粉末锻造Al_(2)O_(3)颗粒增强Fe–Ni–Mo–C–Cu复合材料的组织与性能

通过粉末锻造技术制备了不同含量微米级Al_(2)O_(3)颗粒强化的Fe–Ni–Mo–C–Cu(Q61)复合材料,并对调质态和淬火态复合材料的组织和性能进行了研究。结果表明:当Al_(2)O_(3)质量分数为0.15%时,增强颗粒在基体内分布均匀;相较于同种状态下不添加增强颗粒的单一Q61,调质态复合材料的硬度从HRC 38增至HRC 39.8,屈服强度从1106 MPa增至1121 MPa,延伸率从12%降至6.5%;淬火态复合材料的硬度从HRC 61.5增至HRC 63.2,磨损率从5.27×10^(-6)mm^(3)·m^(-1)·N^(-1)降至3.08×10^(-6)mm^(3)·m^(-1)·N^(-1),低于对比试验用的典型齿轮材料40Cr的磨损率(3.34×10^(-6)mm^(3)·m^(-1)·N^(-1))。当Al_(2)O_(3)质量分数大于0.15%时,Al_(2)O_(3)颗粒逐渐偏聚,虽然调质态下复合材料屈服强度仍继续小幅增加,但塑性严重退化,且淬火态复合材料磨损率增加,耐磨性变差。综合来看,添加0.15%Al_(2)O_(3)颗粒强化Q61复合材料在调质态下具有较高的综合力学性能,而在淬火态下表现出良好的抗摩擦磨损能力。

强流脉冲电子束作用下Cu表面合金化Mo研究

钼(Mo)与铜(Cu)之间属于二元互不固溶体系,然而结合了Mo的高温硬度和强度以及Cu的导电导热等优异性能的Cu-Mo复合材料却在电触头、散热元件等领域有着重要的应用。存在的问题是Cu-Mo之间的固溶度极低,难以实现合金化,从而极大地限制了Cu-Mo复合材料优异性能的发挥。该研究尝试采用强流脉冲电子束(HCPEB)技术实现Cu-Mo互不固溶体系的合金化,从而达到改善材料表面力学性能的目的。利用HCPEB辐照预制Mo涂层粉的Cu基体进行辐照,研究不同脉冲次数对样品固溶度、相结构和表面硬度的影响。结果表明,HCPEB辐照可以有效提高Cu-Mo互不固溶体系的固溶度,15次辐照后,Mo在Cu基体中的固溶度达到最高;随辐照次数增加,Cu(Mo)固溶体受热脱溶影响导致合金层中的固溶度反而有所降低。微观结构图像显示,15次HCPEB辐照后样品表层中可观察到大量的球形以及摩尔形态的Mo颗粒;当辐照次数增加到35次后,Mo颗粒大多倾向于分布在晶体缺陷处,且脱溶析出的Mo颗粒与基体存在一定的取向关系。性能测试结果表明,HCPEB合金化处理后Cu(Mo)合金化表层的硬度与辐照次数呈统一变化趋势,即随辐照次数增加显著提升,固溶强化、位错强化和弥散强化机制的共同作用是合金化表层性能改善的原因之所在。

Investigation on the Novel High-performance Copper/Graphene Composite Conductor for High Power Density Motor

High-performance Cu/Graphene composite wire synergistically strengthened by nano Cr_(3)C_(2) phase was directly synthesized via hot press sintering followed by severe cold plastic deformation, using liquid paraffin and CuCr alloy powder as the raw materials. Since graphene is in situ formed under the catalysis of copper powder during the sintering process, the problem that graphene is easy to agglomerate and difficult to disperse uniformly in the copper matrix has been solved. The nano Cr_(3)C_(2)-particles nailed at the interface favor to improve the interface bonding. The Cu/Graphene composite possesses high electrical conductivity, hardness, and plasticity. The composite wire exhibits high electrical conductivity of 96.93% IACS, great tensile strength of 488MPa, and excellent resistance to softening. Even after annealing at 400℃ for 1 h, the tensile strength can still reach 268 MPa with a conductivity of about 99.14% IACS.The wire's temperature coefficient of resistance(TCR) is largely reduced to 0.0035/℃ due to the complex structure,which leads the wire to present low resistivity at higher temperatures. Such Cu/Graphene composite wire with excellent comprehensive performance has a good application prospect in high-power density motors.

