Investigation of the characteristics of GIDL current in 90nm CMOS technology

A specially designed experiment is performed for investigating gate-induced drain leakage （GIDL） current in 90nm CMOS technology using lightly-doped drain （LDD） NMOSFET. This paper shows that the drain bias VD has a strong effect on GIDL current as compared with the gate bias VG at the same drain-gate voltage VDG. It is found that the difference between ID in the off-state ID - VG characteristics and the corresponding one in the off-state ID - VD characteristics, which is defined as IDIFF, versus VDG shows a peak. The difference between the influences of VD and VG on GIDL current is shown quantitatively by IDIFF, especially in 90nm scale. The difference is due to different hole tunnellings, Furthermore, the maximum IDIFF（IDIFF,MAX） varies linearly with VDG in logarithmic coordiuates and also VDG at IDIFF,MAX with VF which is the characteristic voltage of IDIFF, The relations are studied and some related expressions are given.

Research on Electric Field Confinement Effect in Silicon LED Fabricated by Standard CMOS Technology

The wedge-shaped and leaf-type silicon light-emitting devices(LED)are designed and fabricated with the Singapore Chartered Semi Inc.'s dual-gate standard 0.35μm CMOS process.The basic structure of the two devices is N well-P+ junction.P+ area is the wedge-shaped structure,which is embedded in N well.The leaf-type silicon LED device is a combination of the three wedge-shaped LED devices.The main difference between the two devices is their different electrode distribution,which is mainly in order to analyze the application of electric field confinement(EFC).The devices' micrographs were measured with the Olympus IC test microscope.The forward and reverse bias electrical characteristics of the devices were tested.Light measurements of the devices show that the electrode layout is very important when the electric field confinement is applied.

A frequency servo SoC with output power stabilization loop technology for miniaturized atomic clocks

A frequency servo system-on-chip(FS-SoC)featuring output power stabilization technology is introduced in this study for high-precision and miniaturized cesium(Cs)atomic clocks.The proposed power stabilization loop(PSL)technique,incorporating an off-chip power detector(PD),ensures that the output power of the FS-SoC remains stable,mitigating the impact of power fluctuations on the atomic clock's stability.Additionally,a one-pulse-per-second(1PPS)is employed to syn-chronize the clock with GPS.Fabricated using 65 nm CMOS technology,the measured phase noise of the FS-SoC stands at-69.5 dBc/Hz@100 Hz offset and-83.9 dBc/Hz@1 kHz offset,accompanied by a power dissipation of 19.7 mW.The Cs atomic clock employing the proposed FS-SoC and PSL obtains an Allan deviation of 1.7×10^(-11) with 1-s averaging time.

Challenges of 22 nm and beyond CMOS technology

It is predicted that CMOS technology will probably enter into 22 nm node around 2012. Scaling of CMOS logic technology from 32 to 22 nm node meets more critical issues and needs some significant changes of the technology, as well as integration of the advanced processes. This paper will review the key processing technologies which can be potentially integrated into 22 nm and beyond technology nodes, including double patterning technology with high NA water immersion lithography and EUV lithography, new device architectures, high K/metal gate （HK/MG） stack and integration technology, mobility enhancement technologies, source/drain engineering and advanced copper interconnect technology with ultra-low-k process.

Novel devices and process for 32 nm CMOS technology and beyond

The development of next 32 nm generation and below needs innovations on not only device structures, but also fabrication techniques and material selections. Among those promising technologies, new gate structures as high-κ gate dielectric and metal gate, strain channel carrier mobility enhancement technology, and novel non-planar MOSFET structures are all possible candidate technologies. In this paper, we will specify our discussion on the research progress of high-κ-metal gate and non-planar MOSFET-technologies that are suitable to 32 nm technology node and beyond.

60-GHz array antenna with standard CMOS technology on Schott Borofloat

This design is presented of a 2 × 2 planar array, with a half-wave dipole antenna to be its element, on a new substrate material, Schott Borofloat, with CMOS technology in the 60 GHz band. In the proposed structure, all the designs are based on the CMOS technology and similar performance could be achieved with the same size in contrast to the design on low-temperature co-fired ceramic （LTCC）. This could lead to the improving of the compatibility with the CMOS IC process, the design cost and the design precision which is restricted in the LTCC process. The simulated-10 dB bandwidth of the array is from 58 to 64 GHz. A peak gain of 9.4 dBi is achieved. Good agreement on return loss is achieved between simulations and measurements.

A 1.2-V,84-dB∑△ADM in 0.18-μm digital CMOS technology

A low power and low voltage∑△analog-to-digital modulator is realized with digital CMOS technology, which is due to full compensated depletion mode capacitors.Compared with mixed signal technology,this type of modulator is more compatible for pure digital applications.A pseudo-two-stage class-AB OTA is used in switchedcapacitor integrators for low voltage and low power.The modulator is realized in standard SMIC 0.18μm 1P6M digital CMOS technology.Measured results show that with 1.2 V supply voltage and a 6 MHz sample clock,the dynamic range of the modulator is 84 dB and the total power dissipation is 2460μW.

