Recent Advances in Interface Modification of Cu/graphite Composites and Layered Ternary Carbides of Modified Layer Candidate

We review the fundamental properties and significant issues related to Cu/graphite composites.In particular,recent research on the interfacial modification of Cu/graphite composites is addressed,including the metal-modified layer,carbide-modified layer,and combined modified layer.Additionally,we propose the use of ternary layered carbide as an interface modification layer for Cu/graphite composites.

Microstructure and properties of Cu matrix composites reinforced with surface-modified Kovar particles

The thermal conductivity of Cu/Kovar composites was improved by suppressing element diffusion at the interfaces through the formation of FeWO_(4)coating on the Kovar particles via vacuum deposition.Cu matrix composites reinforced with unmodified(Cu/Kovar)and modified Kovar(Cu/Kovar@)particles were prepared by hot pressing.The results demonstrate that the interfaces of Cu/FeWO_(4)and FeWO_(4)/Kovar in the Cu/Kovar@composites exhibit strong bonding,and no secondary phase is generated.The presence of FeWO_(4)impedes interfacial diffusion within the composite,resulting in an increase in grain size and a decrease in dislocation density.After surface modification of the Kovar particle,the thermal conductivity of Cu/Kovar@composite is increased by 110%from 40.6 to 85.6 W·m^(-1)·K^(-1).Moreover,the thermal expansion coefficient of the Cu/Kovar@composite is 9.8×10^(-6)K^(-1),meeting the electronic packaging requirements.

Revealing the Role of Defect in 3D Graphene-Based Photocatalytic Composite for Efficient Elimination of Antibiotic and Heavy Metal Combined Pollution

Defect engineering can give birth to novel properties for adsorption and photocatalysis in the control of antibiotics and heavy metal combined pollution with photocatalytic composites.However,the role of defects and the process mechanism are complicated and indefinable.Herein,TiO_(2)/CN/3DC was fabricated and defects were introduced into the tripartite structure with separate O_(2)plasma treatment for the single component.We find that defect engineering can improve the photocatalytic activity,attributing to the increase of the contribution from h^(+)and OH.In contrast to TiO_(2)/CN/3DC with a photocatalytic tetracycline removal rate of 75.2%,the removal rate of TC with D-TiO_(2)/CN/3DC has increased to 88.5%.Moreover,the reactive sites of tetracycline can be increased by adsorbing on the defective composites.The defect construction on TiO_(2)shows the advantages in tetracycline degradation and Cu^(2+)adsorption,but also suffers significant inhibition for the tetracycline degradation in a tetracycline/Cu^(2+)combined system.In contrast,the defect construction on graphene can achieve the cooperative removal of tetracycline and Cu^(2+).These findings can provide new insights into water treatment strategies with defect engineering.

Investigation on the Novel High-performance Copper/Graphene Composite Conductor for High Power Density Motor

High-performance Cu/Graphene composite wire synergistically strengthened by nano Cr_(3)C_(2) phase was directly synthesized via hot press sintering followed by severe cold plastic deformation, using liquid paraffin and CuCr alloy powder as the raw materials. Since graphene is in situ formed under the catalysis of copper powder during the sintering process, the problem that graphene is easy to agglomerate and difficult to disperse uniformly in the copper matrix has been solved. The nano Cr_(3)C_(2)-particles nailed at the interface favor to improve the interface bonding. The Cu/Graphene composite possesses high electrical conductivity, hardness, and plasticity. The composite wire exhibits high electrical conductivity of 96.93% IACS, great tensile strength of 488MPa, and excellent resistance to softening. Even after annealing at 400℃ for 1 h, the tensile strength can still reach 268 MPa with a conductivity of about 99.14% IACS.The wire's temperature coefficient of resistance(TCR) is largely reduced to 0.0035/℃ due to the complex structure,which leads the wire to present low resistivity at higher temperatures. Such Cu/Graphene composite wire with excellent comprehensive performance has a good application prospect in high-power density motors.

Morphology and Frictional Characteristics Under Electrical Currents of Al_2O_3/Cu Composites Prepared by Internal Oxidation

Two Al2O3/Cu composites containing 0.24 wt.% Al2O3 and 0.60 wt.% Al2O3 separately are prepared by internal oxidation. Effects of sliding speed and pressure on the frictional characteristics of the composites and copper against brass are investigated and compared. The changes in morphology of the sliding surface and subsurface are examined with scanning electron microscope （SEM） and energy dispersive X-ray spectrum （EDS）. The results show that the wear resistance of the Al2O3/Cu composites is superior to that of copper under the same conditions, Under a given electrical current, the wear rate of Al2O3/Cu composites decreases as the Al2O3-content increases, However, the wear rates of the Al2O3/Cu composites and copper increase as the sliding speed and pressure increase under dry sliding condition. The main wear mechanisms for Al2O3/Cu composites are of abrasion and adhesion; for copper, it is adhesion, although wear by oxidation and electrical erosion can also be observed as the speed and pressure rise.

