To reveal the drop failure modes of the wafer level chip scale packages （WLCSPs） with Sn-3.0Ag-0.5Cu solder joints, board level drop tests were performed according to the JEDEC standard. Six failure modes were iden...To reveal the drop failure modes of the wafer level chip scale packages （WLCSPs） with Sn-3.0Ag-0.5Cu solder joints, board level drop tests were performed according to the JEDEC standard. Six failure modes were identified, i.e., short FR-4 cracks and complete FR-4 cracks at the printing circuit board （PCB） side, split between redistribution layer （RDL） and Cu under bump metallization （UBM）, RDL fracture, bulk cracks and partial bulk and intermetallic compound （IMC） cracks at the chip side. For the outmost solder joints, complete FR-4 cracks tended to occur, due to large deformation of PCB and low strength of FR-4 dielectric layer. The formation of complete FR-4 cracks largely absorbed the impact energy, resulting in the absence of other failure modes. For the inner solder joints, the absorption of impact energy by the short FR-4 cracks was limited, resulting in other failure modes at the chip side.展开更多
The corrosion behaviors of Sn-0.75Cu solder and Sn-0.75Cu/Cu joint in 3.5% NaCl（mass fraction） solution were studied by potentiodynamic polarization test and leaching measurement.The polarization curves indicated th...The corrosion behaviors of Sn-0.75Cu solder and Sn-0.75Cu/Cu joint in 3.5% NaCl（mass fraction） solution were studied by potentiodynamic polarization test and leaching measurement.The polarization curves indicated that the corrosion rate of Sn-0.75Cu solder was lower than that of Sn-0.75Cu/Cu joint.The morphology observation and phase composition analysis on the corroded product at each interesting potential suggested that Sn3O（OH）2Cl2 formed on the surface of Sn-0.75Cu solder at active dissolution stage.As the potential increased from active/passive transition stage,all the surface of Sn-0.75Cu solder was covered by the Sn3O（OH）2Cl2 and some pits appeared after the polarization test.Compared to the Sn-0.75Cu solder alloy,much more Sn3O（OH）2Cl2 formed at active dissolution stage and the pits with bigger size were observed after polarization test for the Sn-0.75Cu/Cu solder joints.The leaching test confirmed that the faster electrochemical corrosion rate resulted in the larger amount of Sn released from the Sn-0.75Cu/Cu solder joints.展开更多
基金Projects(51475072,51171036)supported by the National Natural Science Foundation of China
文摘To reveal the drop failure modes of the wafer level chip scale packages （WLCSPs） with Sn-3.0Ag-0.5Cu solder joints, board level drop tests were performed according to the JEDEC standard. Six failure modes were identified, i.e., short FR-4 cracks and complete FR-4 cracks at the printing circuit board （PCB） side, split between redistribution layer （RDL） and Cu under bump metallization （UBM）, RDL fracture, bulk cracks and partial bulk and intermetallic compound （IMC） cracks at the chip side. For the outmost solder joints, complete FR-4 cracks tended to occur, due to large deformation of PCB and low strength of FR-4 dielectric layer. The formation of complete FR-4 cracks largely absorbed the impact energy, resulting in the absence of other failure modes. For the inner solder joints, the absorption of impact energy by the short FR-4 cracks was limited, resulting in other failure modes at the chip side.
基金Project (2005DKA10400-Z23) supported by Chinese National Science and Technology InfrastructureProject (DUT10R:(3)65) supported by Fundamental Research Funds for the Central Universities,China
文摘The corrosion behaviors of Sn-0.75Cu solder and Sn-0.75Cu/Cu joint in 3.5% NaCl（mass fraction） solution were studied by potentiodynamic polarization test and leaching measurement.The polarization curves indicated that the corrosion rate of Sn-0.75Cu solder was lower than that of Sn-0.75Cu/Cu joint.The morphology observation and phase composition analysis on the corroded product at each interesting potential suggested that Sn3O（OH）2Cl2 formed on the surface of Sn-0.75Cu solder at active dissolution stage.As the potential increased from active/passive transition stage,all the surface of Sn-0.75Cu solder was covered by the Sn3O（OH）2Cl2 and some pits appeared after the polarization test.Compared to the Sn-0.75Cu solder alloy,much more Sn3O（OH）2Cl2 formed at active dissolution stage and the pits with bigger size were observed after polarization test for the Sn-0.75Cu/Cu solder joints.The leaching test confirmed that the faster electrochemical corrosion rate resulted in the larger amount of Sn released from the Sn-0.75Cu/Cu solder joints.
