The role of boric acid in the copper tin alloy bath has been investigated by means of the cathodic polarization curves,cyclic voltammograms,rate of alloy electrodeposition and morphological analysis of deposits.The r...The role of boric acid in the copper tin alloy bath has been investigated by means of the cathodic polarization curves,cyclic voltammograms,rate of alloy electrodeposition and morphological analysis of deposits.The results indicate that the presence of boric acid in weak acidic solution for electrodeposition of Cu Sn alloy raises the overvoltage of hydrogen discharge and lowers the overvoltage of Cu,Sn and Cu Sn alloy deposition on the Pt,and accelerates the rate of depostion.Boric acid was adsorbed on the surface of cathode and inhibited reduction of hydrogen,then the adsorbed boric acid promoted electrodeposition of metals as a catalyzator.However,as the concentration of boric acid is more than 0.50 mol/L,the above effect was weakened due to the complexation reaction between the excessive boric acid and metallic ions.展开更多
Smooth and strong copper foils are highly required for the development of printed circuit boards and Li-ion batteries.Adding additives is an efficient and low-cost method to enhance electrodeposited copper foils.Here ...Smooth and strong copper foils are highly required for the development of printed circuit boards and Li-ion batteries.Adding additives is an efficient and low-cost method to enhance electrodeposited copper foils.Here we chose Bis-(3-sulfopropyl)-disulfide(SPS)as the additive and investigated its concentration on the surface roughness and tensile strength of the electrodeposited copper foils.A copper foil with the smoothest surface(Rz=2.1μm)and the highest tensile strength(~338 MPa)was prepared with1.5 mg/L SPS.The contact angle on the copper foil decreased with the reduction of surface roughness.The enhancing mechanism of the SPS was investigated by scanning electron microscopy and X-ray diffraction.The refined grain and enhanced(220)texture were considered to be the radical reason for the smooth and strong copper foils.The electrochemical results prove the suppressing effect is related to the SPS adsorption.展开更多
文摘The role of boric acid in the copper tin alloy bath has been investigated by means of the cathodic polarization curves,cyclic voltammograms,rate of alloy electrodeposition and morphological analysis of deposits.The results indicate that the presence of boric acid in weak acidic solution for electrodeposition of Cu Sn alloy raises the overvoltage of hydrogen discharge and lowers the overvoltage of Cu,Sn and Cu Sn alloy deposition on the Pt,and accelerates the rate of depostion.Boric acid was adsorbed on the surface of cathode and inhibited reduction of hydrogen,then the adsorbed boric acid promoted electrodeposition of metals as a catalyzator.However,as the concentration of boric acid is more than 0.50 mol/L,the above effect was weakened due to the complexation reaction between the excessive boric acid and metallic ions.
基金the National Key R&D Program of China(No.2017YFB1200800)the National Natural Science Foundation of China(Nos.51827810 and 51637009)the Fundamental Research Funds for the Central Universities(2018XZZX001-05)。
文摘Smooth and strong copper foils are highly required for the development of printed circuit boards and Li-ion batteries.Adding additives is an efficient and low-cost method to enhance electrodeposited copper foils.Here we chose Bis-(3-sulfopropyl)-disulfide(SPS)as the additive and investigated its concentration on the surface roughness and tensile strength of the electrodeposited copper foils.A copper foil with the smoothest surface(Rz=2.1μm)and the highest tensile strength(~338 MPa)was prepared with1.5 mg/L SPS.The contact angle on the copper foil decreased with the reduction of surface roughness.The enhancing mechanism of the SPS was investigated by scanning electron microscopy and X-ray diffraction.The refined grain and enhanced(220)texture were considered to be the radical reason for the smooth and strong copper foils.The electrochemical results prove the suppressing effect is related to the SPS adsorption.
