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The analytical model for crosstalk noise of current-mode signaling in coupled RLC interconnects of VLSI circuits
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作者 Peng Xu Zhongliang Pan 《Journal of Semiconductors》 EI CAS CSCD 2017年第9期74-81,共8页
With the continuous advancement of semiconductor technology, the interconnects crosstalk has had a great influence on the performances of VLSI circuits. To date, most of the research about the interconnects of VLSI ci... With the continuous advancement of semiconductor technology, the interconnects crosstalk has had a great influence on the performances of VLSI circuits. To date, most of the research about the interconnects of VLSI circuits focus on the voltage-mode signaling (VMS) scheme while the current-mode signaling (CMS) scheme is rarely analyzed. First of all, an equivalent circuit model of two-line coupled interconnects is presented in this paper, which is applicable to both the CMS and VMS schemes. The coupling capacitive and mutual inductive are taken into account in the equivalent circuit model. Secondly, the output noise of CMS and VMS schemes are investigated in the paper according to the decoupling technique and A B CD parameter matrix approach at local level, intermediate level and global level, respectively. Moreover, the experimental results show that the CMS interconnects have lesser noise peak, noise width and noise amplitude than the VMS interconnects in the same cases, and the CMS scheme is especially suitable for the global interconnects communication of VLSI circuits. It is found that the results obtained by A B CD parameter matrix approach are in good accordance with the simulation results of the advanced design system. 展开更多
关键词 VLSI circuits interconnects crosstalk noise current-mode signaling decoupling technique A B CD parameter matrix
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FDTD based transition time dependent crosstalk analysis for coupled RLC interconnects 被引量:2
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作者 Devendra Kumar Sharma Brajesh Kumar Kaushik R.K.Sharma 《Journal of Semiconductors》 EI CAS CSCD 2014年第5期69-73,共5页
The performance of high density chips operating in the GHz range is mostly affected by on-chip interconnects. The interconnect delay depends on many factors, a few of them are inputs toggling patterns, line & couplin... The performance of high density chips operating in the GHz range is mostly affected by on-chip interconnects. The interconnect delay depends on many factors, a few of them are inputs toggling patterns, line & coupling parasitics, input rise/fall time and source/load characteristics. The transition time of the input is of prime importance in high speed circuits. This paper addresses the FDTD based analysis of transition time effects on functional and dynamic crosstalk. The analysis is carried out for equal and unequal transition times of coupled inputs. The analysis of the effects of unequal rise time is equally important because practically, it is quite common to have mismatching in the rise time of the signals transmitting through different length wires. To demonstrate the effects, two distributed RLC lines coupled inductively and capacitively are taken into consideration. The FDTD technique is used because it gives accurate results and carries time domain analysis of coupled lines. The number of lumps in SPICE simulations is considered the same as those of spatial segments. To validate the FDTD computed results, SPICE simulations are run and results are compared. A good agreement of the computed results has been observed with respect to SPICE simulated results. An average error of less than 3.2% is observed in the computation of the performance parameters using the proposed method. 展开更多
关键词 FDTD transition time crosstalk noise DELAY coupled interconnects
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