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Analysis on the Bonding Failure Mechanism of High Modulus Carbon Fiber Composites
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作者 LIANG Yanmin ZU Qingming +5 位作者 LIANG Xuhao YE Zhoujun SHI Wenfeng LI Zongzhou DONG Bin JIANG Hao 《上海航天(中英文)》 CSCD 2022年第1期129-136,共8页
In order to explore the bonding failure mechanism of high modulus carbon fiber composite materials,the tensile experiment and finite element numerical simulation for single-lap and bevel-lap joints of unidirectional l... In order to explore the bonding failure mechanism of high modulus carbon fiber composite materials,the tensile experiment and finite element numerical simulation for single-lap and bevel-lap joints of unidirectional laminates are carried out,and the stress distributions,the failure modes,and the damage contours are analyzed. The analysis shows that the main reason for the failure of the single-lap joint is that the stress concentration of the ply adjacent to the adhesive layer is serious owing to the modulus difference,and the stress cannot be effectively transmitted along the thickness direction of the laminate. When the tensile stress of the ply exceeds its ultimate strength in the loading process,the surface fiber will fail. Compared with the single-lap joint,the bevel-lap joint optimizes the stress transfer path along the thickness direction,allows each layer of the laminate to share the load,avoids the stress concentration of the surface layer,and improves the bearing capacity of the bevel-lap joint. The improved bearing capacity of the bevellap joint is twice as much as that of the single-lap joint. The research in this paper provides a new idea for the subsequent study of mechanical properties of adhesively bonded composite materials. 展开更多
关键词 high modulus carbon fiber composite material single-lap joint bevel-lap joint failure mode numerical simulation stress concentration stress transfer
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Research on the Crack Detection of Conductive Components Using Pulsed Eddy Current Thermography 被引量:8
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作者 ZHOU Deqiang CHANG Xiang +3 位作者 DU Yang CAO Piyu WANG Hua ZHANG Hong 《Instrumentation》 2017年第3期59-68,共10页
Crack of conductive component is one of the biggest threats to daily production. In order to detect the crack on conductive component,the pulsed eddy current thermography models were built according to different mater... Crack of conductive component is one of the biggest threats to daily production. In order to detect the crack on conductive component,the pulsed eddy current thermography models were built according to different materials with the cracks based on finite element method(FEM) simulation. The influence of the induction heating temperature distribution with the different defect depths were simulated for the carbon fiber reinforced plastic(CFRP) materials and general metal materials. The grey value of image sequence was extracted to analyze its relationship with the depth of crack. Simulative and experimental results show that in the carbon fiber reinforced composite materials,the bigger depth of the crack is,the larger temperature rise of the crack during the heating phase is; and the bigger depth of the crack is,the faster the cooling rate of the crack during the cooling phase is. In general metal materials,the smaller depth of the crack is,the lager temperature rise of the crack during the heating phase is; and the smaller depth of the crack is,the faster the cooling rate of crack during the cooling phase is. 展开更多
关键词 Pulsed Eddy Current Thermography Finite Element Analysis carbon fiber Reinforced composite Material Metal Material
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