RELATIONS BETWEEN INTERFACE OF CF/Al-4.5 Cu COMPOSITE AND SOLIDIFICATION PROCESSING

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Bonding properties of interface in Fe/Al clad tube prepared by explosive welding

A Fe/Al clad tube was prepared by explosive welding.Then the bonding characteristic of the interface was investigated by compression,flattening and compression-shear test.The test results exhibit that the clad tubes possessing good bonding interface have higher shear strength than that of pure aluminum and can bear both axial and radial deformation.The original interface between aluminum layer and ferrite layer was observed by scanning electron microscopy（SEM）.The results show that the clad tubes with good bonding properties possess the interface in wave and straight shape.The Fe/Al clad tube was used to manufacture the T-shape by hydro-bulging.It is found that the good-bonding interface of the Fe/Al clad tube plays a dominant role in the formation of the T-shape.

Characterization and evaluation of interface in SiC_p/2024 Al composite

35% SiCp/2024 Al（volume fraction） composite was prepared by powder metallurgy method. The microstructures of Si Cp/Al interfaces and precipitate phase/Al interfaces were characterized by HRTEM, and the interface conditions were evaluated by tensile modules of elasticity and Brinell hardness measurement. The results show that the overall Si Cp/Al interface condition in this experiment is good and three kinds of Si Cp/Al interfaces are present in the composites, which include vast majority of clean planer interfaces, few slight reaction interfaces and tiny amorphous interfaces. The combination mechanism of Si C and Al in the clean planer interface is the formation of a semi-coherent interface by closely matching of atoms and there are no fixed or preferential crystallographic orientation relationships between Si C and Al. MgAl2O4 spinel particles act as an intermediate to form semi-coherent interface with SiC and Al respectively at the slight reaction interfaces. When the composite is aged at 190 °C for 9 h after being solution-treated at 510 °C for 2 h, numerous discoid-shaped and needle-shaped nanosized precipitates dispersively exist in the composite and are semi-coherent of low mismatch with Al matrix. The Brinell hardness of composites arrives peak value at this time.

Effect of immersion Ni plating on interface microstructure and mechanical properties of Al/Cu bimetal

A nickel-based coating was deposited on the pure Al substrate by immersion plating,and the Al/Cu bimetals were prepared by diffusion bonding in the temperature range of 450-550 ℃.The interce microstructure and fracture surface of Al/Cu joints were studied by scanning electron microscopy（SEM） and X-ray diffraction（XRD）.The mechanical properties of the Al/Cu bimetals were measured by tensile shear and microhardness tests.The results show that the Ni interiayer can effectively eliminate the formation of Al-Cu intermetallic compounds.The Al/Ni interface consists of the Al3Ni and Al3Ni2 phases,while it is Ni-Cu solid solution at the Ni/Cu interce.The tensile shear strength of the joints is improved by the addition of Ni interiayer.The joint with Ni interiayer annealed at 500 ℃ exhibits a maximum value of tensile shear strength of 34.7 MPa.

Improvement of the matrix and the interface quality of a Cu/Al composite by the MARB process

The matrix accumulative roll bonding technology （MARB） can improve the matrix performance of metal composite and strengthen the bonding quality of the interface./n this research, for the fwst time, the technology of MARB was proposed. A sound Cu/AI bonding composite was obtained using the MARB process and the bonding characteristic of the interface was studied using scanning electricity microscope （SEM） and energy-dispersive spectroscopy （EDS）. The result indicated that accumulation cycles and diffusion annealing temperature were the most important factors for fabricating a Cu/AI composite material. The substrate aluminum was strengthened by MARB, and a high quality Cu/AI composite with sound interface was obtained as well.

Effect of bonding interface on delamination behavior of drawn Cu/Al bar clad material

Cu/Al bar clad material was fabricated by a drawing process and a subsequent heat treatment.During these processes,intermetallic compounds have been formed at the interface of Cu/Al and have affected its bonding property.Microstructures of Cu/Al interfaces were observed by OM,SEM and EDX Analyser in order to investigate the bonding properties of the material.According to the microstructure a series of diffusion layers were observed at the interface and the thicknesses of diffusion layers have increased with aging time as a result of the diffusion bonding.The interfaces were composed of 3-ply diffusion layers and their compositions were changed with aging time at 400 °C.These compositional compounds were revealed to be η2,(θ+η2),(α+θ) intermetallic phases.It is evident from V-notch impact tests that the growth of the brittle diffusion layers with the increasing aging time directly influenced delamination distance between the Cu sleeve and the Al core.It is suggested that the proper holding time at 400 °C for aging as post heat treatment of a drawn Cu/Al bar clad material would be within 1 h.

