Copper porous materials have been manufactured by the method of powder metallurgy.Electrolytic copper powders and atomized copper powders are used as matrix material.Methylcellulose and paraffin are used as porogen.Th...Copper porous materials have been manufactured by the method of powder metallurgy.Electrolytic copper powders and atomized copper powders are used as matrix material.Methylcellulose and paraffin are used as porogen.The influence of porogen type and copper powder morphology on the property of copper porous materials is investigated as well.The results show that copper porous materials with paraffin as porogen have lower porosity and permeability compared with materials using methylcellulose as porogen,due to the different pore-forming mechanisms.The pore forming mechanism of methylcellulose is thermal decomposition,while the pore forming mechanism of paraffin is melting–evaporation.The morphology of copper powders affects the contact state between adjacent powders,which further influence the sintering shrinkage.The porous materials using arborescent copper powders as matrix have lower porosity,smaller pore size and lower permeability,compared with materials with atomized copper powders as matrix.展开更多
Pressure-assisted sinter bonding was performed in air at 250−350℃ using a preform comprising copper formate particles to form a bondline that is sustainable at high temperatures.H2 and CO generated concurrently by th...Pressure-assisted sinter bonding was performed in air at 250−350℃ using a preform comprising copper formate particles to form a bondline that is sustainable at high temperatures.H2 and CO generated concurrently by the pyrolysis of copper formate at 210℃ during the sinter bonding removed the native oxide and other oxides grown on bulk Cu finishes,enabling interface bonding.Moreover,Cu produced in situ by the reduction of Cu(II)accelerated the sinter bonding.Consequently,the bonding achieved at 300−350℃ under 5 MPa exhibited sufficient shear strength of 20.0−31.5 MPa after 180−300 min of sinter bonding.In addition,an increase in pressure to 10 MPa resulted in shear strength of 21.9 MPa after an extremely short time of 30 s at 250℃,and a near-full-density bondline was achieved after 300 s.The obtained results indicate the promising potential of the preform comprising copper formate particles for high-speed sinter bonding.展开更多
W/Cu functionally gradient material (FGM) has excellent mechanical properties since it can effectively relax interlayer thermal stresses caused by the mismatch between their thermal expansion coefficients. W/Cu FGM co...W/Cu functionally gradient material (FGM) has excellent mechanical properties since it can effectively relax interlayer thermal stresses caused by the mismatch between their thermal expansion coefficients. W/Cu FGM combines the advantages of tungsten such as high melting point and service strength, with heat conductivity and plasticity of copper at room temperature. Thus it demonstrates satisfactory heat corrosion and thermal shock resistance and will be a promising candidate as divertor component in thermonuclear device. Owing to the dramatic difference of melting point between tungsten and copper, conventional processes meet great difficulties in fabricating this kind of FGMs. A new approach termed graded sintering under ultra-high pressure (GSUHP) is proposed, with which a near 96% relative density of W/Cu FGM that contains a full distribution spectrum (0-100%W) has been successfully fabricated. Suitable amount of transition metals (such as nickel, zirconium, vanadium) is employed as additives to activate tungsten's sintering, enhance phase wettability and bonding strength between W and Cu. Densification effects of different layer of FGM were investigated. Microstructure morphology and interface elements distribution were observed and analyzed. The thermal shock performance of W/Cu FGM was also preliminarily tested.展开更多
基金Project(2015DFR50580)supported by International S&T Cooperation Program of ChinaProject(51505503)supported by the National Natural Science Foundation of China
文摘Copper porous materials have been manufactured by the method of powder metallurgy.Electrolytic copper powders and atomized copper powders are used as matrix material.Methylcellulose and paraffin are used as porogen.The influence of porogen type and copper powder morphology on the property of copper porous materials is investigated as well.The results show that copper porous materials with paraffin as porogen have lower porosity and permeability compared with materials using methylcellulose as porogen,due to the different pore-forming mechanisms.The pore forming mechanism of methylcellulose is thermal decomposition,while the pore forming mechanism of paraffin is melting–evaporation.The morphology of copper powders affects the contact state between adjacent powders,which further influence the sintering shrinkage.The porous materials using arborescent copper powders as matrix have lower porosity,smaller pore size and lower permeability,compared with materials with atomized copper powders as matrix.
基金supported by the Materials&Components Technology Development Program(10080187)funded by the Ministry of Trade,Industry&Energy(MI,Korea)。
文摘Pressure-assisted sinter bonding was performed in air at 250−350℃ using a preform comprising copper formate particles to form a bondline that is sustainable at high temperatures.H2 and CO generated concurrently by the pyrolysis of copper formate at 210℃ during the sinter bonding removed the native oxide and other oxides grown on bulk Cu finishes,enabling interface bonding.Moreover,Cu produced in situ by the reduction of Cu(II)accelerated the sinter bonding.Consequently,the bonding achieved at 300−350℃ under 5 MPa exhibited sufficient shear strength of 20.0−31.5 MPa after 180−300 min of sinter bonding.In addition,an increase in pressure to 10 MPa resulted in shear strength of 21.9 MPa after an extremely short time of 30 s at 250℃,and a near-full-density bondline was achieved after 300 s.The obtained results indicate the promising potential of the preform comprising copper formate particles for high-speed sinter bonding.
基金China National Committee of High Technology New Materials under grant No.863-715-011-0230.]
文摘W/Cu functionally gradient material (FGM) has excellent mechanical properties since it can effectively relax interlayer thermal stresses caused by the mismatch between their thermal expansion coefficients. W/Cu FGM combines the advantages of tungsten such as high melting point and service strength, with heat conductivity and plasticity of copper at room temperature. Thus it demonstrates satisfactory heat corrosion and thermal shock resistance and will be a promising candidate as divertor component in thermonuclear device. Owing to the dramatic difference of melting point between tungsten and copper, conventional processes meet great difficulties in fabricating this kind of FGMs. A new approach termed graded sintering under ultra-high pressure (GSUHP) is proposed, with which a near 96% relative density of W/Cu FGM that contains a full distribution spectrum (0-100%W) has been successfully fabricated. Suitable amount of transition metals (such as nickel, zirconium, vanadium) is employed as additives to activate tungsten's sintering, enhance phase wettability and bonding strength between W and Cu. Densification effects of different layer of FGM were investigated. Microstructure morphology and interface elements distribution were observed and analyzed. The thermal shock performance of W/Cu FGM was also preliminarily tested.
