Ceramic particles reinforced copper matrix composites manufactured by advanced powder metallurgy:preparation, performance, and mechanisms

Copper matrix composites doped with ceramic particles are known to effectively enhance the mechanical properties,thermal expansion behavior and high-temperature stability of copper while maintaining high thermal and electrical conductivity.This greatly expands the applications of copper as a functional material in thermal and conductive components,including electronic packaging materials and heat sinks,brushes,integrated circuit lead frames.So far,endeavors have been focusing on how to choose suitable ceramic components and fully exert strengthening effect of ceramic particles in the copper matrix.This article reviews and analyzes the effects of preparation techniques and the characteristics of ceramic particles,including ceramic particle content,size,morphology and interfacial bonding,on the diathermancy,electrical conductivity and mechanical behavior of copper matrix composites.The corresponding models and influencing mechanisms are also elaborated in depth.This review contributes to a deep understanding of the strengthening mechanisms and microstructural regulation of ceramic particle reinforced copper matrix composites.By more precise design and manipulation of composite microstructure,the comprehensive properties could be further improved to meet the growing demands of copper matrix composites in a wide range of application fields.

Hybrid effect on mechanical properties and high-temperature performance of copper matrix composite reinforced with micro-nano dual-scale particles

A dual-scale hybrid HfB_(2)/Cu-Hf composite with HfB_(2) microparticles and Cu_(5) Hf nanoprecipitates was designed and prepared.The contribution of the hybrid effect to the mechanical properties and high-temperature performances was studied from macro and micro perspectives,respectively.The hybrid of dual-scale particles can make the strain distribution of the composite at the early deformation stage more uniform and delay the strain concentration caused by the HfB_(2) particle.The dislocation pinning of HfB_(2) particles and the coherent strengthening of Cu_(5) Hf nanoprecipitates simultaneously play a strengthening role,but the strength of the hybrid composite is not a simple superposition of two strengthening mod-els.In addition,both Cu_(5) Hf nanoprecipitates and HfB_(2) microparticles contribute to the high-temperature performance of the composite,the growth and phase transition of nanoprecipitates at high temperature will reduce their contribution to strength,while the stable HfB_(2) particles can inhibit the coarsening of matrix grains and maintain the high-density geometrically necessary dislocations(GNDs)in the matrix,which ensures more excellent high-temperature resistance of the hybrid composite.As a result,the hy-brid structure can simultaneously possess the advantages of multiple reinforcements and make up for the shortcomings of each other.Finally,a copper matrix composite with high strength,high conductivity,and excellent high-temperature performance is displayed.

Significant strengthening of copper-based composites using boron nitride nanotubes

Nanotubes, such as boron nitride nanotubes (BNNTs) and carbon nanotubes (CNTs), exhibit excellent mechanical properties. In this work, high-quality BNNTs were synthesized by ball milling and annealing. Subsequently, well-dispersed 3vol%BNNTs/Cu and 3vol%CNTs/Cu composites were successfully prepared using ball milling, spark plasma sintering, and followed by hot-rolling. Moreover, the mechanical properties and strengthening mechanisms of BNNTs/Cu and CNTs/Cu composites were compared and discussed in details. At 293 K,both BNNTs/Cu and CNTs/Cu composites exhibited similar ultimate tensile strength (UTS) of~404 MPa, which is approximately 170%higher than pure Cu. However, at 873 K, the UTS and yield strength of BNNTs/Cu are 27%and 29%higher than those of CNTs/Cu, respectively.This difference can be attributed to the stronger inter-walls shear resistance, higher thermomechanical stability of BNNTs, and stronger bonding at the BNNTs/Cu interface as compared to the CNTs/Cu interface. These findings provide valuable insights into the potential of BNNTs as an excellent reinforcement for metal matrix composites, particularly at high temperature.

