Applications of Enzyme-simulating Copper Complex Catalyst in Low-temperature Scouring/Bleaching of Cotton Knits

An enzyme-stimulating catalyst( PTL) with copper ions( Cu^(2+)) as the activation center and aminophosphonate as ligand was developed and applied in low-temperature scouring/bleaching of cotton knits. The optimal weight ratio of Cu^(2+) to aminophosphonate was 1 ∶75. Via orthodox and single-factor experiments,the most efficient formula for low-temperature scouring/bleaching was composed of 0. 4 g/L high-efficiency degreaser DM-1130,1. 5 g/L PTL,2. 0 g/L sodium hydroxide( NaOH),and 7. 0 g/L 30% hydrogen peroxide( H_2O_2). The PTL could not only increase the whiteness of cotton knits,but also remove pectin to enhance capillary effect.

Simulating experiment on the hydrothermal superimposing metallogenesis of the Dongguashan strata-bound copper deposit

Series of sedimentary hydrothermal-diplogenetic copper deposits have been found scattering in the region along the middle-lower reaches of the Yangtze River, and their metallogenetic mechanism is still in hot debate. In order to reveal the ore-forming kinetics of sedimentary process and hydrothermal superimposition, and evaluate the role of sedimentary pyrite in the enrichment and precipitation of copper, a set of simulating experiments on the reaction between pyrite and CuCl2 solution were conducted. According to the physicochemical characteristics of the ore-forming fluid of the Dongguashan copper deposit, Anhui Province, 100 MPa was selected as the experimental pressure, and the experimental temperatures were set at 450, 350, 250 and 150°C, respectively. The reactions between pyrite grains isolated from the Shimenkou strata-bound pyrite deposit and the solution with 0.2 mol/L CuCl2 and 1.0 mol/L NaCl were experimentally simulated. Then, variations in surface topography and surface chemistry of the experimental pyrite grains were documented using scanning electronic microscopy (SEM), atomic force microscopy (AFM), Auger electron spectrometry (AES) and X-ray photoelectron spectroscopy (XPS), and the solution and newly formed minerals were analyzed using inductively coupled plasma (ICP-AES) and X-ray diffraction (XRD) techniques. Desulphurization of pyrite surface was observed and new copper minerals were detected. It is proposed that pyrite can act as a geochemical barrier for the enrichment and precipitation of copper from the solution under the experimental conditions. Furthermore, the ore-forming mechanism of sedimentary hydrothermal-diplogenetic copper deposits was discussed.

Furnace structure analysis for copper flash continuous smelting based on numerical simulation

According to the innate characteristic of four types of furnace, the copper flash continuous smelting （CFCS） furnace can be considered a synthetic reactor of two relatively independent processes： flash matte smelting process （FMSP） and copper continuous converting process （CCCP）. Then, the CFCS thermodynamic model was proposed by establishing the multi-phase equilibrium model of FMSP and the local-equilibrium model of CCCP, respectively, and by combining them through the smelting intermediates. Subsequently, the influences of the furnace structures were investigated using the model on the formation of blister copper, the Fe3O4 behavior, the copper loss in slag and the copper recovery rate. The results show that the type D furnace, with double flues and a slag partition wall, is an ideal CFCS reactor compared with the other three types furnaces. For CFCS, it is effective to design a partition wall in the furnace to make FMSP and CCCP perform in two relatively independent zones, respectively, and to make smelting gas and converting gas discharge from respective flues.

Atomistic simulation of thermal effects and defect structures during nanomachining of copper

Molecular dynamics （MD） simulations of monocrystalline copper （100） surface during nanomachining process were performed based on a new 3D simulation model. The material removal mechanism and system temperature distribution were discussed. The simulation results indicate that the system temperature distribution presents a roughly concentric shape, a steep temperature gradient is observed in diamond cutting tool, and the highest temperature is located in chip. Centrosymmetry parameter method was used to monitor defect structures. Dislocations and vacancies are the two principal types of defect structures. Residual defect structures impose a major change on the workpiece physical properties and machined surface quality. The defect structures in workpiece are temperature dependent. As the temperature increases, the dislocations are mainly mediated from the workpiece surface, while the others are dissociated into point defects. The relatively high cutting speed used in nanomachining results in less defect structures, beneficial to obtain highly machined surface quality.

Numerical simulation on size effect of copper with nano-scale twins

To understand the tensile deformation of electro-deposited Cu with nano-scale twins, a numerical study was carried out based on a conventional theory of mechanism-based strain gradient plasticity （CMSG）. The concept of twin lamella strengthening zone was used in terms of the cohesive interface model to simulate grain-boundary sliding and separation. The model included a number of material parameters, such as grain size, elastic modulus, plastic strain hardening exponent, initial yield stress, as well as twin lamellar distribution, which may contribute to size effects of twin layers in Cu polycrystalline. The results provide information to understand the mechanical behaviors of Cu with nano-scale growth twins.