三维互穿结构Cu-W触头抗熔焊机理

触头闭合回跳电弧引起的开关电器动熔焊问题,直接影响大功率接触器的电寿命和可靠性。为此设计了2种三维互穿有序结构的四边形和菱形十二面体的Cu-W复合材料触头,围绕触头动熔焊过程中的电弧、熔池、液滴溅射及凝固相变降温等问题,建立触头熔池流体动力学模型和冷凝降温数学模型,研究了2种有序结构和商用无序结构的触头阳极在闭合回跳电弧作用下熔化温度分布、熔池喷溅形貌和接触区域金属凝固过程,通过模拟熔焊实验平台进行了熔焊力验证。结果表明,通过调节三维互穿有序W骨架结构,能够有效抑制熔池扩散和液态金属喷溅,并降低熔焊力,从而提高Cu-W复合材料的抗熔焊性能。

晶粒尺寸对界面含Cr-O-C防黏层Cu/Ni复合体拉伸性能的影响

通过分子动力学方法研究含Cr-O-C防黏层的具有不同晶粒尺寸的Cu/Ni复合体的拉伸变形。结果表明:当Cu/Ni复合体的晶粒尺寸大于12 nm时,不论界面不含Cr、O和C原子或含有定量Cr、O和C原子,复合体的屈服强度随着晶粒尺寸的减小呈现增大趋势,符合细晶强化规律,晶粒塑性变形主要受晶体内部的位错滑移控制,最大应力增加9.52%;当晶粒尺寸小于12 nm时,由于晶界所占比例的增加,拉伸过程的塑性变形更多受晶界变形控制,屈服强度下降。Cr-O-C界面弱化了Cu/Ni复合体的强度,随着界面上Cr、O和C原子数量的增加,Cu/Ni复合体的抗拉强度随之降低,最大应力下降56.40%,Cu/Ni复合体内部的位错数量也随之降低,转移到Ni表面的Cu原子数量随之减少。

Reaction thermodynamics and kinetics on in situ Al_2O_3/Cu composites

The preferred internal oxidation of aluminum in Cu Al alloy was used to obtain in situ Al 2O 3/Cu composites. The reinforcement particles were mainly γ Al 2O 3, some θ Al 2O 3 and a little α Al 2O 3. Thermodynamics analyses show that the chemical reactions are 3Cu 2O+2Al=6Cu+Al 2O 3 or 3CuO+2Al=3Cu+Al 2O 3. A related equilibrium diagram was drawn. The experiments and investigation show that the formation rate of Al 2O 3 was controlled by the diffusion of oxygen in matrix.

Low-temperature heat conduction characteristics of diamond/Cu composite by pressure infiltration method

In this paper,diamond/CuCr and diamond/CuB composites were prepared using the pressure infiltration method.The physical property measurement system(PPMS)was adopted to evaluate the thermal conductivity of diamond/Cu and MoCu composites within the range of100–350 K,and a scanning electron microscope(SEM)was utilized to analyze the microstructure and fracture appearance of the materials.The research indicates that the thermal conductivity of diamond/Cu composite within the range of100–350 K is 2.5–3.0 times that of the existing MoCu material,and the low-temperature thermal conductivity of diamond/Cu composite presents an exponential relationship with the temperature.If B element was added to a Cu matrix and a low-temperature binder was used for prefabricated elements,favorable interfacial adhesion,relatively high interfacial thermal conductivity,and favorable low-temperature heat conduction characteristics would be apparent.