First-principles investigation on stability and electronic structure of Sc-dopedθ′/Al interface in Al−Cu alloys

The properties of Sc-dopedθ′(Al_(2)Cu)/Al interface in Al−Cu alloys were investigated by first-principles calculations.Sc-doped semi-coherent and coherentθ′(Al_(2)Cu)/Al interfaces(Sc doped in Al slab(S1 site),Sc doped inθ′slab(S2 site))were modeled based on calculated results and reported experiments.Through the analysis of interfacial bonding strength,it is revealed that the doping of Sc at S1 site can significantly decrease the interface energy and increase the work of adhesion.In particular,the doped coherent interface with Sc at S1 site which is occupied by interstitial Cu atoms has very good bonding strength.The electronic structure shows the strong Al—Cu bonds at the interfaces with Sc at S1 site,and the Al—Al bonds at the interfaces with Sc at S2 site are formed.The formation of strong Al—Cu and Al—Al bonds plays an important role in the enhancement of doped interface strength.

Study on Interface between Sub-micron Particles and Matrix in Al_2O_3p/Al Composites

The microstructural characteristic of 1070AI matrix composites reinforced by 0.15 祄 AI2O3 particles whose volume fraction was 40% was investigated by TEM and HREM. The results showed that the interface between the matrix and reinforcements was clean and bonded well, without any interfacial reaction products. There were some preferential crystallographic orientation relationships between Al matrix and AI2O3 particle because of the lattice imperfection on the surface of Al2O3 particles.

Evolution of bonding interface in solid-liquid cast-rolling bonding of Cu/Al clad strip

Cu/Al clad strips are prepared using solid?liquid cast-rolling bonding(SLCRB)technique with a d160mm×150mm twin-roll experimental caster.The extent of interfacial reactions,composition of the reaction products,and their micro-morphology evolution in the SLCRB process are investigated with scanning electron microscope(SEM),energy dispersive spectrometer(EDS),and X-ray diffraction(XRD).In the casting pool,initial aluminized coating is first generated on the copper strip surface,with the diffusion layer mainly consisting ofα(Al)+CuAl2and growing at high temperatures,with the maximum thickness of10μm.After sequent rolling below the kiss point,the diffusion layer is broken by severe elongation,which leads to an additional crack bond process with a fresh interface of virgin base metal.The average thickness is reduced from10to5μm.The reaction products,CuAl2,CuAl,and Cu9Al4,are dispersed along the rolling direction.Peeling and bending test results indicate that the fracture occurs in the aluminum substrate,and the morphology is a dimple pattern.No crack or separation is found at the bonding interface after90°-180°bending.The presented method provides an economical way to fabricate Cu/Al clad strip directly.

Analysis of diffusion bond interface of TiAl base alloy with Ti, TC4 alloy and 40Cr steel

TiAl is diffusion bonded with Ti, TC4 Alloy and 40Cr Steel by heating in vacuum, and analysis of interfaces shows stratified Ti 3Al forms in TiAl/Ti interface closest to TiAl base, and the α phase and the α+β phase arise closest to Ti base at lower temperature and higher temperature respectively; Structure of TiAl/TC4 interface is TiAl/γ+α 2/Ti 3Al/α-Ti/TC4 at lower temperature and TiAl/γ+β+α 2/TC4 at high temperature; in TiAl/40Cr steel interface, obvious decarbonised layer on steel side while TiC and reaction phase with Fe Al Ti system form on TiAl side.

Carbon Fiber Breakage Mechanism in Aluminum(Al)/Carbon Fibers(CFs) Composite Sheet during Accumulative Roll Bonding(ARB) Process

We put forward a method of fabricating Aluminum(Al)/carbon fibers(CFs) composite sheets by the accumulative roll bonding(ARB) method. The finished Al/CFs composite sheet has CFs and pure Al sheets as sandwich and surface layers. After cross-section observation of the Al/CFs composite sheet, we found that the CFs discretely distributed within the sandwich layer. Besides, the tensile test showed that the contribution of the sandwich CFs layer to tensile strength was less than 11% compared with annealed pure Al sheet. With ex-situ observation of the CFs breakage evolution with-16%,-32%, and-45% rolling reduction during the ARB process, the plastic instability of the Al layer was found to bring shear damages to the CFs. At last, the bridging strengthening mechanism introduced by CFs was sacrificed. We provide new insight into and instruction on Al/CFs composite sheet preparation method and processing parameters.

