Microstructure and properties of Cu matrix composites reinforced with surface-modified Kovar particles

The thermal conductivity of Cu/Kovar composites was improved by suppressing element diffusion at the interfaces through the formation of FeWO_(4)coating on the Kovar particles via vacuum deposition.Cu matrix composites reinforced with unmodified(Cu/Kovar)and modified Kovar(Cu/Kovar@)particles were prepared by hot pressing.The results demonstrate that the interfaces of Cu/FeWO_(4)and FeWO_(4)/Kovar in the Cu/Kovar@composites exhibit strong bonding,and no secondary phase is generated.The presence of FeWO_(4)impedes interfacial diffusion within the composite,resulting in an increase in grain size and a decrease in dislocation density.After surface modification of the Kovar particle,the thermal conductivity of Cu/Kovar@composite is increased by 110%from 40.6 to 85.6 W·m^(-1)·K^(-1).Moreover,the thermal expansion coefficient of the Cu/Kovar@composite is 9.8×10^(-6)K^(-1),meeting the electronic packaging requirements.

Preparation and electrochemical property of Cs0.35V2O5/Cu composite material

Cs0.35V2O5 was successfully synthesized as cathode material for lithium secondary battery by the rheological phase reaction method from Cs2CO3 and NH4VO3. The Cs0.35V2O5/Cu composite material was prepared by the displacement reaction in CuSO4 solution using zinc powder as a reductant. The structure and electrochemical property of the so-prepared powders were characterized by means of XRD （powder X-ray diffraction） and the galvanostatic discharge-charge techniques. The results show that the electrochemical property of Cs0.35V2O5/Cu composite material is significantly improved compared to the bulk Cs0.35V2O5 material. The Cs0.35V2O5/Cu composite material exhibits the first discharge capacity as high as 164.3 mAh.g -1 in the range of 4.2-1.8V at a current rate of 10 mA.g-1 and remains at a stable discharge capacity of about 110 mAh.g-1 within 40 cycles.

WEAR TRANSITIONS OF C/Cu COMPOSITE MATERIALS

An unlubricated sliding friction test on C/Cu composite materials is described. The result of the test proves that adhesive wear is the domination. At a certain speed, when the load upon the test block is light, the wear rate remains low level and the friction pair has a good antifriction performance. But when the load increases to a certain value, the wear transitions happen, the wear becomes severe.

Fabrication of W/Cu and Mo/Cu FGM as Plasma-facing Materials

W/Cu Functionally Graded Materials (FGM) was designed not only for reducing the thermal stress caused by the mismatch of thermal expansion coefficients, but also for combining the features of W, Mo - high plasma-erosion resistance and the advantages of Cu - high heat conductivity and ductility. Four different fabrication processes for W/Cu or Mo/Cu, including hot-pressing, Cu infiltration of sintered porosity-graded W skeleton, spark plasma sintering and plasma spraying, were investigated and compared. It was foundthat the hot-pressing process is difficult to keep the designed composition gradient, while the other three processes are successful in making W/Cu or Mo/Cu FGM. Meanwhile, microstructures and composition gradients are analyzed with SEM and EDAX.

Microstructure and thermal and electric conductivities of high dense Mo/Cu composites

For electronic packaging applications, Mo/Cu composites with volume fractions of 55%, 60% and 67% Mo were fabricated by the patented squeeze-casting technology. The microstructures and thermal and electric conduction properties of the Mo/Cu composites were investigated. The results show that Mo particles are homogeneous and uniform, and the Mo-Cu interfaces are clean and free from interfacial reaction products and amorphous layers; the densifications of the Mo/Cu composites are higher than 99%. The thermal conductivities of Mo/Cu composites range from 220 to 270W/(m·℃) and decrease with an increase in volume fraction of Mo content. The thermal conductivities agree well with the predicted values of theoretical models. The electric conductivities of Mo/Cu composites are in the range of 2228MS/m and decrease with the increase of Mo content. The achievement of higher thermal and electric conduction is attributed to the full densities and high purity Mo/Cu composites, which are attained through the cost-effective squeeze-casting technology processes.