Fabrication of superaligned carbon nanotubes reinforced copper matrix laminar composite by electrodeposition

A new kind of laminar metal matrix nanocomposite（MMC） was fabricated by an electrodeposition process with copper and superaligned carbon nanotubes film（SACNT film）.The SACNT film was put on a titanium plate and then a layer of copper was electrodeposited on it.By repeating the above process,the laminar Cu/SACNT composite which contains dozens or hundreds of layers of copper and SACNT films was obtained.The thickness of a single copper layer was controlled by adjusting the process parameter easily and the thinnest layer is less than 2 μm.The microscopic observation shows that the directional alignment structure of SACNT is retained in the composite perfectly.The mechanical and electrical properties testing results show that the tensile and yield strengths of composites are improved obviously compared with those of pure copper,and the high conductivity is retained.This technology is a potential method to make applicable MMC which characterizes high volume fraction and directional alignment of carbon nanotubes.

Tribological properties of copper matrix composites reinforced with homogeneously dispersed graphene nanosheets

Graphene reinforced copper matrix composites （Gr/Cu） were fabricated by electrostatic self-assembly and powder metallurgy. The morphology and structure of graphene oxide, graphene oxide-Cu powders and Gr/Cu composites were characterized by scanning electronic microscopy, transmission electronic microscopy, X-ray diffraction and Raman spectroscopy, respectively. The effects of graphene contents, applied loads and sliding speeds on the tribological behavior of the composites were investigated. The results indicate that the coefficient of friction of the composites decreases first and then increases with increasing the graphene content. The lowest friction coefficient is achieved in 0.3 wt~ Gr/Cu composite, which decreases by 65% compared to that of pure copper. The coefficient of friction of the composite does not have significant change with increasing the applied load, however, it increases with increasing the sliding speed. The tribological mechanisms of the composite under different conditions were also investigated.

Sintering behavior and thermal conductivity of nickel-coated graphite flake/copper composites fabricated by spark plasma sintering

Nickel-coated graphite flakes/copper（GN/Cu） composites were fabricated by spark plasma sintering with the surface of graphite flakes（GFs） being modified by Ni–P electroless plating. The effects of the phase transition of the amorphous Ni–P plating and of Ni diffusion into the Cu matrix on the densification behavior, interfacial microstructure, and thermal conductivity（TC） of the GN/Cu composites were systematically investigated. The introduction of Ni–P electroless plating efficiently reduced the densification temperature of uncoated GF/Cu composites from 850 to 650℃ and slightly increased the TC of the X–Y basal plane of the GF/Cu composites with 20 vol%–30 vol% graphite flakes. However, when the graphite flake content was greater than 30 vol%, the TC of the GF/Cu composites decreased with the introduction of Ni–P plating as a result of the combined effect of the improved heat-transfer interface with the transition layer, P generated at the interface, and the diffusion of Ni into the matrix. Given the effect of the Ni content on the TC of the Cu matrix and on the interface thermal resistance, a modified effective medium approximation model was used to predict the TC of the prepared GF/Cu composites.

Synthesis and Tribological Properties of Copper-alumina Nanocomposites Prepared by Coprecipitation Technique

The objective of this work is to study the synthesis of copper-alumina nanocomposites using the coprecipitation process and hot-pressing method, and investigate their mechanical properties. The effects of calcination temperature on the average size of composite particles and chemical composition after calcination were also analyzed. The sintering parameters including sintering temperature, hot pressure and packing time were optimized to fabricate the alumina nanoparticles reinforced copper matrix composites（CMCs）. The density, microhardness and tribological properties of the CMCs reinforced with 1 wt%, 2 wt%, 3 wt%, 4 wt% and 5 wt% of alumina nanoparticles were investigated correspondingly. The results showed that the optimum preparation parameters for the CMCs were 900 ℃ of hot pressing temperature, 27.5 MPa of hot pressure and 2 hrs of packing time. The CMC reinforced with 2 wt% of alumina nanoparticles had the lowest wear rate, with the relative wear resistance of 3.13.

