To explore the complex thermal-mechanical-chemical behavior in the solid-liquid cast-roll bonding(SLCRB) of Cu/Al cladding strip, numerical simulations were conducted from both macro and micro scales. In macro-scale, ...To explore the complex thermal-mechanical-chemical behavior in the solid-liquid cast-roll bonding(SLCRB) of Cu/Al cladding strip, numerical simulations were conducted from both macro and micro scales. In macro-scale, with birth and death element method, a thermo-mechanical coupled finite element model(FEM) was set up to explore the temperature and contact pressure distribution at the Cu/Al bonding interface in the SLCRB process. Taking these macro-scale simulation results as boundary conditions, we simulated the atom diffusion law of the bonding interface by molecular dynamics(MD) in micro-scale. The results indicate that the temperature in Cu/Al bonding interface deceases from 700 to 320 ℃ from the entrance to the exit of caster, and the peak of contact pressure reaches up to 140 MPa. The interfacial diffusion thickness depends on temperature and rolling reduction, higher temperature results in larger thickness, and the rolling reduction below kiss point leads to significant elongation deformation of cladding strip which yields more newborn interface with fresh metal and make the diffusion layer thinner. The surface roughness of Cu strip was found to be benefit to atoms diffusion in the Cu/Al bonding interface. Meanwhile, combined with the SEM-EDS observation on the microstructure and composition in the bonding interface of the experimental samples acquired from the castrolling bite, it is revealed that the rolling reduction and severe elongation deformation in the solid-solid contact zone below kiss point guarantee the satisfactory metallurgical bonding with thin and smooth diffusion layer. The bonding mechanisms of reactive diffusion, mechanical interlocking and crack bonding are proved to coexist in the SLCRB process.展开更多
Cu/Al bar clad material was fabricated by a drawing process and a subsequent heat treatment.During these processes,intermetallic compounds have been formed at the interface of Cu/Al and have affected its bonding prope...Cu/Al bar clad material was fabricated by a drawing process and a subsequent heat treatment.During these processes,intermetallic compounds have been formed at the interface of Cu/Al and have affected its bonding property.Microstructures of Cu/Al interfaces were observed by OM,SEM and EDX Analyser in order to investigate the bonding properties of the material.According to the microstructure a series of diffusion layers were observed at the interface and the thicknesses of diffusion layers have increased with aging time as a result of the diffusion bonding.The interfaces were composed of 3-ply diffusion layers and their compositions were changed with aging time at 400 °C.These compositional compounds were revealed to be η2,(θ+η2),(α+θ) intermetallic phases.It is evident from V-notch impact tests that the growth of the brittle diffusion layers with the increasing aging time directly influenced delamination distance between the Cu sleeve and the Al core.It is suggested that the proper holding time at 400 °C for aging as post heat treatment of a drawn Cu/Al bar clad material would be within 1 h.展开更多
In the case of valuable cold-rolled Cu/Al clad plates,billet surface treatment before rolling is a significant process that can affect the bonding efficiency and quality.While the current studies primarily focus on th...In the case of valuable cold-rolled Cu/Al clad plates,billet surface treatment before rolling is a significant process that can affect the bonding efficiency and quality.While the current studies primarily focus on the influence of rolling parameters,insufficient attention has been paid to surface treatment.In this study,the effects of mechanical surface treatment on the bonding mechanism and bonding properties of cold-rolled Cu/Al clad plates were investigated.The results showed that different mechanical surface treatments have significant effects on the surface morphology,roughness,and residual stress.In addition,the effect of surface mechanical treatment on bonding quality was also observed