Effect of electrical current on tribological property of Cu matrix composite reinforced by carbon nanotubes

Cu matrix composite reinforced with 10%（volume fraction） carbon nanotubes（CNTs/Cu） and pure Cu bulk were prepared by powder metallurgy techniques under the same consolidation processing condition.The effect of electrical current on tribological property of the materials was investigated by using a pin-on-disk friction and wear tester.The results show that the friction coefficient and wear rate of CNTs/Cu composite as well as those of pure Cu bulk increase with increasing the electrical current without exception,and the effect of electrical current is more obvious on tribological property of pure Cu bulk than on that of CNTs/Cu composite;the dominant wear mechanisms are arc erosion wear and plastic flow deformation,respectively;CNTs can improve tribological property of Cu matrix composites with electrical current.

Properties and microstructure of Cu/diamond composites prepared by spark plasma sintering method

Cu/diamond composites have been considered as the next generation of thermal management material for electronic packages and heat sinks applications. Cu/diamond composites with different volume fractions of diamond were successfully prepared by spark plasma sintering（SPS） method. The sintering temperatures and volume fractions（50%, 60% and 70%） of diamond were changed to investigate their effects on the relative density, homogeneity of the microstructure and thermal conductivity of the composites. The results show that the relative density, homogeneity of the microstructure and thermal conductivity of the composites increase with decreasing the diamond volume fraction; the relative density and thermal conductivity of the composites increase with increasing the sintering temperature. The thermal conductivity of the composites is a result of the combined effect of the volume fraction of diamond, the homogeneity and relative density of the composites.

Microstructural development and its effects on mechanical properties of Al/Cu laminated composite

The microstructural development and its effect on the mechanical properties of Al/Cu laminated composite produced by asymmetrical roll bonding and annealing were studied. The composite characterizations were conducted by transmission electron microscope（TEM）, scanning electron microscope（SEM）, peeling tests and tensile tests. It is found that the ultra-fine grained laminated composites with tight bonding interface are prepared by the roll bonding technique. The annealing prompts the atomic diffusion in the interface between dissimilar matrixes, and even causes the formation of intermetallic compounds. The interfacial bonding strength increases to the maximum value owing to the interfacial solution strengthening at 300 °C annealing, but sharply decreases by the damage effect of intermetallic compounds at elevated temperatures. The composites obtain high tensile strength due to the Al crystallization grains and Cu twins at 300 °C. At 350 °C annealing, however, the composites get high elongation by the interfacial interlayer with submicron thickness.

时效处理对Cu-Y_(2)O_(3)-Ti复合材料组织及性能的影响

以Cu、Y、Ti和CuO粉末为原料,采用机械合金化(MA)和热还原的方法制备了Cu-Y_(2)O_(3)-Ti复合粉末。然后经放电等离子烧结(SPS)技术制备了Cu-Y_(2)O_(3)-Ti复合材料,并对材料进行了900℃固溶1 h和不同温度时效2 h的处理。采用光学显微镜(OM)、扫描电镜(SEM)、X射线衍射仪(XRD)、能谱仪(EDS)、拉伸试验和导电率测量仪等研究了不同温度时效处理对Cu-Y_(2)O_(3)-Ti复合材料组织及性能的影响。结果表明:随着时效温度的升高,Cu-Y_(2)O_(3)-Ti复合材料的晶粒和第二相尺寸增大,导电率降低,最大应变和抗拉强度先增大后减小。Cu-Y_(2)O_(3)-Ti复合材料经900℃固溶1 h+400℃时效2 h后,综合性能最优,其具有良好塑性的同时,抗拉强度和导电率分别达到326.4 MPa和73.0%IACS。

三维互穿结构Cu-W触头抗熔焊机理

触头闭合回跳电弧引起的开关电器动熔焊问题,直接影响大功率接触器的电寿命和可靠性。为此设计了2种三维互穿有序结构的四边形和菱形十二面体的Cu-W复合材料触头,围绕触头动熔焊过程中的电弧、熔池、液滴溅射及凝固相变降温等问题,建立触头熔池流体动力学模型和冷凝降温数学模型,研究了2种有序结构和商用无序结构的触头阳极在闭合回跳电弧作用下熔化温度分布、熔池喷溅形貌和接触区域金属凝固过程,通过模拟熔焊实验平台进行了熔焊力验证。结果表明,通过调节三维互穿有序W骨架结构,能够有效抑制熔池扩散和液态金属喷溅,并降低熔焊力,从而提高Cu-W复合材料的抗熔焊性能。

