纳米Al_2O_3添加剂含量对Cu-Sn合金镀层微结构及性能的影响

当下,焦磷酸盐体系Cu-Sn合金电镀存在许多问题,将纳米Al2O3粉末加入镀液中,可解决镀层的一些结构和性能问题。采用X射线衍射仪(XRD)、扫描电镜(SEM)、能谱(EDS)、电化学测量技术,研究了纳米Al2O3添加剂对Cu-Sn合金电镀层微结构及性能的影响。结果表明:在直流电镀过程中,纳米Al2O3能够进入Cu-Sn合金镀层,镀层微结构、性能与其含量有着较大的关系;随着纳米Al2O3含量的增加,Cu-Sn合金镀层更加致密、均匀,其硬度、耐蚀性与耐磨性不断提高;当Al2O3纳米浓度达到8 g/L时,Cu-Sn合金镀层的显微硬度、耐蚀性能、耐磨性能及与基体的结合强度处于最佳状态。

激光熔覆成型用Ni-Cu-Sn合金粉末的制备及其成形特性

研制了适合激光熔覆成型的Ni-Cu-Sn合金粉末,通过工艺试验,分析了激光熔覆成型件的微观组织特征及微观缺陷的形成原因,并提出了预防缺陷形成的方法。

Al-Pb-Si-Sn-Cu轴瓦合金的微观结构及特征

采用机械合金化、冷压与热挤压法制备了Al 15 %Pb 4 %Si 1%Sn 1 5 %Cu(质量分数 ,% )轴瓦合金。试验结果表明 ,块体材料的组织分布很均匀。Pb粒子细小均匀弥散分布在Al基体上 ,呈纳米晶粒。Al基体晶粒大小约 1 2 μm ,在其晶界和晶粒内都有粒子析出。在Al基体上还分布着由非晶和亚微米晶粒构成的混合相。研究表明 ,该工艺是制备Al Pb系列轴瓦合金的较佳方法 ;并为制备室温不互溶、高温存在很宽固溶间隙、有较大密度差异的合金组元且组织均匀的合金奠定了工艺基础。

Cu-16%Sn-8%P合金的球状Cu_3P与热处理特性

利用金相和电子探针研究了Cu 16%Sn 8%P合金的微观结构,热处理条件对合金结构和硬度的影响。结果表明:在Cu 16%Sn 8%P合金中,P主要以Cu3P化合物形式存在,在Sn的影响下该化合物形成非常圆整的球状;Sn以Cu10Sn和Cu5Sn两种化合物存在。在560℃下保温,时间越长淬火组织中形成的条状Cu3P化合物越多,球状Cu3P化合物直径越小;硬度先降低,然后大幅度升高。对淬火组织进行退火处理,可进一步促进Cu3P化合物以块状、条状形态析出。

SCR连铸连轧法制备Cu-Sn接触线工艺及Sn对组织和性能的影响

采用SCR连铸连轧法制备Cu-Sn接触线,通过金相分析、高分辨透射电镜以及对线坯、成品的力学、电学性能测试,探讨生产工艺的优越性及第二相Sn对Cu-Sn合金接触线组织、性能的影响以及Sn在合金中的存在形式。分析认为:通过SCR连铸连轧法生产的Cu-Sn合金接触线性能优越,完全满足国家标准,Sn在Cu基体中除了固溶外还以多种中间相的形式存在,Sn的掺入细化了晶粒组织,在可允许范围内增大了电阻率,且力学强度也有所改善,经过冷拉处理,其伸长率和电阻率均符合国家标准,且力学强度有大幅度提高。

高能球磨制备Al-Pb-Si-Sn-Cu纳米晶粉末的特性

通过机械合金化制备了 Al-15%Pb-4%Si-1%Sn-1.5%Cu(质量分数)纳米晶粉末。采用 X 射线衍射(XRD),扫描电镜(SEM)和透射电镜(TEM)对不同球磨时间的混合粉末的组织结构、晶粒大小、微观形貌以及颗粒中化学成分分布情况进行了研究。结果表明混合粉末经过球磨后形成了纳米晶,其组织非常均匀。球磨对 Pb 的作用效果明显大于对 Al 的作用效果,经过 40 h 球磨后 Pb 粒子达到 40 nm,而 Al 在球磨 60 h 后晶粒为 65 nm;经球磨后,Cu 和 Si 固溶于 Al 的晶格中,而 Sn 则固溶于 Pb 晶格中,并且 Al 和 Pb 发生了互溶,形成了 Pb(Al)超饱和固溶体;在球磨过程中硬度高的脆性粒子 Si 难于完全实现合金化。

Surface quality, microstructure and mechanical properties of Cu-Sn alloy plate prepared by two-phase zone continuous casting

Cu-4.7%Sn （mass fraction） alloy plate was prepared by the self-developed two-phase zone continuous casting （TZCC） process. The relationship between process parameters of TZCC and surface quality of the alloy plate was investigated. The microstructure and mechanical properties of the TZCC alloy plate were analyzed. The results show that Cu-4.7%Sn alloy plate with smooth surface can be obtained by means of reasonable matching the entrance temperature of two-phase zone mold and the continuous casting speed. The microstructure of the TZCC alloy is composed of grains-covered grains, small grains with self-closed grain boundaries, columnar grains and equiaxed grains. Compared with cold mold continuous casting Cu-4.7%Sn alloy plate, the room temperature tensile strength and ductility of the TZCC alloy plate are greatly improved.