COMPUTER MODEL OF COPPER SMELTING PROCESS AND DISTRIBUTION BEHAVIORS OF ACCESSORY ELEMENTS

A computer model has been developed to simulate the distribution behaviors of Ni, Co. Sn. Ph,Zn, As, Sb, Bi, An and Ag in copper smelting process. The model assumes that the copper smelting furnaceis in thermodynamic equilibrium. As many as 21 elements (Cu. S, Fe. Ni, Co. Sn, As, Sb. Bi, Ph. Zn.An. Ag. O, N, C, H, Ca, Mg, Al, and St) and 73 compounds are considered. This model accounts forphysical entrainment in the melts. The predictions by the present computer model are compared with theknown commercial data from Guixi Smelter in China, Home Smelter in Canada and Naoshima Smelter inJapan. The agreements between the computer predictions and the commercial data are excellent, so that thepresent computer model can be used to monitor and optimize the actual industrial operations of copper smelting. It is applicable to simulation of almost all copper pyrometallurgical processes.

Numerical simulation analysis of Guixi copper flash smelting furnace

A numerical simulation analysis for reactions of chalcopyrite and pyriteparticles coupled with momentum, heat and mass transfer between the particle and gas in a flashsmelting furnace is presented. In the simulation, the equations governing the gas flow are solvednumerically by Eular method. The particle phase is introduced into the gas flow by theparti-cle-source-in-cell technique (PSIC). Predictions including the fluid flow field, temperaturefield, concentration field of gas phase and the tracks of particles have been obtained by thenumerical simulation. The visualized results show that the reaction of sulfide particles is almostcompleted in the upper zone of the shaft within 1.5 m far from the central jet distributor (CJD)type concentrate burner. The simulation results are in good agreement with data obtained from aseries of experiments and tests in the plant and the error is less than 2%.

Numerical simulation of temperature field in horizontal core-filling continuous casting for copper cladding aluminum rods

The steady-state temperature field of horizontal core-filling continuous casting （HCFC） for producing copper cladding aluminum rods was simulated by finite element method to investigate the effects of key processing parameters on the positions of solid-liquid interfaces （SLIs） of copper and aluminum. It is found that mandrel tube length and mean withdrawing speed have significant effects on the SLI positions of both copper and aluminum. Aluminum casting temperature （TAI） （1003-1123 K） and secondary cooling water flux （600-900 L.h-1） have little effect on the SLI of copper but cause the SLI of aluminum to move 2-4 mm. When TA1 is in a range of 1043-1123 K, the liquid aluminum can fill continuously into the pre-solidified copper tube. Based on the numerical simulation, reasonable processing parameters were determined.

Multiscale simulation of nanometric cutting of single crystal copper——effect of different cutting speeds

A multiscale simulation has been performed to determine the effect of the cutting speed on the deformation mechanism and cutting forces in nanometric cutting of single crystal copper. The multiscale simulation model, which links the finite element method and the molecular dynamics method, captures the atomistic mechanisms during nanometric cutting from the free surface without the computational cost of full atomistic simulations. Simulation results show the material deformation mechanism of single crystal copper greatly changes when the cutting speed exceeds the material static propagation speed of plastic wave. At such a high cutting speed, the average magnitudes of tangential and normal forces increase rapidly. In addition, the variation of strain energy of work material atoms in different cutting speeds is investigated.

Numerical modeling of Jinlong CJD burner copper flash smelting furnace

Fluid flow, heat transfer and combustion in Jinlong CJD concentrate burnerflash smelting furnace have been investigated by numerical modeling and flow visualization. Themodeling is based on the Eulerian approach for the gas flow equations and the Lagrangian approachfor the particles. Interaction between the gas phase and particle phase, such as frictional forces,heat and mass transfer, are included by the addition of sources and sinks. The modeling resultsincluding the fluid flow field, temperature field, concentration field of gas phase and thetrajectories of particles have been obtained. The predicted results are in good agreement with thedata obtained from a series of experiments and tests in the Jinlong Copper Smelter and thetemperature error is less than 20 K.

