A 3D temperature field reconstruction method using the colored background oriented schlieren(CBOS)method is proposed to address image blurring due to the different refractive index of the multi-wavelength light and si...A 3D temperature field reconstruction method using the colored background oriented schlieren(CBOS)method is proposed to address image blurring due to the different refractive index of the multi-wavelength light and significant errors produced when the traditional background oriented schlieren(BOS)method is applied to high-temperature gas.First,the traditional method is employed to reconstruct the non-uniform 3D temperature field.Second,the CBOS method is applied to correct the distortion.Then,by analyzing the correlation coefficient among different color points of the colored background pattern,the non-uniform temperature field is reconstructed much more accurately.Finally,the experimental results are verified by applying the Runge-Kutta ray-tracing method and the thermocouple contact measurement method.The maximum average temperature error of the CBOS-reconstructed temperature field is 12.92°C,compared with the thermocouples.Therefore,an accurate three-dimensional reconstruction of the temperature field can be achieved by the proposed method effectively.展开更多
This work used experimental methods to study heat transfer behavior inside a heat pipe and found that heat transfer behavior inside the heat pipe was changed due to its integration with cooling plates. This change cau...This work used experimental methods to study heat transfer behavior inside a heat pipe and found that heat transfer behavior inside the heat pipe was changed due to its integration with cooling plates. This change caused the heat pipe to have copper-like heat transfer behavior. Experimental performances first built a CPU simulator with maximum heat power 300 W in accordance with the ASTM standard as heat source and measured temperature distribution by using infrared thermography and thermocouple thermometer. Observation of heat transfer behavior inside heat pipe influenced by its integration with cooling plates used color schlieren technique. A commercial CPU heat pipe cooler was also used as reference object in this work. Integration of the heat pipe with cooling plates causes the heat pipe to have the copper-like heat transfer behavior. The results indicate that rebuilding the bare heat pipe’s heat transfer behavior is the best solution for improving cooling efficiency of the heat pipe cooler.展开更多
基金Supported by the National Natural Science Foundation of China(52005500)Foundation of Tianjin Educational Committee(2018KJ242)Basic Science-Research Funds of National University(3122019088)。
文摘A 3D temperature field reconstruction method using the colored background oriented schlieren(CBOS)method is proposed to address image blurring due to the different refractive index of the multi-wavelength light and significant errors produced when the traditional background oriented schlieren(BOS)method is applied to high-temperature gas.First,the traditional method is employed to reconstruct the non-uniform 3D temperature field.Second,the CBOS method is applied to correct the distortion.Then,by analyzing the correlation coefficient among different color points of the colored background pattern,the non-uniform temperature field is reconstructed much more accurately.Finally,the experimental results are verified by applying the Runge-Kutta ray-tracing method and the thermocouple contact measurement method.The maximum average temperature error of the CBOS-reconstructed temperature field is 12.92°C,compared with the thermocouples.Therefore,an accurate three-dimensional reconstruction of the temperature field can be achieved by the proposed method effectively.
文摘This work used experimental methods to study heat transfer behavior inside a heat pipe and found that heat transfer behavior inside the heat pipe was changed due to its integration with cooling plates. This change caused the heat pipe to have copper-like heat transfer behavior. Experimental performances first built a CPU simulator with maximum heat power 300 W in accordance with the ASTM standard as heat source and measured temperature distribution by using infrared thermography and thermocouple thermometer. Observation of heat transfer behavior inside heat pipe influenced by its integration with cooling plates used color schlieren technique. A commercial CPU heat pipe cooler was also used as reference object in this work. Integration of the heat pipe with cooling plates causes the heat pipe to have the copper-like heat transfer behavior. The results indicate that rebuilding the bare heat pipe’s heat transfer behavior is the best solution for improving cooling efficiency of the heat pipe cooler.