Fabrication and characterization of high dense Mo/Cu composites for electronic packaging applications

For electronic packaging applications,Mo/Cu composites with volume fractions of 55%-67% Mo were fabricated by the patented squeeze-casting technology. The microstructures and properties of the Mo/Cu composites were investigated. The results show that Mo particles are homogeneous and uniformly,and the Mo-Cu interfaces are clean and free-from interfacial reaction products and amorphous layers,the densifications of the Mo/Cu composites are higher than 99%. The mean linear coefficients of thermal expansion(20-100 ℃) of Mo/Cu composites range from 7.9 to 9.3×10-6/℃ and decrease with increasing volume fraction of Mo. The experimental coefficients of thermal expansion agree well with predicted values based on Kerner's model. The thermal and electric conductivities of Mo/Cu composites are in range of 220-270 W/(m·℃) and 22-28 MS/m,respectively,and decrease with increasing volume fraction of Mo. The achievement of higher thermal and electric conduction is attributed to the full densities and high purity,which are obtained through the cost-effective squeeze-casting technology processes.

粉末锻造Al_(2)O_(3)颗粒增强Fe–Ni–Mo–C–Cu复合材料的组织与性能

通过粉末锻造技术制备了不同含量微米级Al_(2)O_(3)颗粒强化的Fe–Ni–Mo–C–Cu(Q61)复合材料,并对调质态和淬火态复合材料的组织和性能进行了研究。结果表明:当Al_(2)O_(3)质量分数为0.15%时,增强颗粒在基体内分布均匀;相较于同种状态下不添加增强颗粒的单一Q61,调质态复合材料的硬度从HRC 38增至HRC 39.8,屈服强度从1106 MPa增至1121 MPa,延伸率从12%降至6.5%;淬火态复合材料的硬度从HRC 61.5增至HRC 63.2,磨损率从5.27×10^(-6)mm^(3)·m^(-1)·N^(-1)降至3.08×10^(-6)mm^(3)·m^(-1)·N^(-1),低于对比试验用的典型齿轮材料40Cr的磨损率(3.34×10^(-6)mm^(3)·m^(-1)·N^(-1))。当Al_(2)O_(3)质量分数大于0.15%时,Al_(2)O_(3)颗粒逐渐偏聚,虽然调质态下复合材料屈服强度仍继续小幅增加,但塑性严重退化,且淬火态复合材料磨损率增加,耐磨性变差。综合来看,添加0.15%Al_(2)O_(3)颗粒强化Q61复合材料在调质态下具有较高的综合力学性能,而在淬火态下表现出良好的抗摩擦磨损能力。

Effects of rolling and annealing on microstructures and properties of Cu/Invar electronic packaging composites prepared by powder metallurgy

The Cu/Invar composites of 40% Cu were prepared by powder metallurgy, and the composites were rolled with 70% reduction and subsequently annealed at 750 ℃. Phases, microstructures and properties of the composites were then studied. After that, the amount of a-Fe（Ni,Co） in the composites is reduced, because a-Fe（Ni,Co） partly transfers into y-Fe（Ni,Co） through the diffusion of the Ni atoms into a-Fe（Ni,Co） from Cu. When the rolling reduction is less than 40%, the deformation of Cu takes place, resulting in the movement of the Invar particles and the seaming of the pores. When the rolling reduction is in the range from 40% to 60%, the deformations of Invar and Cu occur simultaneously to form a streamline structure. After rolling till 70% and subsequent annealing, the Cu/Invar composites have fine comprehensive properties with a relative density of 98.6%, a tensile strength of 360 MPa, an elongation rate of 50%, a thermal conductivity of 25.42 W/（m.K） （as-tested） and a CTE of 10.79× 10-6/K （20-100 ℃）.

Improvement of the matrix and the interface quality of a Cu/Al composite by the MARB process

The matrix accumulative roll bonding technology （MARB） can improve the matrix performance of metal composite and strengthen the bonding quality of the interface./n this research, for the fwst time, the technology of MARB was proposed. A sound Cu/AI bonding composite was obtained using the MARB process and the bonding characteristic of the interface was studied using scanning electricity microscope （SEM） and energy-dispersive spectroscopy （EDS）. The result indicated that accumulation cycles and diffusion annealing temperature were the most important factors for fabricating a Cu/AI composite material. The substrate aluminum was strengthened by MARB, and a high quality Cu/AI composite with sound interface was obtained as well.

