Effect of Mechanical Surface Treatment on the Bonding Mechanism and Properties of Cold‑Rolled Cu/Al Clad Plate

In the case of valuable cold-rolled Cu/Al clad plates,billet surface treatment before rolling is a significant process that can affect the bonding efficiency and quality.While the current studies primarily focus on the influence of rolling parameters,insufficient attention has been paid to surface treatment.In this study,the effects of mechanical surface treatment on the bonding mechanism and bonding properties of cold-rolled Cu/Al clad plates were investigated.The results showed that different mechanical surface treatments have significant effects on the surface morphology,roughness,and residual stress.In addition,the effect of surface mechanical treatment on bonding quality was also observed to be critical.When the grinding direction was consistent with the rolling direction(RD),the bonding quality of the Cu/Al clad plates was significantly improved.After surface treatment along the RD for 20 s,the Cu/Al clad plates showed the highest shear strength(78 MPa),approximately four times as high as that of the unpolished samples.Simultaneously,the peel strength of this process was also significantly higher than that achieved via the other processes.Finally,on the basis of the surface morphology,roughness,and residual stress,the effect of surface treatment on the bonding mechanism and bonding properties of Cu/Al clad plates was analyzed.This study proposes a deeper understanding of the bonding behavior and bonding mechanism for cold rolled clad plates processed via mechanical surface treatment.

退火工艺对Cu/Al复层材料界面影响的研究

采用纯铜/纯铝和纯铜/铝合金进行400℃温轧和退火热处理,并对得到的Cu/Al复层材料进行界面结合强度测试、界面金相显微组织分析和界面扫描电镜分析。结果表明:Cu/Al复层材料界面处Cu/Al中间相的形成需要一定的孕育期,其形成过程为:形核→核长大→沿界面横向连片生长→沿界面法线方向纵向生长;纯铜/纯铝复层材料最佳退火工艺为300℃×1 h,最大界面结合强度可达2.4 N/mm;而纯铜/铝合金为300℃×3 h,界面结合强度最大值为3.1 N/mm,保证了材料的成型性能,同时防止金属间化合物的生成;经较高温度的长时退火(500℃×5 h),纯铜/铝合金比纯铜/纯铝复层材料界面更容易形成脆性金属间化合物相,导致界面结合强度的降低,造成界面在剥离条件下的脆性断裂。

Corrosion behavior of Cu/Al casting-rolled clad plates in different alkaline solution

The effect of pH value and different kinds of anions on the corrosion behavior of Cu/Al casting-rolled clad plates in the alkaline solution was evaluated by means of scanning electron microscopy(SEM),energy dispersive spectroscopy(EDS),X-ray diffraction(XRD),weight loss analysis,3D confocal laser scanning microscopy(CLSM)and electrochemical test.Results show the corrosion mainly occurs on the aluminum side.The corrosion resistance of the Cu/Al decreases as the pH value increases.When pH≥12,the dissolution of the film layer is faster than the passivation process.The addition of Cl^(-)ions reduces the corrosion resistance of the Cu/Al clad plates,which leads to pitting corrosion.The higher the concentration of Cl^(-)ions,the more prone the pitting to occur.The addition of SO_(4)^(2-)ions causes the denudation of the samples.The corrosion resistance of the Cu/Al is better in the alkaline solution containing NO_(3)^(-)ions than that in the solution containing Cl^(-)ions or SO_(4)^(2-)ions.When adding SO_(4)^(2-),NO^(3)^(-)and Cl^(-)to the pure alkaline solution,the corrosion resistance of the Cu/Al clad plates decreases.

波纹轧制制备Cu/Al复合板的应力分析及显微组织演变

建立三维有限元模型,并通过50%压下量的轧制试验验证模型的准确性。从时间角度分析整个波纹轧制过程中金属的流动规律。金属经历的变形可以分为两个阶段:填充阶段和压下阶段。填充阶段应力变化较为复杂,而压下阶段应力变化趋势一致。通过罗德参数和应力三轴度分析特征位置的应力状态,在开始变形时为两向拉应力一向压应力。采用EBSD技术分析Cu板的显微组织演变过程。与原始板材相比,铜板各特征位置晶粒均发生细化,而Cu板波谷处晶粒在发生细化后有长大的现象,这是由剧烈塑性变形产生的绝热温升现象造成的。

中间退火对Cu/Al复合板界面结合性能的影响

分别采用两道次轧制过程中中间退火和未中间退火两种工艺制备了Cu/Al复合板,研究了中间退火处理对复合板界面结合性能的影响。研究结果表明,两种工艺条件下制备的复合板界面均牢固结合,但采用中间退火处理工艺更有利于提升轧后Cu/Al复合板的结合强度。其中,采用未中间退火的两道次轧后复合板的剥离强度为28.29 MPa,而采用中间退火工艺的复合板剥离强度则达到了34.05 MPa。这是因为经过中间退火处理后进行二道次轧制制备的复合板界面由冶金结合区和物理结合区共同组成,协同作用强化了界面的结合性能。

