Study of Chemical Etching and Chemo-Mechanical Polishing on CdZnTe Nuclear Detectors

Cadmium zinc telluride (CdZnTe) semiconductor has applications in the detection of X-rays and gamma-rays at room temperature without having to use a cooling system. Chemical etching and chemo-mechanical polishing are processes used to smoothen CdZnTe wafer during detector device fabrication. These processes reduce surface damages left after polishing the wafers. In this paper, we compare the effects of etching and chemo-mechanical polishing on CdZnTe nuclear detectors, using a solution of hydrogen bromide in hydrogen peroxide and ethylene glycol mixture. X-ray photoelectron spectroscopy (XPS) was used to monitor TeO2 on the wafer surfaces. Current-voltage and detector-response measurements were made to study the electrical properties and energy resolution. XPS results showed that the chemical etching process resulted in the formation of more TeO2 on the detector surfaces compared to chemo-mechanical polishing. The electrical resistivity of the detector is of the order of 1010 Ω-cm. The chemo-mechanical polishing process increased the leakage current more that chemical etching. For freshly treated surfaces, the etching process is more detrimental to the energy resolution compared to chemo-mechanically polishing.

A novel approach of jet polishing for interior surface of small-grooved components using three developed setups

It is a challenge to polish the interior surface of an additively manufactured component with complex structures and groove sizes less than 1 mm.Traditional polishing methods are disabled to polish the component,meanwhile keeping the structure intact.To overcome this challenge,small-grooved components made of aluminum alloy with sizes less than 1 mm were fabricated by a custom-made printer.A novel approach to multi-phase jet(MPJ)polishing is proposed,utilizing a self-developed polisher that incorporates solid,liquid,and gas phases.In contrast,abrasive air jet(AAJ)polishing is recommended,employing a customized polisher that combines solid and gas phases.After jet polishing,surface roughness(Sa)on the interior surface of grooves decreases from pristine 8.596μm to 0.701μm and 0.336μm via AAJ polishing and MPJ polishing,respectively,and Sa reduces 92%and 96%,correspondingly.Furthermore,a formula defining the relationship between linear energy density and unit defect volume has been developed.The optimized parameters in additive manufacturing are that linear energy density varies from 0.135 J mm^(-1)to 0.22 J mm^(-1).The unit area defect volume achieved via the optimized parameters decreases to 1/12 of that achieved via non-optimized ones.Computational fluid dynamics simulation results reveal that material is removed by shear stress,and the alumina abrasives experience multiple collisions with the defects on the heat pipe groove,resulting in uniform material removal.This is in good agreement with the experimental results.The novel proposed setups,approach,and findings provide new insights into manufacturing complex-structured components,polishing the small-grooved structure,and keeping it unbroken.

Novel Batch Polishing Method of Ceramic Cutting Inserts for Reducing Tool Wear

Ceramic cutting inserts are a type of cutting tool commonly used in high-speed metal cutting applications.However,the wear of these inserts caused by friction between the workpiece and cutting inserts limits their overall effectiveness.In order to improve the tool life and reduce wear,this study introduces an emerging method called magnetic field-assisted batch polishing(MABP)for simultaneously polishing multiple ceramic cutting inserts.Several polishing experiments were conducted under different conditions,and the wear characteristics were clarified by cutting S136H steel.The results showed that after 15 min of polishing,the surface roughness at the flank face,edge,and nose of the inserts was reduced to below 2.5 nm,6.25 nm,and 45.8 nm,respectively.Furthermore,the nose radii of the inserts did not change significantly,and there were no significant changes in the weight percentage of elements before and after polishing.Additionally,the tool life of the batch polished inserts was found to be up to 1.75 times longer than that of unpolished inserts.These findings suggest that the MABP method is an effective way to mass polish ceramic cutting inserts,resulting in significantly reduced tool wear.Furthermore,this novel method offers new possibilities for polishing other tools.