to be critical.When the grinding direction was consistent with the rolling direction(RD),the bonding quality of the Cu/Al clad plates was significantly improved.After surface treatment along the RD for 20 s,the Cu/Al clad plates showed the highest shear strength(78 MPa),approximately four times as high as that of the unpolished samples.Simultaneously,the peel strength of this process was also significantly higher than that achieved via the other processes.Finally,on the basis of the surface morphology,roughness,and residual stress,the effect of surface treatment on the bonding mechanism and bonding properties of Cu/Al clad plates was analyzed.This study proposes a deeper understanding of the bonding behavior and bonding mechanism for cold rolled clad plates processed via mechanical surface treatment.展开更多
The effect of pH value and different kinds of anions on the corrosion behavior of Cu/Al casting-rolled clad plates in the alkaline solution was evaluated by means of scanning electron microscopy(SEM),energy dispersive...The effect of pH value and different kinds of anions on the corrosion behavior of Cu/Al casting-rolled clad plates in the alkaline solution was evaluated by means of scanning electron microscopy(SEM),energy dispersive spectroscopy(EDS),X-ray diffraction(XRD),weight loss analysis,3D confocal laser scanning microscopy(CLSM)and electrochemical test.Results show the corrosion mainly occurs on the aluminum side.The corrosion resistance of the Cu/Al decreases as the pH value increases.When pH≥12,the dissolution of the film layer is faster than the passivation process.The addition of Cl^(-)ions reduces the corrosion resistance of the Cu/Al clad plates,which leads to pitting corrosion.The higher the concentration of Cl^(-)ions,the more prone the pitting to occur.The addition of SO_(4)^(2-)ions causes the denudation of the samples.The corrosion resistance of the Cu/Al is better in the alkaline solution containing NO_(3)^(-)ions than that in the solution containing Cl^(-)ions or SO_(4)^(2-)ions.When adding SO_(4)^(2-),NO^(3)^(-)and Cl^(-)to the pure alkaline solution,the corrosion resistance of the Cu/Al clad plates decreases.展开更多
基金Funded by the General Program of National Natural Science Foundation of China(Nos.51474189 and 51674222)the Excellent Youth Foundation of Hebei Scientific Committee,China(No.E2018203446)the Scientific Research Foundation of the Higher Education Institutions of Hebei Province,China(No.QN2015214)
文摘To explore the complex thermal-mechanical-chemical behavior in the solid-liquid cast-roll bonding(SLCRB) of Cu/Al cladding strip, numerical simulations were conducted from both macro and micro scales. In macro-scale, with birth and death element method, a thermo-mechanical coupled finite element model(FEM) was set up to explore the temperature and contact pressure distribution at the Cu/Al bonding interface in the SLCRB process. Taking these macro-scale simulation results as boundary conditions, we simulated the atom diffusion law of the bonding interface by molecular dynamics(MD) in micro-scale. The results indicate that the temperature in Cu/Al bonding interface deceases from 700 to 320 ℃ from the entrance to the exit of caster, and the peak of contact pressure reaches up to 140 MPa. The interfacial diffusion thickness depends on temperature and rolling reduction, higher temperature results in larger thickness, and the rolling reduction below kiss point leads to significant elongation deformation of cladding strip which yields more newborn interface with fresh metal and make the diffusion layer thinner. The surface roughness of Cu strip was found to be benefit to atoms diffusion in the Cu/Al bonding interface. Meanwhile, combined with the SEM-EDS observation on the microstructure and composition in the bonding interface of the experimental samples acquired from the castrolling bite, it is revealed that the rolling reduction and severe elongation deformation in the solid-solid contact zone below kiss point guarantee the satisfactory metallurgical bonding with thin and smooth diffusion layer. The bonding mechanisms of reactive diffusion, mechanical interlocking and crack bonding are proved to coexist in the SLCRB process.