电沉积制备Cu-Ni-Mo三元电极及其析氢性能

目的制备一种在碱性溶液中具有高效、低成本等优点的铜基析氢阴极材料。方法在35℃下采用直流电沉积法,在泡沫镍(NF)表面分别沉积Cu-Ni、Cu-Ni-Mo镀层,制备Cu-Ni/NF、Cu-Ni-Mo/NF析氢电极。利用X射线衍射分析仪(XRD)、扫描电镜(SEM)和能谱仪(EDS)表征电极的表面形貌、结构元素含量及物相。通过电化学阻抗技术(EIS)、线性扫描伏安法(LSV)、循环伏安法(CV)测定电极的析氢性能和催化活性。结果经Mo掺杂后,Mo在Cu-Ni-Mo三元合金中以置换型固溶体的形式存在,与二元镀层相比,增大了镀层的晶格常数。Cu-Ni-Mo/NF三元电极在电流密度10 mV/cm^(2)下,过电位仅为116 mV,塔费尔斜率为104 mV/dec,电荷转移电阻为15.34Ω,电化学活性比表面积(ECSA)为22.33,相较于Cu-Ni/NF二元电极,分别降低了68 mV、27 mV/dec、15.48Ω,ECSA值提高了7.95,且循环稳定性较好。结论引入第3种元素Mo,改变了Cu-Ni二元电极的镀层形貌,使晶粒细化,表现为微粒紧密堆积而成的球胞状结构,从而提升了电极材料的比表面积,为析氢反应提供了更多的活性位点,有助于提高析氢反应效率。由于三金属间的协同作用,与Cu-Ni二元电极相比,Cu-Ni-Mo三元电极显示出更优异的析氢催化性能。

Microstructure and thermal and electric conductivities of high dense Mo/Cu composites

For electronic packaging applications, Mo/Cu composites with volume fractions of 55%, 60% and 67% Mo were fabricated by the patented squeeze-casting technology. The microstructures and thermal and electric conduction properties of the Mo/Cu composites were investigated. The results show that Mo particles are homogeneous and uniform, and the Mo-Cu interfaces are clean and free from interfacial reaction products and amorphous layers; the densifications of the Mo/Cu composites are higher than 99%. The thermal conductivities of Mo/Cu composites range from 220 to 270W/(m·℃) and decrease with an increase in volume fraction of Mo content. The thermal conductivities agree well with the predicted values of theoretical models. The electric conductivities of Mo/Cu composites are in the range of 2228MS/m and decrease with the increase of Mo content. The achievement of higher thermal and electric conduction is attributed to the full densities and high purity Mo/Cu composites, which are attained through the cost-effective squeeze-casting technology processes.

Effect of carbide formers on microstructure and thermal conductivity of diamond-Cu composites for heat sink materials

Diamond-copper composites were prepared by powder metallurgy,in which the diamond particles were pre-coated by magnetic sputtering with copper alloy containing a small amount of carbide forming elements(including B,Cr,Ti,and Si).The influence of the carbide forming element additives on the microstructure and thermal conductivity of diamond composites was investigated.It is found that the composites fabricated with Cu-0.5B coated diamond particles has a relatively higher density and its thermal conductivity approaches 300 W/(m·K).Addition of 0.5%B improves the interfacial bonding and decreases thermal boundary resistance between diamond and Cu,while addition of 1%Cr makes the interfacial layer break away from diamond surface.The actual interfacial thermal conductivity of the composites with Cu-0.5B alloy coated on diamond is much higher than that of the Cu-1Cr layer,which suggests that the intrinsic thermal conductivity of the interfacial layer is an important factor for improving the thermal conductivity of the diamond composites.

Fabrication and characterization of high dense Mo/Cu composites for electronic packaging applications

For electronic packaging applications,Mo/Cu composites with volume fractions of 55%-67% Mo were fabricated by the patented squeeze-casting technology. The microstructures and properties of the Mo/Cu composites were investigated. The results show that Mo particles are homogeneous and uniformly,and the Mo-Cu interfaces are clean and free-from interfacial reaction products and amorphous layers,the densifications of the Mo/Cu composites are higher than 99%. The mean linear coefficients of thermal expansion(20-100 ℃) of Mo/Cu composites range from 7.9 to 9.3×10-6/℃ and decrease with increasing volume fraction of Mo. The experimental coefficients of thermal expansion agree well with predicted values based on Kerner's model. The thermal and electric conductivities of Mo/Cu composites are in range of 220-270 W/(m·℃) and 22-28 MS/m,respectively,and decrease with increasing volume fraction of Mo. The achievement of higher thermal and electric conduction is attributed to the full densities and high purity,which are obtained through the cost-effective squeeze-casting technology processes.