Isolation and Characterization of Cellulose Nanofiber(CNF)from Kenaf(Hibiscus cannabinus)Bast through the Chemo-Mechanical Process

The present work emphasizes the isolation of cellulose nanofiber(CNF)from the kenaf(Hibiscus cannabinus)bast through a chemo-mechanical process.In order to develop high CNF yield with superior properties of CNF for improving compatibility in varied applications this method is proposed.The fiber purification involved pulping and bleaching treatments,whereas mechanical treatment was performed by grinding and high-pressure treatments.The kraft pulping as a delignification method followed by bleaching has successfully removed almost 99%lignin in the fiber with high pulp yield and delignification selectivity.The morphology of the fibers was characterized by scanning electron microscopy,which showed a smooth surface,fiber bundles,gel-shaped nanofiber,and an average size of 94.05 nm with 69%of CNF in 34–100 nm size.The chemo-mechanical process exhibited a more crystalline nature in CNF than pulp kenaf.The low zeta potential values exhibit the distribution of fibrils and colloidal suspension stability without any further agglomeration.A lower concentration of CNF is less stable exhibiting the product agglomeration.Therefore,the chemo-mechanical process for the isolation of CNF(Hibiscus cannabinus)from kenaf involves sustainable,low-cost,non-toxic,and cheap alternatives than other traditional methods.

Technological advancements in millet dehulling and polishing process: An insight into pretreatment methods, machineries and impact on nutritional quality

Millets are widely recognized for their nutritional significance;however, the methods employed for their processing are currently lacking. This article primarily focuses on the advanced technologies and progressions in millet dehulling and polishing. These technologies operate based on the fundamental principles of compression-shearing, abrasion-friction, and centrifugal-impact forces. Processing of millets can be challenging because of the physical characteristics and tight attachment of hull and bran to the endosperm. However, several dehullers have been designed to solve this problem for different kinds of millets. In addition, the nutritional and anti-nutritional characteristics undergo alterations due to both dehulling and polishing processes. These alterations are thoroughly examined and discussed in this article. Specifically, anti-nutrients such as tannins and phytate are predominantly found in the outer pericarp of the grain and experience a reduction after undergoing dehulling and polishing. The nutritional properties are also subjected to a reduction;however, this reduction can be mitigated by subjecting the grains to certain pretreatments before dehulling and polishing. These treatments serve to enhance dehulling efficiency and nutrient digestibility while simultaneously reducing the presence of anti-nutrients. Novel thermal and non-thermal methodologies such as microwave, hydrothermal, high-pressure processing, and ohmic heating can be employed for processing millets, thereby diminishing the loss of nutrients. Additional research can be carried out to investigate their impact on the dehulling and polishing of millets.

Energy beam-based direct and assisted polishing techniques for diamond:A review

Diamond is a highly valuable material with diverse industrial applications,particularly in the fields of semiconductor,optics,and high-power electronics.However,its high hardness and chemical stability make it difficult to realize high-efficiency and ultra-low damage machining of diamond.To address these challenges,several polishing methods have been developed for both single crystal diamond(SCD)and polycrystalline diamond(PCD),including mechanical,chemical,laser,and ion beam processing methods.In this review,the characteristics and application scope of various polishing technologies for SCD and PCD are highlighted.Specifically,various energy beam-based direct and assisted polishing technologies,such as laser polishing,ion beam polishing,plasma-assisted polishing,and laser-assisted polishing,are summarized.The current research progress,material removal mechanism,and infuencing factors of each polishing technology are analyzed.Although some of these methods can achieve high material removal rates or reduce surface roughness,no single method can meet all the requirements.Finally,the future development prospects and application directions of different polishing technologies are presented.

An Uncertainty Analysis of Downward Pressure Applied to the Wafer Based on a Flexible Airbag by a Double Side Polishing Machine

The process of wafer polishing is known to be highly demanding,and even small deviations in the processing parameters can have a significant impact on the quality of the wafers obtained.During the process of wafer polishing,maintaining a constant pressure value applied by the polishing head is essential to achieve the desired flatness of the wafer.The accuracy of the downward pressure output by the polishing head is a crucial factor in producing flat wafers.In this paper,the uncertainty component of downward pressure is calculated and its measurement uncertainty is evaluated,and a method for calculating downward pressure uncertainty traceable to international basic unit is established.Therefore,the reliability of double side polishing machine has been significantly improved.