Synthesis of novel silica-supported chelating resin containing tert-butyl 2-picolyamino-N-acetate and its properties for selective adsorption of copper from simulated nickel electrolyte

A novel silica-supported tert-butyl 2-picolyamino-N-acetate chelating resin (Si-AMPY-1) was successfully synthesized and characterized by elemental analysis, FT-IR, SEM and 13 C CP/MAS NMR. The adsorption behaviors of the Si-AMPY-1 resin for Cu(Ⅱ) and Ni(Ⅱ) were studied with batch and column methods. The batch experiments indicated that the Si-AMPY-1 resin adsorbed Ni(Ⅱ) mainly via physisorption, while adsorbed Cu(II) via chemisorption. The column dynamic breakthrough curves revealed thatthe Si-AMPY-1 resin can efficiently separate Cu(Ⅱ) from the simulated nickel electrolyte before the breakthrough point. Moreover, the concentration of Cu(Ⅱ) in the column effluent was decreased to be less than 3 mg/L within the first 43 BV (bed volumes), and the mass ratio of Cu/Ni was 21:1 in the saturated resin, which completely satisfied the industrial requirements of the nickel electrorefining process. Therefore, it was concluded that the Si-AMPY-1 resin can be a promising candidate for the deep removal of Cu(Ⅱ) from the nickel electrolyte.

SIMULATIONS OF MECHANICAL BEHAVIOR OF POLYCRYSTALLINE COPPER WITH NANO-TWINS

Mechanical behavior and microstructure evolution of polycrystalline copper with nano-twins were investigated in the present work by finite element simulations. The fracture of grain boundaries are described by a cohesive interface constitutive model based on the strain gradient plasticity theory. A systematic study of the strength and ductility for different grain sizes and twin lamellae distributions is performed. The results show that the material strength and ductility strongly depend on the grain size and the distribution of twin lamellae microstructures in the polycrystalline copper.

Deformation behavior of dispersion-strengthened copper at high temperature

The deformation behavior of dispersion-strengthened copper with different compositions was investigated by hot compression simulation tests on a Gleeble-1500 thermal-mechanical simulator. The microstructure during deformation at high temperature was also studied. The result shows that at the beginning of hot compression simulation, the flowing stress of the dispersion-strengthened copper quickly attains a peak value and the stress shows a greater decrease when the temperature is higher and the strain rate is lower. The dispersion particles lead to an obvious increase in the recrystallization temperature. Under experimental conditions, dynamic recovery is the main softening method. The constitutive equation at high temperature of 1.2%Al2O3-0.4%WC/Cu is obtained.

Fabrication of Super Hydrophobic Surfaces on Copper by Solution-immersion

Super hydrophobic copper wafer was prepared by means of solution immersion and surface self-assembly methods. Different immersion conditions were explored for the best hydrophobic surface. Scanning electron microscopy (SEM), X-ray diffraction (XRD), energy dispersive spectrometer (EDS) and water contact angle measurements were used to investigate the morphologies, microstructures, chemical compositions and hydrophobicity of the produced films on copper substrates, respectively. Results show that the super hydrophobic surface is composed of micro structure of Cu 7 S 4 . The films present a high water contact angle larger than 150°, a low sliding angle less than 3°, good abrasion resistance and storage stability. The molecular dynamics simulation confirms that N-dodecyl mercaptan molecules link up with Cu 7 S 4 admirably, compared with Cu, which contributes to the stable super hydrophobic surface.

Work hardening of adhesively bonded pure copper single lap joints

To explain the reason why work hardening occurs in epoxy adhesive bonded zone of pure copper adherends after tensile shear strength testing, an elasto-plastic finite element model was established to analyze the effect of different adherends thickness of 2mm and 4mm on the shear strength as well as the level of work hardening in copper adherends of single lap joint. The numerical simulation results show that the axial or equivalent stress overrun the yield strength of the pure copper adherend is the main reason why the work hardening occurs on the bonded zone of the adherends after the shear strength testing. The elasto-plastic finite element simulation results are agreed with the experimental ones. The thicker its adherends are, the more serious the work hardening is.

Fixed-bed column study for deep removal of copper(Ⅱ) from simulated cobalt electrolyte using polystyrene-supported 2-aminomethylpyridine chelating resin