Development of 0.50μm CMOS Integrated Circuits Technology

Submicron CMOS IC technology, including triple layer resist lithography technology, RIE, LDD, Titanium Salicide, shallow junction, thin gate oxide, no bird's beak isolation and channel's multiple implantation doping technology have been developed. 0.50μm. CMOS integrated circuits have been fabricated using this submicron CMOS process.

CMOS Realization of VDVTA and OTA Based Fully Electronically Tunable First Order All Pass Filter with Optimum Linearity at Low Supply Voltage ±0.85 V

This paper presents a new first order all pass filter configurations. The proposed all pass filter configuration employs two configurations namely VDVTA and OTAs based first order all pass filter configuration. The first proposed configuration employs a single VDVTA and one grounded capacitor whereas the second proposed configuration employs two OTAs and one grounded capacitor. Both types of proposed configurations are fully electronically tunable and their quality factors do not depend on tunable pole frequency range. The reported configurations yield low active and passive sensitivities and also have low power consumption with very low supply voltage ± 0.85 V with Bias Voltage ± 0.50 V. The PSPICE simulation of the proposed VDVTA and two OTAs based first order all pass filter configurations are verified using 0.18 μm CMOS Technology Process Parameters.

A Positive Type DVCC-Based Universal Biquad

This paper presents a current-mode universal biquad employing only positive type DVCCs(differential voltage current conveyors).The circuit enables LP(low-pass),BP(band-pass),HP(high-pass),BS(band-stop)and AP(all-pass)responses by the selection and addition of the input and output currents without any component matching constraints.Moreover the circuit parametersω0 and Q can be set orthogonally adjusting the circuit components.A design example is given together with simulation results by PSPICE.

Accelerating hybrid and compact neural networks targeting perception and control domains with coarse-grained dataflow reconfiguration

Driven by continuous scaling of nanoscale semiconductor technologies,the past years have witnessed the progressive advancement of machine learning techniques and applications.Recently,dedicated machine learning accelerators,especially for neural networks,have attracted the research interests of computer architects and VLSI designers.State-of-the-art accelerators increase performance by deploying a huge amount of processing elements,however still face the issue of degraded resource utilization across hybrid and non-standard algorithmic kernels.In this work,we exploit the properties of important neural network kernels for both perception and control to propose a reconfigurable dataflow processor,which adjusts the patterns of data flowing,functionalities of processing elements and on-chip storages according to network kernels.In contrast to stateof-the-art fine-grained data flowing techniques,the proposed coarse-grained dataflow reconfiguration approach enables extensive sharing of computing and storage resources.Three hybrid networks for MobileNet,deep reinforcement learning and sequence classification are constructed and analyzed with customized instruction sets and toolchain.A test chip has been designed and fabricated under UMC 65 nm CMOS technology,with the measured power consumption of 7.51 mW under 100 MHz frequency on a die size of 1.8×1.8 mm^2.

Hybrid material integration in silicon photonic integrated circuits

Hybrid integration ofⅢ-Ⅴand ferroelectric materials is being broadly adopted to enhance functionalities in silicon photonic integrated circuits(PICs).Bonding and transfer printing have been the popular approaches for integration of III–V gain media with silicon PICs.Similar approaches are also being considered for ferroelectrics to enable larger RF modulation bandwidths,higher linearity,lower optical loss integrated optical modulators on chip.In this paper,we review existing integration strategies ofⅢ-Ⅴmaterials and present a route towards hybrid integration of bothⅢ-Ⅴand ferroelectrics on the same chip.We show that adiabatic transformation of the optical mode between hybrid ferroelectric and silicon sections enables efficient transfer of optical modal energies for maximum overlap of the optical mode with the ferroelectric media,similar to approaches adopted to maximize optical overlap with the gain section,thereby reducing lasing thresholds for hybridⅢ-Ⅴintegration with silicon PICs.Preliminary designs are presented to enable a foundry compatible hybrid integration route of diverse functionalities on silicon PICs.

Novel Plus Type DVCC-Based Current-Mode Biquadratic Circuit

This paper presents a novel current-mode biquadratic circuit employing only plus type DVCCs(differential voltage current conveyors).The circuit enables LP(low-pass),BP(band-pass),HP(high-pass),BS(band-stop)and AP(all-pass)responses by the selection and addition of the input and output currents without any component matching constraints.Moreover the circuit parametersω0 and Q can be set orthogonally adjusting the circuit components.A design example is given together with simulation results by PSPICE.

A Plus Type CC-Based Current-Mode Universal Biquad

This paper introduces a current-mode universal biquad circuit using only plus type CCs(current conveyors)(i.e.DVCCs(differential voltage current conveyors)and CCIIs(second generation current conveyors)).The circuit enables LP(low-pass),BP(band-pass),HP(high-pass),BS(band-stop)and AP(all-pass)responses by the selection and/or addition of the input and output currents without any component matching constraints.Moreover the circuit parametersω0 and Q can be set orthogonally adjusting the circuit components.A design example is given together with simulation responses by PSPICE.