Tribological behavior of self lubricating Cu/MoS_2 composites fabricated by powder metallurgy

The effects of MoS2 content on microstructure, density, hardness and wear resistance of pure copper were studied. Copper-based composites containing 0-10%（mass fraction） MoS2 particles were fabricated by mechanical milling and hot pressing from pure copper and MoS2 powders. Wear resistance was evaluated in dry sliding condition using a pin on disk configuration at a constant sliding speed of 0.2 m/s. Hardness measurements showed a critical MoS2 content of 2.5% at which a hardness peak was attained. Regardless of the applied normal load, the lowest coefficient of friction and wear loss were attained for Cu/2.5 MoS2 composite. While coefficient of friction decreased when the applied normal load was raised from 1 to 4 N at any reinforcement content, the wear volume increased with increasing normal load. SEM micrographs from the worn surfaces and debris revealed that the wear mechanism was changed from mainly adhesion in pure copper to a combination of abrasion and delamination in Cu/MoS2 composites.

Thermal expansion behavior of a β-LiAlSiO_4/Cu composite

A copper matrix composite reinforced by β-LiAlSiO4 with negative thermal expansion coefficient was fabricated using vacuum hot-pressed sintering technique. The thermal expansion behavior of the composite was investigated, and the average residual stress in the matrix was analyzed by a simple model. The results indicate that the residual stress in the matrix affects the thermal expansion properties. After heat treatment, the coefficient of thermal expansion （CTE） of the composite decreases greatly. The CTE of the composite after thermal cycling between 50-350°C is the lowest.

Microstructural characterization and dry sliding wear behavior of spark plasma sintered Cu-YSZ composites

In the present study, yttria stabilized zirconia （YSZ） reinforced Cu matrix composite specimens were produced by spark plasma sintering （SPS）. For comparison, pure Cu specimen was also produced in the same conditions. The effect of particles content on microstructure, relative density, electrical conductivity, and Vickers hardness was evaluated. The pin-on-disk test was also performed to determine dry sliding wear behavior of specimens under different wear conditions. After sliding wear tests, the worn surfaces were examined by field emission scanning electron microscopy （FE-SEM）. Microstructural study showed satisfactory distribution of reinforcement particles in copper matrix. The relative density up to 95%was obtained for all specimens. By increasing YSZ content from 0 to 5% （volume fraction）, the electrical conductivity of specimens decreased from 99.2%IACS to 65%IACS, correspondingly. The hardness of Cu-5%YSZ composite specimen was two times greater than that of pure copper. The volume loss and wear rate of pure Cu specimen were 1.48 mm^3 and 1.5±10^-3 mm^3/m under 50 N applied load and 1000 m sliding distance. However, for composite containing 5% YSZ particles, these values dropped to 0.97 mm^3 and 0.9±10^-3 mm^3/m, respectively. Moreover, the friction coefficient of specimens was changed from 0.6 to 0.4. The worn surface and debris observation indicate local plastic deformation and delamination as dominant wear mechanisms for pure copper, while oxidation and ploughing for composite specimen. Accordingly, it can be concluded that the Cu-YSZ composite could be a good candidate for the electrical contact applications in relays, contactors, switches and circuit breakers requiring good electrical and thermal conductivity and capability to resist wearing.

Effect of reinforcement content on the adhesive wear behavior of Cu10Sn5Ni/Si3N4 composites produced by stir casting

The main objective of this paper was to fabricate CuSnNi alloy and its composites reinforced with various contents of SiNparticles(5wt%, 10wt%, and 15wt%) and to investigate their dry sliding wear behavior using a pin-on-disk tribometer. Microstructural examinations of the specimens revealed a uniform dispersion of SiNparticles in the copper matrix. Wear experiments were performed for all combinations of parameters, such as load(10, 20, and 30 N), sliding distance(500, 1000, and 1500 m), and sliding velocity(1, 2, and 3 m/s), for the alloy and the composites. The results revealed that wear rate increased with increasing load and increasing sliding distance, whereas the wear rate decreased and then increased with increasing sliding velocity. The primary wear mechanism encountered at low loads was mild adhesive wear, whereas that at high loads was severe delamination wear. An oxide layer was formed at low velocities, whereas a combination of shear and plastic deformation occurred at high velocities. The mechanism at short sliding distances was ploughing action of SiNparticles, which act as protrusions; by contrast, at long sliding distances, direct metal–metal contact occurred. Among the investigated samples, the Cu/10wt% SiNcomposite exhibited the best wear resistance at a load of 10 N, a velocity of 2 m/s, and a sliding distance of 500 m.