A Novel Technique for Preparation of Electrically Conductive ABS/Cu Polymeric Gradient Composites

A novel technique for preparing functionally gradient electrically conductive polymeric composites was developed by using of solution casting technique on the principle of Stokes＇ law. Acrylonitrile- butadiene-styrene/Cu （ABS/Cu） gradient polymeric composites were prepared successfully using this technique. The gradient structures, electrically conductive performance and mechanical properties of the ABS/Cu composites were investigated. Optical microscope observation shows that the gradient distribution of Cu particles in ABS matrix was formed along their thickness-direction. The electrically conductive testing results indicate that the order of magnitude of surface resistivity was kept in 10^15 Ω at ABS rich side, while that declined to 10^5 Ω at Cu particles rich side, and the percolation threshold was in the range of 2.82 vo1%- 4.74 vol% Cu content at Cu particles rich side. Mechanical test shows that the tensile strength reduced insignificantly as the content of Cu increases owing to the gradient distribution.

Oxidized film on C_p/Cu-Cd electrical contact material

Constituents of the oxidized surface film on diamond particles reinforced Cu-Cd alloy matrix composite （Cp/Cu-Cd） were investigated by XPS. The results show that Cu2O is the main constituent when the oxidized film is thin; CuO appears only after the film is rather thick. The originally formed oxidized film on the Cp/Cu-Cd is about 10nm in thickness and is mainly composed of Cu2O and Cu. After oxidized at 120℃ over 30h, CuO is detected in the film.

Influence of Microstructure Refinement on Strain Strengthening Effect of Cu-Ag Alloy in situ Filamentary Composites

The Cu-10Ag and Cu-10Ag-RE （RE=Ce, Y） alloys in situ filamentary composites were prepared. The relationships of the ultimate tensile strengths （UTS） and microstructure changes of the composites were studied. With increasing of the true strain η, the sizes of the Ag filaments in the composites reduce according to a negative exponential function of η:d=d0·exp（-0.228η）, and the UTS of the composites increase also according to a exponential function of η, σ Cu/Ag=σ 0（Cu）+[k Cu/Agd0 -1/2]exp（η/3）, here d0 is a coefficient related to the original size of Ag phase. The strain strengthening follows a two-stage strengthening effect. The strengthening mechanisms are related to changes of microstructure in the deformation process. At the low true strain stage, the strengthening is mainly caused by the working hardening controlled by dislocation increasing; at the high true strain stage, the strengthening is mainly caused by the super-fine Ag filaments and the large coherent interfaces between the Ag filaments and Cu matrix. The trace RE additions and the rapid solidification obviously refine scales of the Ag filament of the composites, and therefore obviously increased the strain strengthening rate. The microstructure refinement of the composites, especially the refinement of Ag filament, is the main reason of the high strain strengthening effect in Cu-Ag alloy in situ filamentary composites.

Atom Diffusion Behavior and Bonding Strength of Ag/Cu Composite Interface

The atom (Ag,Cu) diffusion behavior and the effect of technology on the interface of rolled Ag/Cu composite contact were investigated. The concentration of Ag and Cu atoms near the interface was determined with electron probe. The bonding strength of composite interface was tested and the fracture in tensile sample was observed by SEM. The results show that there was inter diffusion of Ag and Cu atoms on the interface, which formed compact layer with high bonding strength of 98 MPa. The practical application proved that the Ag/Cu composite interface is reliable.

挤压铸造法制备高致密Mo/Cu及其导热性能

采用专利挤压铸造方法制备了3种Mo体积分数分别为55%、60%和67%的Mo/Cu复合材料,并对其微观组织和导热性能进行了研究.结果表明:Mo颗粒分布均匀,Mo/Cu界面干净,不存在任何界面反应物和非晶层;复合材料组织均匀、致密,且致密度高达99%以上;复合材料的热导率为220～270 W/(m·K),并随着Mo含量的增加而降低.混合定律(ROM)较好地预测了55%Mo/Cu复合材料的热导率,而采用Maxwell模型和H-M模型的计算值与60%和67%Mo/Cu复合材料的热导率测试值一致.