Pingyao Hand-Polished Lacquerware

PINGYAO hand-polished lacquerware has been widely considered as one of the four most famed lacquerware types in China.It originated more than 2,000 years ago in what is called Pingyao County today,in Jinzhong City,central China’s Shanxi Province.Its fame is due to the exquisite and unique skill of polishing lacquered coating with bare hands during the manufacturing process.This quaint and durable lacquerware boasts both aesthetic and practical values,and is characterized by its distinguished appearance and glossy sheen.It comes in the forms of jewelry boxes,utensils and stationery,screens and furniture.

Effects Optimization of Bio-Polishing Industrial Process Parameters

The purpose of this study is to select an appropriate commercial neutral cellulase enzyme for denim garments bio-polishing to achieve specific industrial goals. A full factorial experimental design was used to evaluate the effect of factors considered in the optimization of the bio-polishing process (fabric ID: x1, treatment time: x2, treatment temperature: x3, enzyme concentration: x4, storage time: x5, inactivation step: x6 and enzyme type: x7). Experiments were conducted using laboratory washing machine. Subjective evaluation was performed at a pilot and at an industrial scale. Tear, tensile strength and subjective evaluation concerning hand feel, fabric color, indigo dye pocket back staining and fuzziness extent were evaluated. Results showed that x6 and x7 had significant effects on the fabric tear and tensile strength loss. In the optimization, the great dependence between observed and predicted tear strength and tensile strength loss, the correlation coefficient of the models (R2 > 0.85) and the important value of F-ratio proved the validity of the models. Results showed that denim leg panels treated with the enzyme Lava-Cell NSZ presented a minimum loss of tear and tensile strength. A low-temperature and time enzymatic bio-polishing process was developed at industrial scale.

Surface Polishing of 6H-SiC Substrates

The surface polishing for silicon carbide （SIC） substrates was investigated and results were presented for mechanical polishing （MP） and chemo-mechanical polishing （CMP）. High quality surfaces were obtained after CMP with colloidal silica. The removal mechanism of scratches in MP and detailed physical and chemical process during CMP were analyzed. The effects of MP and CMP on the surface roughness were assessed by optical microscopy （OM）, atomic force microscopy （AFM） and step profilometry. KOH etching and high resolution X-ray diffractometry （H RXRD） were applied to evaluate the subsurface damage of 6H-SiC substrates.

An Improved Angle Polishing Method for Measuring Subsurface Damage in Silicon Wafers

We present an improved angle polishing method in which the end of the cover slice near the glue layer is beveled into a thin,defect-free wedge,the straight edge of which is used as the datum for measuring the depth of subsurface damage. The bevel angle can be calculated from the interference fringes formed in the wedge. The minimum depth of the subsurface damage that can be measured by this method is a few hundred nanometers. Our results show that the method is straightforward, accurate, and convenient.

STUDIES ON POLYURETHANE FOAM POLISHING TOOL

This paper deals with Polyurethane Foam Polishing Tool (PFPT), which has three dimensional softness and are adapted to polishing sophisticated curved surfaces. The manufacturing technology, the equilibrium theory of matter and energy have been discussed and the PFPT is produced successfully at our laboratory. After investigating their properties, the effective factors to the behavior of the PFPT are studied. The microcosmic construction of the PFPT have been observed by sweep electron microscope(SEM) and the polishing mechanism studied. A great deal of experiments have been carried out to optimize the manufacturing parameters.

Linearity of Removal in the Proeess of Optical Element Polishing

In the light of some assumptions that are very close to the practical working conditions,a very complicated polishing process of optical element can be simplified as a linear and shift invariant system that is relatd only to the speed,pres- sure and time of processing.In polishing,the removed material can be represented and entreated by the convolution of the removal function of polishing head and the dwell function.The properties of removal function are presented.The assumptions and methods given by the author have been shown to be correct and applicable by experiments using a ring lap to polish the optical surfac.