XRD and TEM Analysis in the Interface of Diffusion Bonding for Fe_3Al/Q235 Dissimilar Materials

Phase structure characteristics near the interface of Fe3Al/Q235 diffusion bonding are investigated by means of X raydiffraction (XRD), transmission electronic microscope (TEM) and electron diffraction, etc. The test results indicatedthat obviously a diffusion transition zone forms near the interface of Fe3Al/Q235 under the condition of heatingtemperature 1050~1100℃, holding time 60 min and pressure 9.8 MPa, which indicated that the diffusion interfaceof Fe3Al/Q235 was combined well. The diffusion transition zone consisted of Fe3Al and a-Fe(Al) solid solution.Microhardness near the diffusion transition zone was HM 480~540. There was not brittle phase of high hardness inthe interface transition zone. This is favorable to enhance toughness of Fe3Al/Q235 diffusion joint.

Effect of melt-to-solid volume ratio and preheating temperature on Mg/Al bimetals interface by centrifugal casting

Compound casting is an efficient method for bonding dissimilar metals,in which a dramatic reaction can occur between the melt and solid.The centrifugal casting process,a type of compound casting,was applied to cast Al/Mg dissimilar bimetals.Magnesium melt was poured at 700 °C,with melt-to-solid volume ratios(Vm/Vs) of 1.5 and 3,into a preheated hollow aluminum cylinder.The preheating temperatures of the solid part were 320,400,and 450 °C,and the constant rotational speed was 1,600 rpm.The cast parts were kept inside the casting machine until reaching the cooling temperature of 150 °C.The result showed that an increase in preheating temperature from 320 to 450 °C led to an enhanced reaction layer thickness.In addition,an increase in the Vm/Vs from 1.5 to 3 resulted in raising the interface thickness from 1.2 to 1.8 mm.Moreover,the interface was not continuously formed when a Vm/Vs of 3 was selected.In this case,the force of contraction overcame the resultant acting force on the interface.An interface formed at the volume ratio of 1.5 was examined using scanning electron microscopy(SEM) equipped with energy-dispersive X-ray spectroscopy(EDS),and the results demonstrated the formation of Al_(3)Mg_(2),Al_(12)Mg_(17) and(δ+Al_(12)Mg_(17)) eutectic structures in the interface.

Mobility of Various Intervariant Interfaces in 18R Martensite in a Cu-Zn-Al Alloy Part Ⅰ: In-situ Observations

The motion of intervariant intedeces under the action of applied stress in the internally faulted 18R martensite in a Cu-Zn-Al shape memory alloy has been studied. Transmission electron microscopy in situ observations show that the interfaces between 24 martensite variants have different reaction to applied stress. The A/C type and A/B type interfaces have good mobil-ity, the A/D type interface has bad mobiIity, and the different-group-intervariant interfaces are basically immobile.

PREPARATION,PROPERTIES AND INTERFACE STRUCTURES OF Si_3N_(4w)/6061Al COMPOSITE

The Si_3N_4 whisker reinforced 6061Al composite with bending strength of 790 MPa was prepared by squeeze casting process.After heat-treatment under T6 regime i.e.530℃, 1 h solutioning and 160℃,24 h aging,an increment in strength and microhardness may be over 20% and 28% respectively,The microstructures of Si_3N_4 whisker and Si_3N_4/Al interface were observed by meas of HRTEM.The relation between interracial structure and composite properties was discussed.