Microstructure and dry sliding wear behavior of Cu-Sn alloy reinforced with multiwalled carbon nanotubes

Multiwalled carbon nanotubes （MWCNTs） reinforced Cu-Sn alloy based nanocomposite was developed by powder metallurgy route. The mass fraction of CNTs was varied from 0 to 2% in a step of 0.5%. The developed nanocomposites were subjected to density, hardness, electrical conductivity, and friction and wear tests. The results reveal that the density of nanocomposite decreases with the increase of the mass fraction of CNTs. A significant improvement in the hardness is noticed in the nanocomposite with the addition of CNTs. The developed nanocomposites show low coefficient of friction and improved wear resistance when compared with unreinforced alloy. At an applied load of 5 N, the coefficient of friction and wear loss of 2%CNTs reinforced Cu-Sn alloy nanocomposite decrease by 72% and 68%, respectively, compared with those of Cu-Sn alloy. The wear mechanisms of worn surfaces of the composites are reported. In addition, the electrical conductivity reduces with the increase of the content of CNTs.

Effects of sliding velocity and normal load on tribological behavior of aged Al-Sn-Cu alloy

The tribological behavior of aged Al-Sn-Cu alloy rubbed in the presence of lubricant over a range of sliding velocities and normal loads was investigated. The results showed that peak-aged （PA） alloy had a better tribological behavior than under-aged （UA） and over-aged （OA） alloys, which could be attributed to the optimized strength-ductility matching and a better hardness under PA condition. Wear rate and friction coefficient showed great sensitivity to applied sliding velocity and normal load. The wear rate and friction coefficient of the alloy exhibited a reduction trend with the increase in sliding velocity. The low wear rate and friction coefficient of alloy at high velocities were due to the effectively protected film and homogeneous Sn on surface. However, an increase in normal load led to an obvious increment in wear rate. The friction coefficient exhibited a fluctuant trend with the increase of normal loads. The seriously destroyed film and abraded Sn resulted in poor tribological behavior at high normal loads. The Sn particles and lubricant film which includes low shear interfacial lubricating layer and oxide tribolayer are the key to the tribological behavior of Al-Sn-Cu alloy.

Wetting of molten Sn-3.5Ag-0.5Cu on Ni-P(-SiC) coatings deposited on high volume faction SiC/Al composite

The wetting of molten Sn-3.5Ag-0.5Cu alloy on the Ni-P(-SiC)coated SiCp/Al substrates was investigated by electroless Ni plating process,and the microstructures of the coating and the interfacial behavior of wetting systems were analyzed.The SiC particles are evenly distributed in the coating and enveloped with Ni.No reaction layer is observed at the coating/SiCp/Al composite interfaces.The contact angle increases from^19°with the Ni-P coating to 29°,43°and 113°with the corresponding Ni-P-3SiC,Ni-P-6SiC and Ni-P-9SiC coatings,respectively.An interaction layer containing Cu,Ni,Sn and P forms at the Sn-Ag-Cu/Ni-P-(0,3,6)SiC coated SiCp/Al interfaces,and the Cu-Ni-Sn and Ni-Sn-P phases are detected in the interaction layer.Moreover,the molten Sn-Ag-Cu can penetrate into the Ni-P(-SiC)coatings through the Ni-P/SiC interface and dissolve them to contact the SiCp/Al substrate.

Influence of Cu content on microstructure,grain orientation and mechanical properties of Sn-xCu lead-free solders

The effect of Cu content on the microstructure,grain orientation and mechanical properties of Sn-xCu(x=0-4.0 wt.%)lead-free solder was studied.Results showed that added Cu induced the formation of intermetallic phases.Only theη-Cu;Sn;andε-Cu;Sn phases were present in theβ-Sn matrix.For all contents,the strongly preferred orientation of theβ-Sn phase was formed on the{001}plane.In Sn doped with 1.0 wt.%Cu,theη-Cu;Sn;phase exhibited the preferred orientation of{0001}plane,whereas doping with 3.0 or 4.0 wt.%Cu transformed the preferred orientation to the{010}plane.In addition,only the{0001}and{■}planes were present in theε-Cu;Sn phase.The high Cu contents contributed to an increased number of low-angle boundaries,high residual strain,tensile strength and microhardness.