A Computer-Controlled Polishing Machine

Describes a computer controlled polishing machine utilizing a small polisher with specified movement to figure optical surfces having strict dimensional requirements. The system is especially applicable in figuring aspherical surfaces, beginning with the best fit sphere if the departure from the desired surface is not large. An interferometric measuring system is desiigned to form a closed loop control during processing.

Composite Adaptive Control of Belt Polishing Force for Aero-engine Blade

The existing methods for blade polishing mainly focus on robot polishing and manual grinding.Due to the difficulty in high-precision control of the polishing force,the blade surface precision is very low in robot polishing,in particular,quality of the inlet and exhaust edges can not satisfy the processing requirements.Manual grinding has low efficiency,high labor intensity and unstable processing quality,moreover,the polished surface is vulnerable to burn,and the surface precision and integrity are difficult to ensure.In order to further improve the profile accuracy and surface quality,a pneumatic flexible polishing force-exerting mechanism is designed and a dual-mode switching composite adaptive control(DSCAC) strategy is proposed,which combines Bang-Bang control and model reference adaptive control based on fuzzy neural network(MRACFNN) together.By the mode decision-making mechanism,Bang-Bang control is used to track the control command signal quickly when the actual polishing force is far away from the target value,and MRACFNN is utilized in smaller error ranges to improve the system robustness and control precision.Based on the mathematical model of the force-exerting mechanism,simulation analysis is implemented on DSCAC.Simulation results show that the output polishing force can better track the given signal.Finally,the blade polishing experiments are carried out on the designed polishing equipment.Experimental results show that DSCAC can effectively mitigate the influence of gas compressibility,valve dead-time effect,valve nonlinear flow,cylinder friction,measurement noise and other interference on the control precision of polishing force,which has high control precision,strong robustness,strong anti-interference ability and other advantages compared with MRACFNN.The proposed research achieves high-precision control of the polishing force,effectively improves the blade machining precision and surface consistency,and significantly reduces the surface roughness.

Chemical Mechanical Polishing of Glass Substrate with α-Alumina-g-Polystyrene Sulfonic Acid Composite Abrasive

Abrasive is the one of key influencing factors during chemical mechanical polishing（CMP） process. Currently, α-Alumina （α-Al2O3） particle, as a kind of abrasive, has been widely used in CMP slurries, but their high hardness and poor dispersion stability often lead to more surface defects. After being polished with composite particles, the surface defects of work pieces decrease obviously. So the composite particles as abrasives in slurry have been paid more attention. In order to reduce defect caused by pure α-Al2O3 abrasive, α-alumina-g-polystyrene sulfonic acid （α-Al2O3-g-PSS） composite abrasive was prepared by surface graft polymerization. The composition, structure and morphology of the product were characterized by Fourier transform infrared spectroscopy（FTIR）, X-ray photoelectron spectroscopy（XPS）, time-of-flight secondary ion mass spectroscopy（TOF-SIMS）, and scanning electron microscopy（SEM）, respectively. The results show that polystyrene sulfonic acid grafts onto α-Al2O3, and has well dispersibility. Then, the chemical mechanical polishing performances of the composite abrasive on glass substrate were investigated with a SPEEDFAM-16B-4M CMP machine. Atomic force microscopy（AFM） images indicate that the average roughness of the polished glass substrate surface can be decreased from 0.835 nm for pure α-Al2O3 abrasive to 0.583 nm for prepared α-Al2O3-g-PSS core-shell abrasive. The research provides a new and effect way to improve the surface qualities during CMP.