Microstructure of Cu-based Amorphous Composite Coatings on AZ91D Magnesium Alloy by Laser Cladding

To improve the sliding wear resistance of AZ91D magnesium alloy, Cu-based amorphous composite coatings made of CuaTTi34Zr11Nis and Cu47Ti34Zr11Ni8＋20 wt pct SiC powders were fabricated on AZ91D magnesium alloy by laser cladding, respectively. SEM （scanning electron microscopy）, EDS （energy dispersive X-ray spectroscopy）, XRD （X-ray diffraction） and TEM （transmission electron microscopy） techniques were employed to study the phases of the coatings. The results show that the coatings mainly consist of amorphous phase and different intermetallic compounds. The reason of formation of amorphous phase and the function of SiC particles were explained in details.

Cu-Diamond复合材料的多次电弧烧蚀性能研究

采用真空热压烧结法制得金刚石分布均匀,且与铜基结合良好的Cu-Diamond复合材料(金刚石体积分数为5%)。在空气气氛中对Cu-5vol.%Diamond复合材料进行多次电弧烧蚀,通过场发射扫描电子显微镜(SEM)和三维激光共聚焦显微镜(3D LSCM)对烧蚀表面进行观察分析,利用能谱仪(EDS)和X射线光电子能谱仪(XPS)对烧蚀后的成分进行分析,结果表明,经过100次9 kV高电压电弧烧蚀后,复合材料烧蚀区域中的铜基体出现熔化和溅射,并被氧化成了CuO和Cu_(2)O,同时金刚石颗粒较大幅度提高了该复合材料的抗电弧烧蚀能力。

Model of critical strain for dynamic recrystallization in 10%TiC/Cu-Al_2O_3 composite

Using the Gleeble-1500 D simulator, the hot deformation behavior and dynamic recrystallization critical conditions of the 10%Ti C/Cu-Al2O3(volume fraction) composite were investigated by compression tests at the temperatures from 450 °C to 850 °C with the strain rates from 0.001 s-1 to 1 s-1. The results show that the softening mechanism of the dynamic recrystallization is a feature of high-temperature flow true stress-strain curves of the composite, and the peak stress increases with the decreasing deformation temperature or the increasing strain rate. The thermal deformation activation energy was calculated as 170.732 k J/mol and the constitutive equation was established. The inflection point in the lnθ-ε curve appears and the minimum value of-(lnθ)/ε-ε curve is presented when the critical state is attained for this composite. The critical strain increases with the increasing strain rate or the decreasing deformation temperature. There is linear relationship between critical strain and peak strain, i.e., εc=0.572εp. The predicting model of critical strain is described by the function of εc=1.062×10-2Z0.0826.

纳米Cu/多糖复合抗菌膜的制备与表征及其对冬枣黑斑病的防治效果

本研究以明胶和海藻酸钠为成膜基质,采用共混法将绿色合成的纳米Cu掺入多糖膜液,采用流延法制备纳米Cu/多糖复合膜。通过场发射扫描电子显微镜、傅里叶变换红外光谱仪、热重分析仪、紫外-可见近红外分光光谱仪、质构仪以及电感耦合等离子体质谱仪表征纳米Cu及纳米Cu/多糖复合膜的结构,探究薄膜的透光性、理化性能。测定膜的抗真菌活性,并应用到冬枣黑斑病防治,及测定薄膜Cu^(2+)迁移量。结果显示,绿色合成纳米Cu粒径约为44 nm,明胶/海藻酸钠薄膜可作为纳米Cu的优良载体。并且复合膜具有良好的热稳定性、阻隔性和机械性能。此外探究不同质量浓度纳米Cu/多糖复合膜对链格孢菌、镰刀孢菌及灰霉的抑菌性能,最高抑菌率分别为87.80%、77.73%、81.96%,具有良好的抗真菌效果及广谱性。其中对链格孢菌生物量的半抑制浓度为0.25 g/L,在贮藏10 d时,该质量浓度纳米Cu/多糖复合膜对感染黑斑病冬枣的防治效果为52.53%,发病率可有效降低53.16%,且Cu^(2+)迁移量为0.018 7 μg/mL。综上,本实验制备出了一种具有抗真菌活性生物可降解包装膜,为纳米Cu的应用提供了新思路,可为新型抗真菌保鲜材料开发提供理论依据。

