An actively water-cooled limiter has been designed for the long pulse operation of an HT-7 device, by adopting an integrated structure-doped graphite and a copper alloy heat sink with a super carbon sheet serving as a...An actively water-cooled limiter has been designed for the long pulse operation of an HT-7 device, by adopting an integrated structure-doped graphite and a copper alloy heat sink with a super carbon sheet serving as a compliant layer between them. The behaviors of the integrated structure were evaluated in an electron beam facility under different heat loads and cooling conditions. The surface temperature and bulk temperature distribution were carefully measured by optical pyrometers and thermocouples under a steady state heat flux of 1 to 5 MW/m^2 and a water flow rate of 3 m^3/h, 4.5 m^3/h and 6 m^3/h, respectively. It was found that the surface temperature increased rapidly with the heat flux rising, but decreased only slightly with the water flow rate rising. The surface temperature reached approximately 1200℃ at 5 MW/m^2 of heat flux and 6 m^3/h of water flow. The primary experimental results indicate that the integrated design meets the requirements for the heat expelling capacity of the HT-7 device. A set of numerical simulations was also completed, whose outcome was in good accord with the experimental results.展开更多
Cu-coated powder was fabricated by electroless plating process, and the composition and morphology of coated powder were studied. Moreover, Cu-30, 40, 50 vol.%SiCp heat sink materials were fabricated by hot pressing u...Cu-coated powder was fabricated by electroless plating process, and the composition and morphology of coated powder were studied. Moreover, Cu-30, 40, 50 vol.%SiCp heat sink materials were fabricated by hot pressing using coated and uncoated powder. And the microstructure and thermophysical properties of the heat sink materials were also studied. The results show that SiCp particles distribute uniformly in heat sink materials and the interface between SiCp particles and Cu matrix is clear and well bonded. On the condition of same volume fraction of SiCp, the thermal conductivity of the material using coated powder is larger than that of the material using uncoated powder. Under experiment conditions, the thermal conductivity and coefficient of thermal expansion of Cu-30 vol.%SiCp heat sink material is 236.2 W·m-1·K-1 and 9.9×10-6/K (30-200 ℃) respectively. It provides important reference data for future experiments.展开更多
A high packing density laser diode stack array is developed utilizing Al-free active region laser bars with a broad waveguide and discrete copper microchannel-cooled heatsinks. The microchannel cooling technology lead...A high packing density laser diode stack array is developed utilizing Al-free active region laser bars with a broad waveguide and discrete copper microchannel-cooled heatsinks. The microchannel cooling technology leads to a 10-bar laser diode stack array having the thermal resistance of 0.199 ℃/W, and enables the device to be operated under continuous-wave （CW） condition at an output power of 1200 W. The thickness of the discrete copper heatsink is only 1.5 mm, which results in a high packing density and a small bar pitch of 1.8 mm.展开更多
基于冷喷涂技术,提出了一种替代传统100 W白炽灯的新型12 W LED球泡灯,其散热器由纯铝板裁剪和弯折而成。在分析铜基板内部结构基础上,借助ANSYS软件模拟不同覆铜层厚度和不同形状散热器的球泡灯温度场,获得了具有最低芯片结温的LED球...基于冷喷涂技术,提出了一种替代传统100 W白炽灯的新型12 W LED球泡灯,其散热器由纯铝板裁剪和弯折而成。在分析铜基板内部结构基础上,借助ANSYS软件模拟不同覆铜层厚度和不同形状散热器的球泡灯温度场,获得了具有最低芯片结温的LED球泡灯。研究结果表明,铜基板厚度一定时,芯片结温随覆铜层厚度的增加而降低。选择纯铝质散热器和增加覆铜层厚度可使LED球泡灯的结温降低为71.25℃,低于芯片安全温度85℃,满足散热和照明习惯要求。展开更多
基金The project partially supported by National Natural Science Foundation of China (No. 10275069)
文摘An actively water-cooled limiter has been designed for the long pulse operation of an HT-7 device, by adopting an integrated structure-doped graphite and a copper alloy heat sink with a super carbon sheet serving as a compliant layer between them. The behaviors of the integrated structure were evaluated in an electron beam facility under different heat loads and cooling conditions. The surface temperature and bulk temperature distribution were carefully measured by optical pyrometers and thermocouples under a steady state heat flux of 1 to 5 MW/m^2 and a water flow rate of 3 m^3/h, 4.5 m^3/h and 6 m^3/h, respectively. It was found that the surface temperature increased rapidly with the heat flux rising, but decreased only slightly with the water flow rate rising. The surface temperature reached approximately 1200℃ at 5 MW/m^2 of heat flux and 6 m^3/h of water flow. The primary experimental results indicate that the integrated design meets the requirements for the heat expelling capacity of the HT-7 device. A set of numerical simulations was also completed, whose outcome was in good accord with the experimental results.
文摘Cu-coated powder was fabricated by electroless plating process, and the composition and morphology of coated powder were studied. Moreover, Cu-30, 40, 50 vol.%SiCp heat sink materials were fabricated by hot pressing using coated and uncoated powder. And the microstructure and thermophysical properties of the heat sink materials were also studied. The results show that SiCp particles distribute uniformly in heat sink materials and the interface between SiCp particles and Cu matrix is clear and well bonded. On the condition of same volume fraction of SiCp, the thermal conductivity of the material using coated powder is larger than that of the material using uncoated powder. Under experiment conditions, the thermal conductivity and coefficient of thermal expansion of Cu-30 vol.%SiCp heat sink material is 236.2 W·m-1·K-1 and 9.9×10-6/K (30-200 ℃) respectively. It provides important reference data for future experiments.
文摘A high packing density laser diode stack array is developed utilizing Al-free active region laser bars with a broad waveguide and discrete copper microchannel-cooled heatsinks. The microchannel cooling technology leads to a 10-bar laser diode stack array having the thermal resistance of 0.199 ℃/W, and enables the device to be operated under continuous-wave （CW） condition at an output power of 1200 W. The thickness of the discrete copper heatsink is only 1.5 mm, which results in a high packing density and a small bar pitch of 1.8 mm.
文摘基于冷喷涂技术,提出了一种替代传统100 W白炽灯的新型12 W LED球泡灯,其散热器由纯铝板裁剪和弯折而成。在分析铜基板内部结构基础上,借助ANSYS软件模拟不同覆铜层厚度和不同形状散热器的球泡灯温度场,获得了具有最低芯片结温的LED球泡灯。研究结果表明,铜基板厚度一定时,芯片结温随覆铜层厚度的增加而降低。选择纯铝质散热器和增加覆铜层厚度可使LED球泡灯的结温降低为71.25℃,低于芯片安全温度85℃,满足散热和照明习惯要求。
文摘利用定向凝固制备圆柱形气孔规则排列的藕状多孔铜热沉,通过实验和Flow simulation数值模拟系统研究了藕状多孔铜热沉的散热性能。结果表明,多孔铜热沉不仅具有很强的换热能力,可以满足大功率电子元器件的散热;同时,采用水为冷却介质,将具有不同孔径的藕状多孔铜沿孔长方向按孔径梯度排列成组合热沉,可以显著降低多孔铜热沉的温差,并且降低进出口压降。当体积流量为80 m L/s,孔径梯度为0.1 mm,与一体多孔铜热沉相比,4段拼接多孔铜热沉的温差降低55%,压降减小50%,换热系数基本保持不变。