Effects of Polishing on Proximate Composition,Physico-Chemical Characteristics,Mineral Composition and Antioxidant Properties of Pigmented Rice

The effects of polishing on proximate compositions,physico-chemical characteristics,mineral compositions and antioxidant properties of the rice flours obtained from three different pigmented rice varieties(Chak-hao Angangba,Chak-hao Amubi and Chak-hao Poireiton) were investigated.The rice varieties were significantly(P < 0.05) different in the contents of the test characteristics.Lipids,ash,minerals,phytochemicals(phenolic acids and flavonoids) and 2,2-diphenyl-1-picrylhydrazyl(DPPH) activity of rice flours were decreased after polishing(9% degree of milling),while amylose content and lightness were increased.X-ray diffraction pattern of rice flours exhibited A-type crystalline pattern with reflections at 15.1o,17.1o,18.2o and 23.0o.Pasting properties and transition temperatures were decreased after polishing treatment.Polishing resulted in changes in the crystallinity,enthalpy and morphology of rice flours.

Computer Controlled Polishing of the Off-axis Aspheric Mirrors

In this paper, the manufacturing and testing procedures to make large off-axis aspherical mirrors are presented. The difficulties in polishing and testing for both circular aperture and rectangular aperture mirrors are previewed, and a possible solution is given. The two mirrors have been polished by means of CCOS, and the final accuracy is 25nm rms for 770mm×210mm rectangular mirror and 20nm rms for φ600mm circular mirror. These results just meet the optical tolerances specified by the designer, and the manufacturing and testing procedures presented here show good ability to make the large off-axis aspherical mirrors.

Material Removal Model Considering Influence of Curvature Radius in Bonnet Polishing Convex Surface

The bonnet tool polishing is a novel, advanced and ultra-precise polishing process, by which the freeform surface can be polished. However, during the past few years, not only the key technology of calculating the dwell time and controlling the surface form in the bonnet polishing has been little reported so far, but also little attention has been paid to research the material removal function of the convex surface based on the geometry model considering the influence of the curvature radius. Firstly in this paper, for realizing the control of the freeform surface automatically by the bonnet polishing, on the basis of the simplified geometric model of convex surface, the calculation expression of the polishing contact spot on the convex surface considering the influence of the curvature radius is deduced, and the calculation model of the pressure distribution considering the influence of the curvature radius on the convex surface is derived by the coordinate transformation. Then the velocity distribution model is built in the bonnet polishing the convex surface. On the basis of the above research and the semi-experimental modified Preston equation obtained from the combination method of experimental and theoretical derivation, the material removal model of the convex surface considering the influence of the curvature radius in the bonnet polishing is established. Finally, the validity of the model through the simulation method has been validated. This research presents an effective prediction model and the calculation method of material removal for convex surface in bonnet polishing and prepares for the bonnet polishing the free surface numerically and automatically.

Research on Abrasives in the Chemical Mechanical Polishing Process for Silicon Nitride Balls

Silicon nitride (Si 3N 4) has been the main material for balls in ceramic ball bearings, for its lower density, high strength, high hardness, fine thermal stability and anticorrosive, and is widely used in various fields, such as high speed and high temperature areojet engines, precision machine tools and chemical engineer machines. Silicon nitride ceramics is a kind of brittle and hard material that is difficult to machining. In the traditional finishing process of silicon nitride balls, balls are lapped by expensive diamond abrasive. The machining is inefficiency and the cost is high, but also lots of pits, scratch subsurface micro crazes and dislocations will be caused on the surface of the balls, the performance of the ball bearings would be declined seriously. In these year, a kind of new technology known as chemical mechanical polishing is introduced in the ultraprecision machining process of ceramic balls. In this technology, abrasives such as ZrO 2, CeO 2 whose hardness is close to or lower than the work material (Si 3N 4) are used to polishing the balls. In special slurry, these abrasives can chemo-mechanically react with the work material and environment (air or water) to generate softer material (SiO 2). And the resultants will be removed easily at 0.1 nm level. So the surface defects can be minimized, very smooth surface (Ra=4 nm) and fine sphericity (0.15～0.25 μm ) can be obtained, and the machining efficiency is also improved. The action mechanism of the abrasives in the chemical mechanical polishing process in finishing of silicon nitride ball will be introduced in this paper.