Microstructure and Mechanical Performance of Cu-SnO_2-rGO based Composites Prepared by Plasma Activated Sintering

A novel chemical technique combined with unique plasma activated sintering（PAS） was utilized to prepare consolidated copper matrix composites（CMCs） by adding Cu-SnO2-rGO layered micro powders as reinforced fillers into Cu matrix. The repeating Cu-SnO2-rGO structure was composed of inner dispersed reduced graphene oxide（r GO）, SnO2 as intermedia and outer Cu coating. SnO2 was introduced to the surface of rGO sheets in order to prevent the graphene aggregation with SnO2 serving as spacer and to provide enough active sites for subsequent Cu deposition. This process can guarantee rGO sheets to suffi ciently disperse and Cu nanoparticles to tightly and uniformly anchor on each layer of rGO by means of the SnO2 active sites as well as strictly control the reduction speed of Cu^2＋. The complete cover of Cu nanoparticles on rGO sheets thoroughly avoids direct contact among rGO layers. Hence, the repeating structure can simultaneously solve the wettability problem between rGO and Cu matrix as well as improve the bonding strength between rGO and Cu matrix at the well-bonded Cu-SnO2-rGO interface. The isolated rGO can effectively hinder the glide of dislocation at Cu-rGO interface and support the applied loads. Finally, the compressive strength of CMCs was enhanced when the strengthening effi ciency reached up to 41.

Effect of tungsten carbide particles on microstructure and mechanical properties of Cu alloy composite bit matrix

Copper alloy composite bit matrix was prepared by pressureless vacuum infiltration,using at least one of the three kinds of tungsten carbide particles,for example,irregular cast tungsten carbide,monocrystalline tungsten carbide and sintered reduced tungsten carbide particles.The effects of powder particle morphology,particle size and mass fraction of tungsten carbide on the microstructure and mechanical properties of copper alloy composite were investigated by means of scanning electron microscopy,X-ray diffraction and abrasive wear test in detail.The results show that tungsten carbide morphology and particle size have obvious effects on the mechanical properties of copper alloy composites.Cast tungsten carbide partially dissolved in the copper alloy binding phase,and layers of Cu_(0.3)W_(0.5)Ni_(0.1)Mn_(0.1)C phase with a thickness of around 8–15μm were formed on the edge of the cast tungsten carbide.When 45%irregular crushed fine cast tungsten carbide and 15%monocrystalline cast tungsten carbide were used as the skeleton,satisfactory comprehensive performance of the reinforced copper alloy composite bit matrix was obtained,with the bending strength,impact toughness and hardness reaching 1048 MPa,4.95 J/cm^(2) and 43.6 HRC,respectively.The main wear mechanism was that the tungsten carbide particles firstly protruded from the friction surface after the copper alloy matrix was worn,and then peeled off from the matrix when further wear occurred.

Effect of sintering on the relative density of Cr-coated diamond/Cu composites prepared by spark plasma sintering

Cr-coated diamond/Cu composites were prepared by spark plasma sintering. The effects of sintering pressure, sintering temperature, sintering duration, and Cu powder particle size on the relative density and thermal conductivity of the composites were investigated in this paper. The influence of these parameters on the properties and microstructures of the composites was also discussed. The results show that the relative density of Cr-coated diamond/Cu reaches ~100% when the composite is gradually compressed to 30 MPa during the heating process. The densification temperature increases from 880 to 915℃ when the diamond content is increased from 45vol% to 60vol%. The densification temperature does not increase further when the content reaches 65vol%. Cu powder particles in larger size are beneficial for increasing the relative density of the composite.