电磁场对水平双辊铸轧Ti/Al/Cu复合板界面结合强度的影响

利用水平双辊铸轧技术制备Ti/Al/Cu复合板,通过在铸轧过程中施加脉冲电场和电磁振荡场,研究不同外场对铸轧复合板界面结合强度的影响。结果表明:电磁场对铸轧过程的稳定性没有影响。施加脉冲电场和电磁振荡场后,Ti/Al界面和Cu/Al界面的扩散层厚度增加,界面结合强度显著提高。施加电磁振荡场后,在铸轧区的液穴内产生交变的电磁体积力。在电磁体积力的作用下,铝熔体内部产生震荡效应并对金属带表面进行冲刷,使金属带表面新形成的晶核脱离。此外,震荡效应使得金属带与铝熔体接触处的温度梯度降低,凝固速度减慢从而延长固-液接触时间。这些作用使得熔体在金属带表面铺展湿润更加充分,促进了原子间的互扩散,从而产生了更多的冶金结合区域并增大了冶金结合的强度。

Effect of bonding interface on delamination behavior of drawn Cu/Al bar clad material

Cu/Al bar clad material was fabricated by a drawing process and a subsequent heat treatment.During these processes,intermetallic compounds have been formed at the interface of Cu/Al and have affected its bonding property.Microstructures of Cu/Al interfaces were observed by OM,SEM and EDX Analyser in order to investigate the bonding properties of the material.According to the microstructure a series of diffusion layers were observed at the interface and the thicknesses of diffusion layers have increased with aging time as a result of the diffusion bonding.The interfaces were composed of 3-ply diffusion layers and their compositions were changed with aging time at 400 °C.These compositional compounds were revealed to be η2,(θ+η2),(α+θ) intermetallic phases.It is evident from V-notch impact tests that the growth of the brittle diffusion layers with the increasing aging time directly influenced delamination distance between the Cu sleeve and the Al core.It is suggested that the proper holding time at 400 °C for aging as post heat treatment of a drawn Cu/Al bar clad material would be within 1 h.

Evolution of bonding interface in solid-liquid cast-rolling bonding of Cu/Al clad strip

Cu/Al clad strips are prepared using solid?liquid cast-rolling bonding(SLCRB)technique with a d160mm×150mm twin-roll experimental caster.The extent of interfacial reactions,composition of the reaction products,and their micro-morphology evolution in the SLCRB process are investigated with scanning electron microscope(SEM),energy dispersive spectrometer(EDS),and X-ray diffraction(XRD).In the casting pool,initial aluminized coating is first generated on the copper strip surface,with the diffusion layer mainly consisting ofα(Al)+CuAl2and growing at high temperatures,with the maximum thickness of10μm.After sequent rolling below the kiss point,the diffusion layer is broken by severe elongation,which leads to an additional crack bond process with a fresh interface of virgin base metal.The average thickness is reduced from10to5μm.The reaction products,CuAl2,CuAl,and Cu9Al4,are dispersed along the rolling direction.Peeling and bending test results indicate that the fracture occurs in the aluminum substrate,and the morphology is a dimple pattern.No crack or separation is found at the bonding interface after90°-180°bending.The presented method provides an economical way to fabricate Cu/Al clad strip directly.

浇铸温度对于Cu/Al复合板界面的影响

研究不同浇铸温度下Cu/Al复合板复合界面处化合物层变化及对于剥离强度的影响;确定理想的浇铸温度,得到剥离强度较高的复合界面。结果表明,当熔体压力、铜带厚度、铸轧速度一定时,随着浇铸温度的升高界面处扩散层的厚度逐渐增加,Cu带变形量逐渐降低,界面剥离强度降低。当浇铸温度为700℃时,界面扩散层为2.4μm,界面化合物厚度为0.3μm,剥离强度为36.5N/mm。

Multi-scale Simulation on Bonding Mechanism of Solid-Liquid Cast-Rolling of Cu/Al Cladding Strip based on FEM and MD

