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Design and analysis of a highly-integrated CMOS power amplifier for RFID readers
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作者 高同强 张春 +1 位作者 池保勇 王志华 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2009年第6期121-125,共5页
To implement a fully-integrated on-chip CMOS power amplifier(PA) for RFID readers,the resonant frequency of each matching network is derived in detail.The highlight of the design is the adoption of a bonding wire as... To implement a fully-integrated on-chip CMOS power amplifier(PA) for RFID readers,the resonant frequency of each matching network is derived in detail.The highlight of the design is the adoption of a bonding wire as the output-stage inductor.Compared with the on-chip inductors in a CMOS process,the merit of the bondwire inductor is its high quality factor,leading to a higher output power and efficiency.The disadvantage of the bondwire inductor is that it is hard to control.A highly integrated class-E PA is implemented with 0.18-μm CMOS process.It can provide a maximum output power of 20 dBm and a 1 dB output power of 14.5 dBm.The maximum power-added efficiency(PAE) is 32.1%.Also,the spectral performance of the PA is analyzed for the specified RFID protocol. 展开更多
关键词 cmos power amplifier RFID reader matching network bonding wires
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