Evolution of Microstructure in a Cu-Cr in situ Composite Produced by Thermo-Mechanical Processing

This paper studied the microstructure evolution of a deformation-processed Cu-7Cr in situ composite prepared by thermo-mechanical processing. The longitudinal and transverse sectional microstructures were analyzed using an optical microscope and a scanning electronic microscope. In the longitudinal section, the initially randomly distributed Cr dendrites in the as-cast Cu-7Cr alloy were transformed into the fibres aligned parallel to the drawing axis;the Cr dendrites experienced breaking, flattening and rotating, lapping and merging, and homogenizing and refinement during thermo-mechanical processing. In the transverse section, the initially randomly distributed Cr dendrites in the as-cast Cu-7Cr alloy were changed into the curvy ribbon like fibres;the Cr dendrites underwent breaking, flattening and rotating, folding and twisting, and irregularizing and refinement during thermo-mechanical processing.

铜表面激光熔覆制备Ni-Cu-Mo覆层的显微组织及其摩擦磨损性能

为提高铜材料的耐磨性能,在铜基体上激光熔覆了纯Ni、Ni-20Cu、Ni-20Cu-10Mo及Ni-20Cu-15Mo(摩尔分数,%)四种覆层,分析了Ni-20Cu-10Mo覆层的显微组织,并研究了铜基体及覆层的摩擦磨损行为,考察了Ni、Cu、Mo元素含量对激光熔覆制备覆层的组织及其耐磨性能的影响。结果表明:覆层均以Ni基固溶体为主要物相,呈平面晶-胞状树枝晶-等轴晶的非平衡凝固形态;纯Ni、Ni-20Cu、Ni-20Cu-10Mo及Ni-20Cu-15Mo覆层的显微硬度分别为137.0HV、141.4HV、151.3HV、143.7HV,平均摩擦因数分别为0.64、0.54、0.16、0.42;相对于铜基体而言,四种覆层的显微硬度分别提升了22.65%、26.59%、35.45%和28.65%,平均摩擦因数分别提升了29.67%、40.66%、82.42%、53.85%;其中,Ni-20Cu-10Mo覆层的平均摩擦因数最低(0.16),是铜基体的17.58%,使铜基体的摩擦磨损机制由黏着磨损机制向磨粒磨损机制转变。

Electrical Sliding Wear Properties of Mo-Reinforced MoS_2/Cu Composites

An adequate hardness of MoS2/Cu composites has not been achieved if these materials are applied under the extreme wear conditions. Therefore, Me-reinforced MoS2/Cu composites were prepared by powder metallurgy （P/M） methods. The electrical sliding wear properties in the absence or presence of Mereinforced MoS2/Cu composites were tested by HST-100 high speed electric-tribometer. The hardness, electrical conductivity, density, and microstmcture of MoS2/Cu composites were observed. Me-reinforcement MoS2/Cu composites are of good electrical conductivity, while the hardness of Mo-reinforcedment MoS2/Cu composites is about 33.3% higher than that of MoS2/Cu composites. With the addition of Me, composites show better wear properties under high speed and large electric current due to the improvement of hardness. The effects of current intensity and sliding velocity on the wear properties of the tested materials are complicated, and the wear mechanisms of MoS2/Cu composites are mainly abrasive wear and adhesive wear with arc erosion.