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Thermal stability and separation characteristics of anti-sticking layers of Pt/Cr films for the hot slumping technique 被引量:1
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作者 马爽 闻铭武 王占山 《Chinese Physics C》 SCIE CAS CSCD 2016年第7期168-174,共7页
The thermal stability and separation characteristics of anti-sticking layers of Pt/Cr films are studied in this paper. Several types of adhesion layers were investigated: 10.0 nm Pt, 1.5 nm Cr + 50.0 nm Pt, 2.5 nm ... The thermal stability and separation characteristics of anti-sticking layers of Pt/Cr films are studied in this paper. Several types of adhesion layers were investigated: 10.0 nm Pt, 1.5 nm Cr + 50.0 nm Pt, 2.5 nm Cr + 50.0 nm Pt and 3.5 nm Cr + 50.0 nm Pt fabricated using direct current magnetron sputtering. The variation of layer thickness, roughness, crystallization and surface topography of Pt/Cr films were analyzed by grazing incidence X-ray reflectometry, large angle X-ray diffraction and optical profiler before and after heating. 2.5 nm Cr + 50.0 nm Pt film exhibits the best thermal stability and separation characteristics according to the heating and hot slumping experiments. The film was also applied as an anti-sticking layer to optimize the maximum temperature of the hot slumping technique. 展开更多
关键词 hot slumping technique anti-sticking layers Pt/Cr film thermal stability separation characteristic
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