To explore the complex thermal-mechanical-chemical behavior in the solid-liquid cast-roll bonding(SLCRB) of Cu/Al cladding strip, numerical simulations were conducted from both macro and micro scales. In macro-scale, with birth and death element method, a thermo-mechanical coupled finite element model(FEM) was set up to explore the temperature and contact pressure distribution at the Cu/Al bonding interface in the SLCRB process. Taking these macro-scale simulation results as boundary conditions, we simulated the atom diffusion law of the bonding interface by molecular dynamics(MD) in micro-scale. The results indicate that the temperature in Cu/Al bonding interface deceases from 700 to 320 ℃ from the entrance to the exit of caster, and the peak of contact pressure reaches up to 140 MPa. The interfacial diffusion thickness depends on temperature and rolling reduction, higher temperature results in larger thickness, and the rolling reduction below kiss point leads to significant elongation deformation of cladding strip which yields more newborn interface with fresh metal and make the diffusion layer thinner. The surface roughness of Cu strip was found to be benefit to atoms diffusion in the Cu/Al bonding interface. Meanwhile, combined with the SEM-EDS observation on the microstructure and composition in the bonding interface of the experimental samples acquired from the castrolling bite, it is revealed that the rolling reduction and severe elongation deformation in the solid-solid contact zone below kiss point guarantee the satisfactory metallurgical bonding with thin and smooth diffusion layer. The bonding mechanisms of reactive diffusion, mechanical interlocking and crack bonding are proved to coexist in the SLCRB process.

Heat transfer analysis and experimental study of unequal diameter twin-roll casting process for fabricating Cu/Al clad strips

Unequal diameter twin-roll casting(UDTRC)can improve the formability,surface conditions,and production efficiency during the fabrication of clad strips.Using Fluent software,a numerical simulation is used to study the asymmetric heat transfer characteristics of Cu/Al clad strips fabricated by UDTRC.The effects of roller velocity ratio,Cu strip thickness,and inclination angle on the kissing point position,as well as the entire temperature distribution are obtained.The heat transfer model is established,and the mechanism is discussed.The Cu strip and rollers are found to be the main causes of asymmetric heat transfer,indicating that the roller velocity ratio changes the liquid zone proportion in the molten pool.The Cu strip thickness determines the heat absorption capacity and the variations in thermal resistance between the molten Al and the big roller.The inclination angle of the small roller changes the cooling time of big roller to molten Al.Moreover,the microstructure of Al cladding under different roller velocity ratios is examined.The results show significant grain refinement caused by the shear strain along the thickness direction of Al cladding and the intense heat transfer at the moment of contact between the metal Al cladding and Cu strip.

Ageing behavior of an Al-Zn-Mg-Cu alloy pre-stretched thick plate

The ageing behavior of a pre-stretched thick plate of Al-Zn-Mg-Cu alloy was systemically studied including one-step ageing, two-step ageing, and retrogression and reageing treatment （RRA）. One-step ageing of the alloy resulted in peak ultimate tensile strengths of 595 and 575 MPa after 22 and 6 h at 120 and 135°C, respectively. The strengthening phase in peak aged （T6 temper） alloy contained GP zones and the η′ phase predominantly. After two-step ageing, the electrical conductivity was increased markedly, but the pre-stretched thick plate sacrificed a great loss of strength. RRA treatment provided a method for maintaining the strength close to that obtained by T6 temper and for obtaining the high electrical conductivity close to that obtained by T7 temper; the ultimate tensile strength and electrical conductivity were 583 MPa and 21.0 MS/m, respectively. TEM analysis of T7 and RRA specimens revealed two types of precipitates that contributed to age strengthening i.e. the η′ and η phases.

Interfacial pressure distribution and bonding characteristics in twin-roll casting of Cu/Al clad strip

The mechanical properties and product thickness specifications of bimetallic clad strip prepared by twin-roll casting are tightly related to the mechanical behavior of bonding interface interaction.The thermal−flow coupled simulation and the interface pressure calculation models are established with the cast-rolling velocity as the variable.The results show that the interface temperature decreases,the interface pressure and the proportion of the thickness of the Al side increase with the decrease in cast-rolling velocity.The thinning of Cu strip mainly occurs in the backward slip zone.The higher pressure and longer solid/semi-solid contact time make the interface bonded fully,which provides favorable conditions for atomic diffusion.The inter-diffusion zone with a width of 4.9μm is attained at a cast-rolling velocity of 2.4 m/min,and the Cu side surface is nearly completely covered by aluminum.Therefore,the ductile fracture occurs on the Al side,which prevents the propagation of interface delamination cracks effectively.Meanwhile,shear effect becomes more significant at high interfacial pressure and large plastic strain,and the microstructure on Al side is composed of slender columnar crystals.Thus,the metallurgical bonding and refinement of grains on the Al side can result in higher bonding strength and tensile properties of the clad strip.