Effect of Nb and alloying elements on interface reaction between high Nb-containing TiAl alloys and ZrO_2-based ceramic moulds

In the present study, Ti-45Al-(6, 7, 8)Nb(at%) and Ti-45Al-8Nb-0.5(Mn, Si, Y, B) alloys were prepared by arc melting and casting into Zr O2(Y2O3 stabilized) ceramic moulds to study the effect of alloying elements Nb and Mn, Si, Y, B on the interfacial reaction between casting Ti Al alloys and ceramic moulds by SEM, and the elements' distribution in the interface reaction layer by line scanning. The results showed that with an increase in Nb content, the interfacial reaction weakened and the thickness of the reaction layer decreased gradually. The interface reaction thickness of the alloys with Nb content of 6, 7, 8at% were 60, 34 and 26 μm, respectively. Clearly, the addition of 8at% Nb to Ti-45 Al is the best for the thickness of the reaction layer. The addition of Nb would form a Nb-rich film in the reaction layer, which could reduce the solubility of oxygen in the interface, and suppress further diffusion of oxygen to the matrix. If the same content of Mn, Si, Y, or B alloying elements were added respectively to Ti-45Al-8Nb, the thickness of the interface reaction layer from large to small was as follows: Mn>Si>Y>B. The interface reaction thickness increased after 0.5at% Mn added, had no obvious change after 0.5at% Si addition, and decreased after adding 0.5at% Y or B. The introduced elements, which formed a protective film or/and promoted the formation of a dense aluminum oxide layer, would be of benefit to the resistance of interfacial reaction.

Interface characterization of Al/Cu 2-ply composites under various loading conditions

The effects of reduction ratio during roll bonding on the microstructural evolution at interface and subsequent mechanical properties of roll-bonded Al/Cu 2-ply sheets were investigated. The interface microstructures for several Al/Cu 2-ply sheets fabricated under different reduction ratios between 30% and 65% were verified by transmission electron microscopy(TEM). Taking the difference of interface microstructure into consideration, 3-point bending and peel tests were performed for obtaining flexural and bonding strengths for Al/Cu 2-ply sheets. The effect of the quantified areas of metallurgical bonding at interfaces on the bonding strength was also discussed. The results show that both the bonding and flexural strengths for Al/Cu 2-ply sheets are reduced by decreasing the reduction ratio during the roll bonding process, which is strongly correlated with the interface microstructure. This was especially verified by observing the interface delamination from the 3-point bent samples.

Stress distribution at diffusion-bonded interface of Fe_3Al with Cr18-Ni8 steel

Fe3Al and Crl8-Ni8 steel were bonded in vacuum and an interface was formed between Fe3Al and Crl8-Ni8 steel. Stress distribution at the diffusion-bonded interface was researched by numerical simulation and finite element method （FEM）. The results indicated that the peak stress appeared at the interface near Cr18-Ni8 steel side. This is the key factor to induce crack at this position. With the enhancement of heating temperature, the peak stress at the bonded interface increases. When the temperature is 1 100 22, the peak stress is up to 65.9 MPa, which is bigger than that at 1 000 22 by 9. 4%. In addition, the peak stress becomes bigger with the increase of the thickness of base metal from 1 mm to 8 ram. While the thickness is more than 8 ram, the peak stress varies slightly with the change of the thickness.

Interface states in Al_2O_3/AlGaN/GaN metal-oxide-semiconductor structure by frequency dependent conductance technique

Frequency dependent conductance measurements are implemented to investigate the interface states in Al2O3/A1GaN/GaN metal-oxide-semiconductor （MOS） structures. Two types of device structures, namely, the recessed gate structure （RGS） and the normal gate structure （NGS）, are studied in the experiment. Interface trap parameters includ-ing trap density Dit, trap time constant ιit, and trap state energy ET in both devices have been determined. Furthermore, the obtained results demonstrate that the gate recess process can induce extra traps with shallower energy levels at the Al2O3/AlGaN interface due to the damage on the surface of the AlGaN barrier layer resulting from reactive ion etching （RIE）.

Segregation of Si and Mg at Fe(110)/Al(110) Interface

The interface structure and electronic properties of Fe(110)/Al(110) are investigated by the first-principles plane-wave pseudopotential method. The interface segregation position of Si and Mg is determined, and the effect of Mg and Si on the interface binding of Fe(110)/Al(110) is analyzed by combining the work of separation and charge density. The results show that the Fe(110)/Al(110) interface energy of FeHollow coordination is smaller and the interface structure is more stable. The Fe(110)/Al(110) interface separation surface in the form of Fe-Hollow coordination appears at the sub interface layer on the side of Al(110)near the interface. The interface structure of Mg and Si segregation is similar to that of undoped alloy elements.The calculations also suggest that Mg and Si segregate on the Al(110) side of the interface and occupy the Al lattice on the Al(110) side. The segregation of Mg and Si elements will reduce the interface binding, primarily because the Fe-Si bond and Fe-Mg bond are weaker than Fe-Al bond.