晶粒尺寸对界面含Cr-O-C防黏层Cu/Ni复合体拉伸性能的影响

通过分子动力学方法研究含Cr-O-C防黏层的具有不同晶粒尺寸的Cu/Ni复合体的拉伸变形。结果表明:当Cu/Ni复合体的晶粒尺寸大于12 nm时,不论界面不含Cr、O和C原子或含有定量Cr、O和C原子,复合体的屈服强度随着晶粒尺寸的减小呈现增大趋势,符合细晶强化规律,晶粒塑性变形主要受晶体内部的位错滑移控制,最大应力增加9.52%;当晶粒尺寸小于12 nm时,由于晶界所占比例的增加,拉伸过程的塑性变形更多受晶界变形控制,屈服强度下降。Cr-O-C界面弱化了Cu/Ni复合体的强度,随着界面上Cr、O和C原子数量的增加,Cu/Ni复合体的抗拉强度随之降低,最大应力下降56.40%,Cu/Ni复合体内部的位错数量也随之降低,转移到Ni表面的Cu原子数量随之减少。

Effects of rolling and annealing on microstructures and properties of Cu/Invar electronic packaging composites prepared by powder metallurgy

The Cu/Invar composites of 40% Cu were prepared by powder metallurgy, and the composites were rolled with 70% reduction and subsequently annealed at 750 ℃. Phases, microstructures and properties of the composites were then studied. After that, the amount of a-Fe（Ni,Co） in the composites is reduced, because a-Fe（Ni,Co） partly transfers into y-Fe（Ni,Co） through the diffusion of the Ni atoms into a-Fe（Ni,Co） from Cu. When the rolling reduction is less than 40%, the deformation of Cu takes place, resulting in the movement of the Invar particles and the seaming of the pores. When the rolling reduction is in the range from 40% to 60%, the deformations of Invar and Cu occur simultaneously to form a streamline structure. After rolling till 70% and subsequent annealing, the Cu/Invar composites have fine comprehensive properties with a relative density of 98.6%, a tensile strength of 360 MPa, an elongation rate of 50%, a thermal conductivity of 25.42 W/（m.K） （as-tested） and a CTE of 10.79× 10-6/K （20-100 ℃）.

Preparation of nanosized W/Cu composite powder by sol-gel technique

Cu(NO3)(2) and (NH4)(6)H(2)W(12)O(40)center dot 4H(2)O were used to prepare W/Cu nanosized composite powder by sol-gel technique. The influences of heat treatment process, pH value of the solution and the amount of an addition agent on particle size were investigated by DSC, XRD and TEM. The results show that, at a certain heat treatment temperature, the W/Cu nanoparticle size increases with the pH value or the amount of the addition agent increasing.

纳米Cu/多糖复合抗菌膜的制备与表征及其对冬枣黑斑病的防治效果

本研究以明胶和海藻酸钠为成膜基质,采用共混法将绿色合成的纳米Cu掺入多糖膜液,采用流延法制备纳米Cu/多糖复合膜。通过场发射扫描电子显微镜、傅里叶变换红外光谱仪、热重分析仪、紫外-可见近红外分光光谱仪、质构仪以及电感耦合等离子体质谱仪表征纳米Cu及纳米Cu/多糖复合膜的结构,探究薄膜的透光性、理化性能。测定膜的抗真菌活性,并应用到冬枣黑斑病防治,及测定薄膜Cu^(2+)迁移量。结果显示,绿色合成纳米Cu粒径约为44 nm,明胶/海藻酸钠薄膜可作为纳米Cu的优良载体。并且复合膜具有良好的热稳定性、阻隔性和机械性能。此外探究不同质量浓度纳米Cu/多糖复合膜对链格孢菌、镰刀孢菌及灰霉的抑菌性能,最高抑菌率分别为87.80%、77.73%、81.96%,具有良好的抗真菌效果及广谱性。其中对链格孢菌生物量的半抑制浓度为0.25 g/L,在贮藏10 d时,该质量浓度纳米Cu/多糖复合膜对感染黑斑病冬枣的防治效果为52.53%,发病率可有效降低53.16%,且Cu^(2+)迁移量为0.018 7 μg/mL。综上,本实验制备出了一种具有抗真菌活性生物可降解包装膜,为纳米Cu的应用提供了新思路,可为新型抗真菌保鲜材料开发提供理论依据。

Microstructure and mechanical properties of Al/Cu/Mg laminated composite sheets produced by the ARB proces

In the present study, an Al/Cu/Mg multi-layered composite was produced by accumulative roll bonding(ARB) through seven passes, and its microstructure and mechanical properties were evaluated. The microstructure investigations show that plastic instability occurred in both the copper and magnesium reinforcements in the primary sandwich. In addition, a composite with a perfectly uniform distribution of copper and magnesium reinforcing layers was produced during the last pass. By increasing the number of ARB cycles, the microhardness of the layers including aluminum, copper, and magnesium was significantly increased. The ultimate tensile strength of the sandwich was enhanced continually and reached a maximum value of 355.5 MPa. This strength value was about 3.2, 2, and 2.1 times higher than the initial strength values for the aluminum, copper, and magnesium sheets, respectively. Investigation of tensile fracture surfaces during the ARB process indicated that the fracture mechanism changed to shear ductile at the seventh pass.