Electrochemical behavior of Cu-Zn-Al shape memory alloy after surface modification by electroless plated Ni-P

The electrochemical behavior of Cu-Zn-Al shape memory alloy (SMA) with andwithout electroless plated Ni-P was investigated by electrochemical methods, in artificial Tyrode'ssolution. The results showed that Cu-Zn-Al SMA engendered dezincification corrosion in Tyrode'ssolution. The anodic active current densities as well as electrochemical dissolution sensitivity ofthe electroless plated Ni-P Cu-Zn-Al SMA increased with NaCl concentration rising, pH of solutiondecreasing and environmental temperature uprising. X-ray diffraction analysis indicated that aftersurface modification by electroless plated Ni-P, an amorphous plated film formed on the surface ofCu-Zn-Al SMA. This film can effectively isolate matrix metal from corrosion media and significantlyimprove the electrochemical property of Cu-Zn-Al SMA in artificial Tyrode's solution.

Kinetics of Internal Oxidation of Cu-Al Alloy Plate

The kinetics of internal oxidation of dilut e Cu-Al alloys, containing up to 2.214% molar fraction Al, was investigated over the temperature range of 1023K to 1273K, and the depth of internal oxidation was measured by microscopies. A modified rate equation was derived to describe the kinetics of internal oxidation of Cu-Al alloy plate.Based on the derived equati on, the permeability of oxygen in solid copper was obtained from the internal ox idation measurements. The experimental results show that the depth of the intern al oxidation is a parabolic function of time, there is no evidence for preferent ial diffusion along grain boundaries and an outer layer of pure copper was forme d on the external surface of samples.

Effect of immersion Ni plating on interface microstructure and mechanical properties of Al/Cu bimetal

A nickel-based coating was deposited on the pure Al substrate by immersion plating,and the Al/Cu bimetals were prepared by diffusion bonding in the temperature range of 450-550 ℃.The interce microstructure and fracture surface of Al/Cu joints were studied by scanning electron microscopy（SEM） and X-ray diffraction（XRD）.The mechanical properties of the Al/Cu bimetals were measured by tensile shear and microhardness tests.The results show that the Ni interiayer can effectively eliminate the formation of Al-Cu intermetallic compounds.The Al/Ni interface consists of the Al3Ni and Al3Ni2 phases,while it is Ni-Cu solid solution at the Ni/Cu interce.The tensile shear strength of the joints is improved by the addition of Ni interiayer.The joint with Ni interiayer annealed at 500 ℃ exhibits a maximum value of tensile shear strength of 34.7 MPa.

激光熔覆制备Al_(65)Cu_(20)Cr_(15)准晶态合金及其类似相的研究

研究了在45#钢基体表面激光熔覆准晶态Al65Cu20Cr15粉末制备准晶及其类似相涂层过程中,激光功率和扫描速度对激光熔覆涂层相结构的影响.实验结果表明:由于激光功率和扫描速度的变化,基体材料对熔覆涂层的稀释程度发生改变;随着激光熔覆稀释率的增加,熔覆层的相结构依次为β+i,β+d,β,β+Fe;激光熔覆粉末所制备的涂层结构致密,无孔隙和裂纹;涂层的表面显微硬度及摩擦系数等力学性能也因涂层相结构的不同而有所差异.

轧制复合电缆用Cu/Al复合材料变形规律研究

采用三步法复合工艺制备了电缆用Cu/Al复合板,分析了冷轧复合过程中Cu/Al复合板变形区的特点,研究了Cu层与Al层厚度比为1:4时各组元压下率与总压下率的关系。将Cu/Al双金属变形区分为3个区,建立了基于原始坯料层厚比条件下的轧制复合Cu/Al复合板厚度模型。

拉伸复合法制备Cu-Al复合接触线

采用拉伸复合法制备了截面积为160mm2,线密度为(1.0±0.1)kg/m的Cu-Al复合接触线。性能检测结果表明,铜铝复合接触线的综合电导率为45.82MS/m,结合力达到60N/mm,拉断力为47kN,可用作载流量为2000A的磁浮动力轨。

Cu/Al固-液复合界面演化CLSM原位观察分析

为研究Cu/Al固-液复合界面的微观形貌及其动态演化规律,利用共聚焦激光扫描高温显微镜(CLSM)对Cu/Al扩散偶在快速加热至Al液相温度610℃及其保温过程中的固-液复合界面进行了原位观察。并结合复合界面扫描电镜和X射线能谱仪分析结果,探讨了CLSM下界面图像视觉变化与连接界面反应扩散迁移的对应关系,以及CLSM原位观察的可行性。结果表明,高温反应扩散和局部熔合是Cu/Al固-液复合界面结合的主要机制,复合层主要为Al_2Cu。且在无压力作用下,界面夹杂物和氧化层物会严重削弱界面的结合效果。