Characteristics of alumina particles in dispersion-strengthened copper alloys

Two types of alumina dispersion-strengthened copper（ADSC） alloys were fabricated by a novel in-situ reactive synthesis（IRS） and a traditional internal oxidation（IO） process. The features of alumina dispersoids in these ADSC alloys were investigated by X-ray diffraction, scanning electron microscopy, and high-resolution transmission electron microscopy. It is found that nano-sized γ-Al2O3 particles of approximately 10 nm in diameter are homogeneously distributed in the IRS-ADSC composites. Meanwhile, larger-sized, mixed crystal structure alumina with rod-shaped morphology is embedded in the IO-ADSC alloy. The IRS-ADSC composites can obtain better mechanical and physical properties than the IO-ADSC composites; the tensile strength of the IRS-ADSC alloy can reach 570 MPa at room temperature, its electrical conductivity is 85% IACS, and the Rockwell hardness can reach 86 HRB.

Study of metal-ceramic WC/Cu nano-wear behavior and strengthening mechanism

In view of the inherent poor tribological properties of copper,the reinforcement of copper matrix composites with WC particles presents a promising research area with significant industrial influence.Therefore,in the present study,a molecular dynamics approach is used to simulate the process of repeated friction of diamond grinding balls on WC/Cu composites,and the friction force,friction coefficient,abrasion depth,wear rate,abrasion morphology,von-Mises stress,internal defects,workpiece energy,and performance comparison of different layer thicknesses are systematically investigated in the multiple friction process.It is found that the fluctuation amplitude of friction force,friction coefficient,and abrasion depth are smaller and the fluctuation frequency is larger during the initial friction,whereas near the WC phase,there appears extreme values of the above parameters and the von-Mises stress is highly concentrated while the workpiece energy contonues to increase.In the case of the repeated friction,with the increase of friction times,the friction force,friction coefficient,and abrasion depth fluctuation amplitude increase,the fluctuation frequency decreases,the workpiece energy reaches an extreme value near the WC phase,and a large number of dislocations plug,therefore,the region is strengthened.As the distance between the grinding ball and the WC phase decreases,the more obvious the strengthening effect,the stronger the ability of workpiece to resist the wear will be.

Researches for higher electrical conductivity copper-based materials

Copper and copper-based materials are widely used in power electronics,auto-mobiles,mechanical manufacturing and high-tech manufacturing fields such as aerospace,telecommunications and integrated circuits owing to their compre-hensive advantages in mechanical,electrical conductivity and processing prop-erties.With the rapid development of technology,many emerging technical fields have introduced more challenging requirements for the electrical conductivity of copper.This article reviews the research status of high-conductivity copper-based materials and introduces three methods to improve electrical conductivity,including purification,alloying and addition of nanocarbon materials.We sum-marise the advantages,disadvantages and future development trends of methods for improving copper conductivity.The key to producing high-conductivity copper-based materials is development of low-cost,continuous and stable processes.

Suppressing Al2O3 nanoparticle coarsening and Cu nanograin growth of milled nanostructured Cu-5vol.%Al2O3 composite powder particles by doping with Ti

Both the coarsening of Al2O3 nanoparticles and the growth of Cu nanograins of mechanically milled nanostructured Cu-5 vol.%Al2O3 composites with, and without, trace amounts of Ti during annealing at973 K for 1 h were investigated. It was found that doping with a small amount of Ti（e.g. 0.2 wt%） in a nanostructured Cu-5 vol.%Al2O3 composite effectively suppressed the coarsening of Al2O3 nanoparticles during exposure at this temperature. Further, the Ti addition also prevented the concomitant abnormal growth of the copper grains normally caused by the coarsening of the Al2O3 nanoparticles. Energy dispersive X-ray spectroscopy analysis of the Al2O3 nanoparticles in the annealed Cu-5 vol.%Al2 O3-0.2 wt%Ti sample suggested that the Ti atoms either diffused into the Al2O3 nanoparticles or segregated to the Cu/Al2O3 interfaces to form Ti-doped Al2O3 nanoparticles, which was more stable than Ti-free Al2O3 nanoparticles during annealing at high homologous temperatures.