Mechanical properties of Cu based composites reinforced by carbon nanotubes

Cu based composites reinforced by 0%～25% (volume fraction) carbon nanotubes were prepared.The fracture behaviors and the rolling properties of the composites and the effects of the volume fraction of the carbon nanotubes were studied.The experimental results show that the fracture toughness of the composites is related to the pulling out and bridging of the carbon nanotubes in the fracture process.With the volume fraction of the carbon nanotubes increasing, the Vicker’s hardness and the compactness of the composites increase first and then decrease. The peaks of the hardness and the compactness occur at 12%～15% of volume fraction of carbon nanotubes.Some proper ratio of rolling reduction benefits to the comprehensive mechanical properties of the composites.

Improvement of the matrix and the interface quality of a Cu/Al composite by the MARB process

The matrix accumulative roll bonding technology （MARB） can improve the matrix performance of metal composite and strengthen the bonding quality of the interface./n this research, for the fwst time, the technology of MARB was proposed. A sound Cu/AI bonding composite was obtained using the MARB process and the bonding characteristic of the interface was studied using scanning electricity microscope （SEM） and energy-dispersive spectroscopy （EDS）. The result indicated that accumulation cycles and diffusion annealing temperature were the most important factors for fabricating a Cu/AI composite material. The substrate aluminum was strengthened by MARB, and a high quality Cu/AI composite with sound interface was obtained as well.

Effects of intermediate Ni layer on mechanical properties of Al–Cu layered composites fabricated through cold roll bonding

Layered composites have attracted considerable interest in the recent literature on metal composites. Their mechanical properties depend on the quality of the bonding provided by the intermediate layers. In this study, we analyzed the mechanical properties and bond strengths provided by the nickel layer with respect to its thickness and nature(either powder or coating). The results suggest that bond strength decreases with an increase in the content of nickel powder. At 0.3 vol% of nickel coating, we found the nature of nickel to be less efficient in terms of bond strength. A different picture arose when the content of nickel was increased and the bond strength increased in nickel coated samples. In addition, the results demonstrate that mechanical properties such as bend strength are strongly dependent on bond strength.

Fabrication of an in-situ nanoAl_2O_3/Cu composite with high strength and high electric conductivity

A heat-resistant dispersion-strengthening nano-Al_2O_3/Cu composite with highstrength and high electric conductivity was fabricated in a multiplex medium. The internaloxidation product, microstructures and properties of the composite, and the process flow weresystematically studied. It is confirmed that this new technique simplifies the process and improvesthe properties of the composite. X-ray analysis indicates that the alumina particles formed duringinternal oxidation consist of a large mount of gamma-Al_2O_3 and a certain amount of theta-Al_2O_3and alpha-Al_2O_3. TEM observation shows that the obtained gamma-Al_2O_3 nano-particles areuniformly distributed in the copper grains; their mean size and space between particles are 7 runand 30 nm, respectively. The main properties of the composite with 50 percent cold deformation areas follows: the electric conductivity is 51 MS/m (87 percent IACS), sigma_b = 628 MPa, and thehardness is HRB86. After annealing at 1273 K, all or most of the above properties remain, and themicrostructures are still dependent on elongated fiber-form grains.

Self-propagating High-temperature Synthesis, Microstructure and Mechanical Properties of TiC-TiB_2-Cu Composites

TiC-TiB2-Cu composites were produced by self-propagating high-temperature synthesis combined with pseudo hot isostatic pressing using Ti, B4C and Cu powders. The microstructure and mechanical properties of the composites were investigated. The X-ray diffraction （XRD） and scanning electron microscopy （SEM） results showed that the final products were only TiC, TiB2 and Cu phases. The clubbed TiB2 grains and spheroidal or irregular TiC grains were found in the microstructure of synthesized products. The reaction temperature and grain size of TiB2 and TiC particles decreased with increasing Cu content. The introduction of Cu into the composites resulted in a drastic increase in the relative density and flexual strength, and the maximum values were obtained with the addition of 20 wt pct, while the fracture toughness was the best when Cu content was 40 wt pct.