This study presents the deep removal of copper (Ⅱ) from the simulated cobalt electrolyte using fabricated polystyrene-supported 2-aminomethylpyridine chelating resin (PS-AMP) in a fixed-bed.The effects of bed height (7.0–14.0 cm),feed flow rate (4.5–9.0 mL/min),initial copper (Ⅱ) concentration of the feed (250–1000 mg/L),feed temperature (25–40 ℃) and the value of pH (2.0–4.0) on the adsorption process of the PS-AMP resin were investigated.The experimental data showed that the PS-AMP resin can deeply eliminate copper (Ⅱ) from the simulated cobalt electrolyte.The bed height,feed flow rate,initial copper (Ⅱ) concentration of the feed,feed temperature and feed pH value which corresponded to the highest removal of copper (Ⅱ) were 7.0 cm with 35 mm of the column diameter,4.5 mL/min,40℃,1000 mg/L and 4.0,respectively.The breakthrough capacity,the saturated capacity of the column and the mass ratio of Cu/Co (g/g) in the saturated resin were correspondingly 16.51 mg/g dry resin,61.72 mg/g dry resin and 37.67 under the optimal experimental conditions.The copper (Ⅱ) breakthrough curves were fitted by the empirical models of Thomas,Yoon-Nelson and Adam-Bohart,respectively.The Thomas model was found to be the most suitable one for predicting how the concentration of copper (Ⅱ) in the effluent changes with the adsorption time.

Integrated Behavior of Carbon and Copper Alloy Heat Sink Under Different Heat Loads and Cooling Conditions

An actively water-cooled limiter has been designed for the long pulse operation of an HT-7 device, by adopting an integrated structure-doped graphite and a copper alloy heat sink with a super carbon sheet serving as a compliant layer between them. The behaviors of the integrated structure were evaluated in an electron beam facility under different heat loads and cooling conditions. The surface temperature and bulk temperature distribution were carefully measured by optical pyrometers and thermocouples under a steady state heat flux of 1 to 5 MW/m^2 and a water flow rate of 3 m^3/h, 4.5 m^3/h and 6 m^3/h, respectively. It was found that the surface temperature increased rapidly with the heat flux rising, but decreased only slightly with the water flow rate rising. The surface temperature reached approximately 1200℃ at 5 MW/m^2 of heat flux and 6 m^3/h of water flow. The primary experimental results indicate that the integrated design meets the requirements for the heat expelling capacity of the HT-7 device. A set of numerical simulations was also completed, whose outcome was in good accord with the experimental results.

The study of arc behavior with different content of copper vapor in GTAW

In order to understand the effects of different content of copper vapor entering the arc plasma on the arc behavior,the tungstencopper materials with copper contents of 0%,10%,20%and 30%were made into special tungsten electrodes,which replaced the melting electrode to generate copper vapor.The effects of different content of copper vapor on the arc morphology,arc voltage,arc pressure,current density and arc axial temperature were studied.When copper vapor was transported into the arc plasma,the arc consisted of two parts:a high brightness arc core and the surrounding green luminous area.Through the observation and measurement of the stabilized arc,the results showed that as the content of copper vapor increased,the radius of the greenish region gradually increased,the brightness and size of the core area gradually decreased,the axial temperature of the arc gradually decreased and arc voltage gradually increased with a maximum difference of 1.5 V.This is because the increase of copper vapor concentration changes the net emission coefficient,resulting in a decrease in arc temperature and electrical conductivity.The distribution of arc pressure and current density showed unimodal distribution on the anode surface,and as the content of copper vapor increased,the distribution curves were gradually flattening.A factor contributing to this is that with the increase of copper vapor concentration,the current tends to flow through the edge of the electrode,which expands the conductive path and makes the arc disperse.And the coupling mathematical model of tungsten electrode and arc were established to further explain the experimental results.

Influence of Copper Vapor on Low-Voltage Circuit Breaker Arcs During Stationary and Moving States

The influence of copper vapor on the low-voltage circuit breaker arcs is studied. A three-dimensional （3-D） magnetohydrodynamics（MHD） model of arc motion under the effect of external magnetic field is built up. By adopting the commercial computational fluid dynamics （CFD） package FLUENT based on control-volume method, the above MHD model is solved. For the mediums of air-1% Cu and air-10% Cu, the distributions of stationary temperature, pressure, electrical potential and the arc motion processes are compared with those of a pure air arc. The copper vapor diffusion process in the arc chamber and the distribution of copper vapor mass concentration are also simulated. The results shows that the copper vapor has a cooling effect on the arc plasma and can decrease the stationary voltage as well. Moreover, the presence of copper vapor can decelerate the arc motion in the quenching chambers. The maximal copper vapor concentration locates behind the arc root because of the existence of a ＂double vortex＂ near the electrodes.

Physical Simulation for Large-Bore Copper Vapor Laser

On the basis of the electric circuit differential equations and the nonlinear partial differential equations of kinetics,a kinetic model for a series of large-bore copper-vapor lasers is carried out.Through the consistent computational results the radial kinetic parameters such as the stimulating electric Geld and the plasma electron temperature are presented.The factors,which evidently influence the output power and the beam quality of the large-bore copper-vapor laser,are the buffer gas pressure and the charging voltage.