钙钛矿材料由于具有结构稳定、易于获取、成本低廉和易于合成等优点,在发光二极管、激光器和太阳能电池等光电器件领域具有广阔的应用前景。目前,部分适合UV-LED应用的钙钛矿具有结构不稳定性。为了寻找结构稳定的钙钛矿,此项研究利用...钙钛矿材料由于具有结构稳定、易于获取、成本低廉和易于合成等优点,在发光二极管、激光器和太阳能电池等光电器件领域具有广阔的应用前景。目前,部分适合UV-LED应用的钙钛矿具有结构不稳定性。为了寻找结构稳定的钙钛矿,此项研究利用第一性原理对无铅双钙钛矿Cs_(2)NaScX_(6)(X=Cl,Br,I)的电子及光学性质进行了理论计算。计算结果表明:Cs_(2)NaScX_(6)(X=Cl,Br,I)为直接带隙半导体,带隙值分别为5.545 e V(Cl)、4.549 eV(Br)和3.408 eV(I),Cs_(2)NaScI_(6)在紫外光范围内具有较强的光吸收。本研究内容为无铅A_(2)B^(I)B^(III)X_(6)型双钙钛矿成为UV-LED的候选材料提供理论支持。展开更多
Indium gallium tin oxide(IGTO)thin films have the potential for high mobility and lowtemperature processing,which makes them suitable for applications such as display backplanes and high-voltage switching devices.Howe...Indium gallium tin oxide(IGTO)thin films have the potential for high mobility and lowtemperature processing,which makes them suitable for applications such as display backplanes and high-voltage switching devices.However,very few studies have investigated the plasmaetching characteristics of IGTO and changes in its properties after etching.In this study,the etching characteristics of IGTO were investigated using Cl_(2)/Ar plasma,and changes in surface properties were analyzed.Results showed that the etch rate increased with an increase in the proportion of Cl_(2),with the highest etch rate observed at 69 nm min^(-1)in pure Cl_(2)plasma with a gas flow rate of 100 sccm.Furthermore,increased radio-frequency power caused a rise in the etch rate,while a process pressure of 15 m Torr was optimal.The primary etching mechanism for IGTO thin films under Cl_(2)plasma was a chemical reaction,and an increased work function indicated the occurrence of defects on the surface.In addition,the etching process reduced the surface roughness of Cl_(2)-containing plasma,whereas the etching process in pure Ar plasma increased surface roughness.This study contributes to a better understanding of the plasmaetching characteristics of IGTO and changes in its properties after etching,providing valuable insights for IGTO-based applications.展开更多
文摘钙钛矿材料由于具有结构稳定、易于获取、成本低廉和易于合成等优点,在发光二极管、激光器和太阳能电池等光电器件领域具有广阔的应用前景。目前,部分适合UV-LED应用的钙钛矿具有结构不稳定性。为了寻找结构稳定的钙钛矿,此项研究利用第一性原理对无铅双钙钛矿Cs_(2)NaScX_(6)(X=Cl,Br,I)的电子及光学性质进行了理论计算。计算结果表明:Cs_(2)NaScX_(6)(X=Cl,Br,I)为直接带隙半导体,带隙值分别为5.545 e V(Cl)、4.549 eV(Br)和3.408 eV(I),Cs_(2)NaScI_(6)在紫外光范围内具有较强的光吸收。本研究内容为无铅A_(2)B^(I)B^(III)X_(6)型双钙钛矿成为UV-LED的候选材料提供理论支持。
基金supported by the Chung-Ang University Research Grants in 2021the National Research Foundation(NRF)of Korea(No.2020R1G1A1102692)。
文摘Indium gallium tin oxide(IGTO)thin films have the potential for high mobility and lowtemperature processing,which makes them suitable for applications such as display backplanes and high-voltage switching devices.However,very few studies have investigated the plasmaetching characteristics of IGTO and changes in its properties after etching.In this study,the etching characteristics of IGTO were investigated using Cl_(2)/Ar plasma,and changes in surface properties were analyzed.Results showed that the etch rate increased with an increase in the proportion of Cl_(2),with the highest etch rate observed at 69 nm min^(-1)in pure Cl_(2)plasma with a gas flow rate of 100 sccm.Furthermore,increased radio-frequency power caused a rise in the etch rate,while a process pressure of 15 m Torr was optimal.The primary etching mechanism for IGTO thin films under Cl_(2)plasma was a chemical reaction,and an increased work function indicated the occurrence of defects on the surface.In addition,the etching process reduced the surface roughness of Cl_(2)-containing plasma,whereas the etching process in pure Ar plasma increased surface roughness.This study contributes to a better understanding of the plasmaetching characteristics of IGTO and changes in its properties after etching,providing valuable insights for IGTO-based applications.