退火温度对轧制复合Cu/Mo/Cu电子封装材料性能的影响

研究了不同退火温度对轧制复合Cu/Mo/Cu电子封装材料性能的影响。结果表明退火温度对复合材料的剪切强度、轧向导电能力和厚度方向导热能力有显著影响 ,退火温度为 85 0℃时 ,Cu/Mo/Cu电子封装材料的综合性能最好。

Cu/Mo/Cu平面层状复合材料的研究进展

总结了Cu/Mo/Cu平面层状复合材料的特点和应用,通过平面层状结构设计,可以实现其在平面(x,y)方向更低的热膨胀系数和更高的热导率,其中热导率最高可达370W·m-1·K-1;介绍了其研究现状和制备方法,并通过对制备工艺的对比分析,指出热压复合和轧制复合是Cu/Mo/Cu层状复合材料生产工艺的发展趋势及方向。

凝胶-共还原法制备超细Mo-Cu粉末及其烧结性能

以(NH4)6Mo7O24·4H2O和CuO为前驱体,采用有机物辅助的凝胶工艺制得干凝胶。干凝胶经煅烧、还原后,获得Cu含量为20%(质量分数)的Mo-Cu复合粉末。该Mo-Cu粉末模压成形后,在H2中于1050～1150℃烧结,制得Mo-Cu复合材料。通过X射线衍射,透射电镜等对干凝胶煅烧后产物及其还原后粉体的相组成、形貌和粒度等进行了表征;通过扫描电镜观测了不同温度烧结所得Mo-Cu复合材料烧结体的显微结构,并对其密度、电导率和强度等物理力学性能进行了测定。结果表明:通过凝胶-共还原法可以制备分散均匀、平均粒度为200nm的Mo-Cu超细粉末;该Mo-Cu粉末烧结活性高,其成形压坯在1150℃下于H2气氛中烧结90min后相对密度可达99.65%,且烧结体的晶粒细小均匀,具有良好的物理力学性能。

自蔓延预热爆炸固结Mo/Cu功能梯度材料的研究

设计并采用自蔓延燃烧预热,水介质缓冲双向爆炸固结的方式制备了Mo/Cu功能梯度材料(FGM),观测了Mo/CuFGM的显微组织并分析了固结过程。对各层的密度、硬度、电导率等进行了测量和分析。发现随着Cu含量的增多,材料的密度平缓递减但相对密度逐渐增大,硬度降低,电导率升高。相对密度从Mo层的94.2%到Cu层的98.4%,试样整体的相对密度达95.5%。Mo/CuFGM第1层与第2层间的剪切强度为214.8MPa;Mo/CuFGM第3层,第4层的热导率分别为204.76W·m-1·K-1和249.71W·m-1·K-1。

熔渗和液相法烧结Mo-Cu合金的组织和性能

研究熔渗和液相烧结法制得Mo-Cu合金的显微组织、电导率、致密度、热导率。结果表明,Mo-Cu合金组织两相分布均匀,钼颗粒之间相互连接。球磨过程中引入杂质Fe,形成新相Fe2Mo3,导致导热系数降低,球磨处理后的烧结试样密度都很高。随成型压力增大,合金径向收缩率减小,相对密度、硬度和电导率几乎不变。

20%Mo/Cu-Al_2O_3复合材料的强化机理及热变形行为

采用真空热压一内氧化烧结方法制备20％Mo／Cu-Al2O3复合材料，测试其性能并观察分析其微观组织。利用Gleeble-1500D热力模拟试验机在温度为350-750℃、应变速率为0．01-5s^-1及总应变量0．5的条件下，对20％Mo／Cu-Al2O3复合材料热变形过程中的流变应力与应变之间的关系进行研究。结果表明：20％Mo／20％Mo／Cu-Al2O3复合材料的组织分布均匀，未观察到明显的团聚现象及孔洞，致密度较高。在材料基体上，原位内氧化生成的纳米级A1203颗粒呈弥散分布，增加了基体的强度。复合材料的高温流动应力一应变曲线以动态再结晶软化机制为主，峰值应力随变形温度的降低或应变速率的升高而增加；在真应力一真应变曲线基础上建立的高温变形本构方程较好地表征了此复合材料的高温流变特性，其计算结果与实验结果吻合较好。