Cu-金刚石复合镀层的制备

采用复合电镀技术,在酸性硫酸盐镀铜电镀液中加入粒径为20μm的金刚石粉体制备Cu-金刚石复合镀层。通过正交试验优化Cu-金刚石复合电镀的工艺参数,采用扫描电镜(SEM)、能谱仪(EDS)和显微硬度计研究CuSO_4·5H_2O浓度、阴极电流密度、金刚石粉体浓度和镀液温度对镀层质量的影响。采用X射线分析仪(XRD)、扫描电镜(SEM)和摩擦实验机表征优化后复合镀层的相结构、表面形貌及摩擦性能。结果表明:优化的镀液组成和工艺参数为CuSO_4·5H_2O 190 g/L,H_2SO_4 60 g/L,阴极电流密度10 A/dm^2,金刚石粉体浓度20 g/L,镀液温度20℃;优化后的复合镀层晶粒均匀,金刚石粉体质量分数为21.50%,具有较好的显微硬度和摩擦性能。

Properties and microstructure of Cu/diamond composites prepared by spark plasma sintering method

Cu/diamond composites have been considered as the next generation of thermal management material for electronic packages and heat sinks applications. Cu/diamond composites with different volume fractions of diamond were successfully prepared by spark plasma sintering（SPS） method. The sintering temperatures and volume fractions（50%, 60% and 70%） of diamond were changed to investigate their effects on the relative density, homogeneity of the microstructure and thermal conductivity of the composites. The results show that the relative density, homogeneity of the microstructure and thermal conductivity of the composites increase with decreasing the diamond volume fraction; the relative density and thermal conductivity of the composites increase with increasing the sintering temperature. The thermal conductivity of the composites is a result of the combined effect of the volume fraction of diamond, the homogeneity and relative density of the composites.