Property alterations of Sn-0.6Cu-0.05Ni-Ge lead-free solder by Ag, Bi, In and Sb addition

The Sn-Cu-Ni-Ge solder is a strong challenger to the Sn-Ag-Cu（SAC） solders as a replacement for the Sn-Pb eutectic solder. This research investigated the effects of addition of Ag, Bi, In, and Sb on the physical properties of the Sn-0.6 Cu-0.05 Ni-Ge（SCNG） lead-free solder and the interfacial reaction with the Cu substrate. The melting behavior, microstructure, tensile strength, and wettability of the SCNG-x（x=Ag, Bi, In, Sb） solders were examined. The findings revealed that the introduction of Ag, Bi, In, and Sb minimally altered the solidus temperature, liquidus temperature, and tensile strength of the solder. However, the cooling behavior and solidified microstructure of the solder were affected by the concentration of the alloying elements. The wettability of the SCNG solder was improved with the doping of the alloying elements except Sb. The thickness of intermetallic layer was increased by the addition of the alloying elements and was related to the cooling behavior of the solder. The morphology of intermetallic layer between the SCNG-x solders and the Cu substrate was different from that of the typical SAC solders. In conclusion, alloying the SCNG solder with Ag, Bi, In or Sb is able to improve particular properties of the solder.

氟硼酸体系二价锡合金镀液抗氧化剂的筛选

为了防止镀液中Sn2+的氧化,需在基础镀液中加入抗氧化剂。采用自然氧化法做分析试验:(1)测定苯酚、间苯二酚和对苯二酚3种不同抗氧化剂对镀液稳定性的影响;(2)测定添加不同质量浓度的对苯二酚对镀液的稳定性及镀层成分的影响。分析结果表明,在Pb-Sn-Cu三元合金电镀中采用质量浓度5g/L的对苯二酚作为抗氧化剂,镀液的稳定性适中,镀层质量良好。

铜基多元合金的处理(Ⅱ)——连续电解实验研究

针对Cu-Zn-Sn-P四元合金网废料,采用连续电解的方式研究了采用电化学溶解———电解沉积的工艺;研究表明可以有效提取出铜组分。

雾化沉积Cu-13.5％Sn合金的显微组织和力学性能研究

本文采用雾化沉积工艺制备了Cu-13.5 wt%Sn合金;研究其轧制性能;分析其轧制机理。结果表明:与传统铸造Cu-Sn合金相比,该合金晶粒细小,组织均匀,无宏观偏析,基体为单相α-Cu组织;Sn含量从8 wt.%上升到13.5 wt%;轧制后表现出良好的综合力学性能,强度和塑性随着形变量的不同在一个较宽的范围内变化,可以满足不同使用需求;具有高强度(>800 MPa)低弹性模量(～88 GPa)的特点。这在晶体金属材料领域是独一无二的,可以预测该合金将会在弹性元件领域具有广泛的应用前景。

磨粒真空预钎焊金刚石磨轮的研制及其加工性能分析

分别采用Cu-Sn-Ti合金、A合金稀释的Ni-Cr合金对金刚石真空预钎焊处理,将预钎焊磨粒与金属粉末混匀后热压烧结制作节块和磨轮,并进行磨轮对比磨削实验。由抗压强度、冲击韧性实验测试磨粒力学性能,由抗弯强度实验测试节块抗弯强度。由扫描电镜分析磨粒与胎体界面结合效果。结果表明:Cu基预钎焊磨粒预钎焊层分布均匀,力学性能比A-Ni基预钎焊磨粒提高;预钎焊节块抗弯强度高于常规节块;Cu基预钎焊磨粒与胎体结合致密,界面处Ti元素偏聚富集,Fe、Cu元素相互扩散,实现了牢固化学冶金结合;预钎焊磨轮加工性能明显优于常规磨轮,Cu基预钎焊磨轮锋利度比Ni基预钎焊磨轮提高约15%,实现了多层钎焊效果。

Dual solidification mechanisms of liquid ternary Fe-Cu-Sn alloy

Liquid ternary Fe47.5Cu47.5Sn5 alloy displayed dual solidification mechanisms when it was undercooled by up to 329 K （0.19TL）. Below a critical undercooling of about 196 K, it solidified just like a normal peritectic alloy, even though metastable phase separation occurred to a microscopic extent. Once bulk undercooling exceeds 196 K, macroscopic segregation played a domi- nant role in solidification. In both cases, the solidification process was always characterized by two successive peritectic trans- formations： firstly primary yFe dendrites reacted with liquid phase to form （Cu） phase, and subsequently the （Cu） phase reacted with residual liquid phase to yield β-Cu5.6Sn intermetallic compound. The primary yFe dendrites achieved a maximum growth velocity of 400 mm/s and experienced a growth kinetics transition as a result of macrosegregation. Since the （Cu） phase was both the product phase of the first peritectic transformation and also the reactant phase for the second peritectic transformation, it appeared as two layers in solidification microstructures due to the microsegregation of Sn solute. The boundary continuity between the macroscopically separated Fe-rich and Cu-ricb zones was enhanced with the increase of undercooling.