Cu/WC复合材料性能影响因素的研究

研究了WC含量、烧结温度、高温退火等方面对Cu／WC复合材料性能的影响。结果表明，Cu／WC复合材料的密度、电导率随WC含量的增加逐渐下降，而硬度升高。热稳定性较好，具有较高的软化温度。经600～900℃退火后，硬度、强度稍有下降，而塑性则大大提高。

真空热压烧结对Cu/WC复合材料性能的影响

采用粉末冶金真空热压烧结法制备Cu/WC复合材料,研究了WC含量及材料烧结时间对硬度及导电等性能的影响。结果表明,真空热压烧结可明显改善WC颗粒度分布,提高复合材料的致密度、硬度和导电性;v(WC)=1.5%、烧结时间为3h时,材料的综合性能最好。

Influence of additives and concentration of WC nanoparticles on properties of WC−Cu composite prepared by electroplating

The effects of additives(polyethylene glycol(PEG),sodium dodecyl sulfate(SDS))and WC nano-powder on the microstructure,relative density,hardness and electrical conductivity of electroplated WC−Cu composite were investigated.The preparation mechanism was also studied.The microstructure of samples was analyzed by XRD,SEM,EDS,TEM and HRTEM.The synergistic effect of PEG and SDS made the WC−Cu composite more compact during the electroplating process.The hardness of WC−Cu composites increased with the increase in WC content,while the electrical conductivity decreased with the increase in WC content.The density of samples tended to increase initially and then decreased with increase in the additive content.When the electroplating solution contained 10 g/L WC nanopowder,0.2 g/L PEG and 0.1 g/L SDS,the WC−Cu composite exhibited hardness of HV 221 and electric conductivity of 53.7 MS/m.Therefore,the results suggest that WC−Cu composite with excellent properties can be obtained by optimizing the content of additives and WC particles.