （FPN） is around 0.5%, a dynamic digital double sampling technique is developed, which possesses simpler circuit architecture and a better FPN suppression outcome. The CMOS image sensor chip is implemented in the 0.35μm mixed signal process of a Chartered by MPW. The experimental results show that the chip operates welt,with an FPN of about 0.17%.