基金Project supported by the Fundamental Materials Development funded by the Korean Ministry of Knowledge Economy
文摘Cu/Al bar clad material was fabricated by a drawing process and a subsequent heat treatment.During these processes,intermetallic compounds have been formed at the interface of Cu/Al and have affected its bonding property.Microstructures of Cu/Al interfaces were observed by OM,SEM and EDX Analyser in order to investigate the bonding properties of the material.According to the microstructure a series of diffusion layers were observed at the interface and the thicknesses of diffusion layers have increased with aging time as a result of the diffusion bonding.The interfaces were composed of 3-ply diffusion layers and their compositions were changed with aging time at 400 °C.These compositional compounds were revealed to be η2,(θ+η2),(α+θ) intermetallic phases.It is evident from V-notch impact tests that the growth of the brittle diffusion layers with the increasing aging time directly influenced delamination distance between the Cu sleeve and the Al core.It is suggested that the proper holding time at 400 °C for aging as post heat treatment of a drawn Cu/Al bar clad material would be within 1 h.
基金Supported by Major Program of National Natural Science Foundation of China(Grant No.U1710254)National Natural Science Foundation of China(Grant Nos.51904205,51804215)+3 种基金Shanxi Provincial Science and Technology Major Projects of China(Grant No.20181101008)Shanxi Provincial Natural Science Foundation of China(Grant No.201801D221221)China Postdoctoral Science Foundation(Grant No.2018M641681)Taiyuan Municipal Science and Technology Major Projects of China(Grant No.170203).
文摘In the case of valuable cold-rolled Cu/Al clad plates,billet surface treatment before rolling is a significant process that can affect the bonding efficiency and quality.While the current studies primarily focus on the influence of rolling parameters,insufficient attention has been paid to surface treatment.In this study,the effects of mechanical surface treatment on the bonding mechanism and bonding properties of cold-rolled Cu/Al clad plates were investigated.The results showed that different mechanical surface treatments have significant effects on the surface morphology,roughness,and residual stress.In addition,the effect of surface mechanical treatment on bonding quality was also observed to be critical.When the grinding direction was consistent with the rolling direction(RD),the bonding quality of the Cu/Al clad plates was significantly improved.After surface treatment along the RD for 20 s,the Cu/Al clad plates showed the highest shear strength(78 MPa),approximately four times as high as that of the unpolished samples.Simultaneously,the peel strength of this process was also significantly higher than that achieved via the other processes.Finally,on the basis of the surface morphology,roughness,and residual stress,the effect of surface treatment on the bonding mechanism and bonding properties of Cu/Al clad plates was analyzed.This study proposes a deeper understanding of the bonding behavior and bonding mechanism for cold rolled clad plates processed via mechanical surface treatment.
基金financially supported by the National Natural Science Foundation of China(No.52001216)。
文摘The effect of pH value and different kinds of anions on the corrosion behavior of Cu/Al casting-rolled clad plates in the alkaline solution was evaluated by means of scanning electron microscopy(SEM),energy dispersive spectroscopy(EDS),X-ray diffraction(XRD),weight loss analysis,3D confocal laser scanning microscopy(CLSM)and electrochemical test.Results show the corrosion mainly occurs on the aluminum side.The corrosion resistance of the Cu/Al decreases as the pH value increases.When pH≥12,the dissolution of the film layer is faster than the passivation process.The addition of Cl^(-)ions reduces the corrosion resistance of the Cu/Al clad plates,which leads to pitting corrosion.The higher the concentration of Cl^(-)ions,the more prone the pitting to occur.The addition of SO_(4)^(2-)ions causes the denudation of the samples.The corrosion resistance of the Cu/Al is better in the alkaline solution containing NO_(3)^(-)ions than that in the solution containing Cl^(-)ions or SO_(4)^(2-)ions.When adding SO_(4)^(2-),NO^(3)^(-)and Cl^(-)to the pure alkaline solution,the corrosion resistance of the Cu/Al clad plates decreases.
基金Project(51474189)supported by the National Natural Science Foundation of ChinaProject(QN2015214)supported by the Educational Commission of Hebei Province,China
基金Projects(2016YFB0300901,2016YFB0700401) supported by the National Key Research and Development Program of ChinaProjects(106112015CDJXY130003,106112015CDJXZ138803) supported by the Fundamental Research Funds for the Central Universities,China
