CMP process optimization for bulk copper removal based on alkaline copper slurry was performed on a 300 mm Applied Materials Reflexion LK system. Under the DOE condition, we conclude that as the pressure increases, th...CMP process optimization for bulk copper removal based on alkaline copper slurry was performed on a 300 mm Applied Materials Reflexion LK system. Under the DOE condition, we conclude that as the pressure increases, the removal rate increases and non-uniformity is improved. As the slurry flow rate increases, there is no significant improvement in the material removal rate, but it does slightly reduce the WIWNU and thus improve uniformity. The optimal variables are obtained at a reduced pressure of 1.5 psi and a slurry flow rate of 300 ml/min. Platen/carrier rotary speed is set at a constant value of 97/103 rpm. We obtain optimized CMP characteristics including a removal rate over 6452 A/min and non-uniformity below 4% on blanket wafer and the step height is reduced by nearly 8000 A/min in the center of the wafer on eight layers of copper patterned wafer, the surface roughness is reduced to 0.225 nm.展开更多
A signal processing method for the friction-based endpoint detection system of a chemical mechanical polishing （CMP） process is presented. The signal process method uses the wavelet threshold denoising method to red...A signal processing method for the friction-based endpoint detection system of a chemical mechanical polishing （CMP） process is presented. The signal process method uses the wavelet threshold denoising method to reduce the noise contained in the measured original signal, extracts the Kalman filter innovation from the denoised signal as the feature signal, and judges the CMP endpoint based on the feature of the Kalman filter innovation sequence during the CMP process. Applying the signal processing method, the endpoint detection experiments of the Cu CMP process were carried out. The results show that the signal processing method can judge the endpoint of the Cu CMP process.展开更多
CMP设备通过精准过程控制系统(Precision Process Control,PPC)可以精准计算抛光时间。而在这一过程中,需要存储大量的抛光历史数据、晶圆厚度量测数据、计算中间值和模型配置信息等。这些数据信息数量巨大、关系复杂,并且在计算过程中...CMP设备通过精准过程控制系统(Precision Process Control,PPC)可以精准计算抛光时间。而在这一过程中,需要存储大量的抛光历史数据、晶圆厚度量测数据、计算中间值和模型配置信息等。这些数据信息数量巨大、关系复杂,并且在计算过程中需要快速获取相关数据。为了更好地适应了PPC的需求,可利用MySQL数据库对这些数据进行存储管理。通过需求分析和实体关系模型的建立,实现了数据库的设计。最终利用数据库实现了数据的有效管理及快速查询,并在机台稳定运行。展开更多
基金Project supported by the Major National Science and Technology Special Projects(No.2009ZX02308)the Tianjin Natural Science Foundation of China(No.10JCZDJC15500)+1 种基金the National Natural Science Foundation of China(No.10676008)the Fund Project of the Hebei Provincial Department of Education(No.2011128)
文摘CMP process optimization for bulk copper removal based on alkaline copper slurry was performed on a 300 mm Applied Materials Reflexion LK system. Under the DOE condition, we conclude that as the pressure increases, the removal rate increases and non-uniformity is improved. As the slurry flow rate increases, there is no significant improvement in the material removal rate, but it does slightly reduce the WIWNU and thus improve uniformity. The optimal variables are obtained at a reduced pressure of 1.5 psi and a slurry flow rate of 300 ml/min. Platen/carrier rotary speed is set at a constant value of 97/103 rpm. We obtain optimized CMP characteristics including a removal rate over 6452 A/min and non-uniformity below 4% on blanket wafer and the step height is reduced by nearly 8000 A/min in the center of the wafer on eight layers of copper patterned wafer, the surface roughness is reduced to 0.225 nm.
基金Project supported by the Major Program of National Natural Science Foundation of China(No.50390061)the National Science and Technology Major Project,China(No.2009ZX02011)
文摘A signal processing method for the friction-based endpoint detection system of a chemical mechanical polishing （CMP） process is presented. The signal process method uses the wavelet threshold denoising method to reduce the noise contained in the measured original signal, extracts the Kalman filter innovation from the denoised signal as the feature signal, and judges the CMP endpoint based on the feature of the Kalman filter innovation sequence during the CMP process. Applying the signal processing method, the endpoint detection experiments of the Cu CMP process were carried out. The results show that the signal processing method can judge the endpoint of the Cu CMP process.
文摘CMP设备通过精准过程控制系统(Precision Process Control,PPC)可以精准计算抛光时间。而在这一过程中,需要存储大量的抛光历史数据、晶圆厚度量测数据、计算中间值和模型配置信息等。这些数据信息数量巨大、关系复杂,并且在计算过程中需要快速获取相关数据。为了更好地适应了PPC的需求,可利用MySQL数据库对这些数据进行存储管理。通过需求分析和实体关系模型的建立,实现了数据库的设计。最终利用数据库实现了数据的有效管理及快速查询,并在机台稳定运行。
