Capacitive micromechanical ultrasonic transducers(CMUTs)have been widely studied because they can be used as substitutes for piezoelectric ultrasonic transducers in imaging applications.However,it is unclear whether a...Capacitive micromechanical ultrasonic transducers(CMUTs)have been widely studied because they can be used as substitutes for piezoelectric ultrasonic transducers in imaging applications.However,it is unclear whether and how CMUTs can be developed for sensors incorporating other functions.For instance,researchers have proposed the use of CMUTs for pressure sensing,but fundamental and practical application issues remain unsolved.This study explored ways in which a pressure sensor can be properly developed based on a CMUT prototype using a simulation approach.A three-dimensional finite element model of CMUTs was designed using the COMSOL Multiphysics software by combining the working principle of CMUTs with pressure sensing characteristics in which the resonance frequency of the CMUT cell shifts accordingly when it is subjected to an external pressure.Simultaneously,when subjected to pressure,the CMUT membrane deforms,thus the pressure can be reflected by the change in the capacitance.展开更多
Eased on the mechanism of temperature tactile sensing of human finger,a heat flux tactile sensor com- posed of a thermostat module and a heat flux sensor is designed to identify material thermal properties. The ther- ...Eased on the mechanism of temperature tactile sensing of human finger,a heat flux tactile sensor com- posed of a thermostat module and a heat flux sensor is designed to identify material thermal properties. The ther- mostat module maintains the sensor temperature invariable, and the heat flux sensor（Peltier device） detects the heat flux temperature difference between the thermostat module and the object surface. Two different modes of the heat flux tactile sensor are proposed, and they are simulated and experimented for different material objects. The results indicate that the heat flux tactile sensor can effectively identify different thermal properties.展开更多
MEMS压力传感器的研制已相当成熟,但在高温领域却遇到了许多问题,为解决高温环境下压力测量的问题,文中介绍了一种新型Si C高温压力传感器电容芯片的设计方案。应用Ansys有限元分析软件进行热-结构耦合场仿真分析,常温下电容芯片的灵敏...MEMS压力传感器的研制已相当成熟,但在高温领域却遇到了许多问题,为解决高温环境下压力测量的问题,文中介绍了一种新型Si C高温压力传感器电容芯片的设计方案。应用Ansys有限元分析软件进行热-结构耦合场仿真分析,常温下电容芯片的灵敏度为1.3 p F/bar(1 bar=100 k Pa),300℃、500℃、700℃时灵敏度分别为1.4 p F/bar、1.54 p F/bar、1.74 p F/bar,表明这种结构在高温下仍具有较高的灵敏度,同时对结构进行模态仿真,由模态分析结果知,一阶频率为245 930 Hz,可知该结构具有很高的频响。展开更多
文摘Capacitive micromechanical ultrasonic transducers(CMUTs)have been widely studied because they can be used as substitutes for piezoelectric ultrasonic transducers in imaging applications.However,it is unclear whether and how CMUTs can be developed for sensors incorporating other functions.For instance,researchers have proposed the use of CMUTs for pressure sensing,but fundamental and practical application issues remain unsolved.This study explored ways in which a pressure sensor can be properly developed based on a CMUT prototype using a simulation approach.A three-dimensional finite element model of CMUTs was designed using the COMSOL Multiphysics software by combining the working principle of CMUTs with pressure sensing characteristics in which the resonance frequency of the CMUT cell shifts accordingly when it is subjected to an external pressure.Simultaneously,when subjected to pressure,the CMUT membrane deforms,thus the pressure can be reflected by the change in the capacitance.
基金Supported by the National High Technology Research and Development Program of China(″863″Program)(2009AA01Z314,2009AA01Z311)the Jiangsu Province Natural Science Foundation(BK2009272)theJiangsu Province″333″Program~~
文摘Eased on the mechanism of temperature tactile sensing of human finger,a heat flux tactile sensor com- posed of a thermostat module and a heat flux sensor is designed to identify material thermal properties. The ther- mostat module maintains the sensor temperature invariable, and the heat flux sensor（Peltier device） detects the heat flux temperature difference between the thermostat module and the object surface. Two different modes of the heat flux tactile sensor are proposed, and they are simulated and experimented for different material objects. The results indicate that the heat flux tactile sensor can effectively identify different thermal properties.
文摘MEMS压力传感器的研制已相当成熟,但在高温领域却遇到了许多问题,为解决高温环境下压力测量的问题,文中介绍了一种新型Si C高温压力传感器电容芯片的设计方案。应用Ansys有限元分析软件进行热-结构耦合场仿真分析,常温下电容芯片的灵敏度为1.3 p F/bar(1 bar=100 k Pa),300℃、500℃、700℃时灵敏度分别为1.4 p F/bar、1.54 p F/bar、1.74 p F/bar,表明这种结构在高温下仍具有较高的灵敏度,同时对结构进行模态仿真,由模态分析结果知,一阶频率为245 930 Hz,可知该结构具有很高的频响。