Small Area ROM Design for Embedded Applications

The compact full custom layout design of a 16 kbit mask-programmable complementary metal oxide semiconductor (CMOS) read only memory (ROM) with low power dissipation is introduced. By optimizing storage cell size and peripheral circuit structure, the ROM has a small area of 0.050 mm2 with a power-delay product of 0.011 pJ/bit at +1.8 V. The high packing density and the excellent power-delay product have been achieved by using SMIC 0.18 μm 1P6M CMOS technology. A novel and simple sense amplifier/driver structure is presented which restores the signal full swing efficiently and reduces the signal rising time by 2.4 ns, as well as the memory access time. The ROM has a fast access time of 8.6 ns. As a consequence, the layout design not only can be embedded into microprocessor system as its program memory, but also can be fabricated individually as ROM ASIC.

A 3.125-Gb/s inductorless transimpedance amplifier for optical communication in 0.35μm CMOS

A 3.125-Gb/s transimpedance amplifier（TIA） for an optical communication system is realized in 0.35μm CMOS technology.The proposed TIA employs a regulated cascode configuration as the input stage, and adopts DC-cancellation techniques to stabilize the DC operating point.In addition,noise optimization is processed. The on-wafer measurement results show the transimpedance gain of 54.2 dBΩand -3 dB bandwidth of 2.31 GHz.The measured average input referred noise current spectral density is about 18.8 pA/（？）.The measured eye diagram is clear and symmetrical for 2.5-Gb/s and 3.125-Gb/s PRBS.Under a single 3.3-V supply voltage,the TIA consumes only 58.08 mW,including 20 mW from the output buffer.The whole die area is 465×435μm^2.

Circuit Topology Analysis of CMOS LNA in Mobile Communication Systems

A Low Noise Amplifier (LNA) intended for the use in the front-end of the third-generation WCDMA receivers is designed in a standard 0 25?um CMOS process. In the LNA circuit, a positive-feedback Q-enhancement and tuning technique is used to obtain an optimal Q for acquiring a minimum noise figure. The LNA in our design has a forward gain of 20 3?dB and a minimum noise figure of 1 2?dB at 2 0?GHz. The power dissipation is 30?mW at a 2 5?V supply.

CMOS ring VCO for UHF RFID readers

A complementary metal oxide semiconductor （CMOS） voltage controlled ring oscillator for ultra high frequency （UHF） radio frequency identification （RFID） readers has been realized and characterized. Fabricated in charter 0.35 p.m CMOS process, the total chip size is 0.47 × 0.67 mm^2. While excluding the pads, the core area is only 0.15 ×0.2 mm^2. At a supply voltage of 3.3 V, the measured power consumption is 66 mW including the output buffer for 50 Ω testing load. This proposed voltage-controlled ring oscillator exhibits a low phase noise of - 116 dBc/Hz at 10 MHz offset from the center frequency of 922.5 MHz and a lower tuning gain through the use of coarse/fine frequency control.

A high linearity X-band SOI CMOS digitally-controlled phase shifter

This paper proposed an X-band 6-bit passive phase shifter （PS） designed in 0.18 μm silicon-on-insulator （SOI） CMOS technology, which solves the key problem of high integration degree, low power, and a small size T/R module. The switched-topology is employed to achieve broadband and fiat phase shift. The ESD circuit and driver are also integrated in the PS. It covers the frequency band from 7.5 to 10.5 GHz with an EMS phase error less than 7.5%. The input and output VSWRs are less than 2 and the insertion loss （IL） is between 8-14 dB across the 7.5 to 10.5 GHz, with a maximum IL difference of 4 dB. The input 1 dB compression point （IP1dB） is 20 dBm.

Efficient design method for cell allocation in hybrid CMOS/nanodevices using a cultural algorithm with chaotic behavior

The hybrid CMOS molecular （CMOL） circuit, which combines complementary metal-oxide- semiconductor （CMOS） components with nanoscale wires and switches, can exhibit significantly improved performance. In CMOL circuits, the nanodevices, which are called cells, should be placed appropriately and are connected by nanowires. The cells should be connected such that they follow the shortest path. This paper presents an efficient method of cell allocation in CMOL circuits with the hybrid CMOS/nanodevice structure; the method is based on a cultural algorithm with chaotic behavior. The optimal model of cell allocation is derived, and the coding of an individual represent- ing a cell allocation is described. Then the cultural algorithm with chaotic behavior is designed to solve the optimal model. The cultural algorithm consists of a population space, a belief space, and a protocol that describes how knowledge is exchanged between the population and belief spaces. In this paper, the evolutionary processes of the population space employ a genetic algorithm in which three populations undergo parallel evolution. The evolutionary processes of the belief space use a chaotic ant colony algorithm. Extensive experiments on cell allocation in benchmark circuits showed that a low area usage can be obtained using the proposed method, and the computation time can be reduced greatly compared to that of a conventional genetic algorithm.