微米级铜-银双金属粉镀层结构及其抗氧化性

The correlation of plating structure with the antioxygenation of micro Cu-Ag bimetallic powder was studied by SEM、XRD、TG and other means.It was found that copper powder plated with silver having an interspersion structure posesses antioxygenation at normal atmospheric temperature as surface Ag content reaches above 15.22%,the temperature of oxidation resistance varies with the surface Ag content.The greater the surface Ag content is,the higher the temperature of antioxygenation for bimetalic powder with the plating interspersion structure.The copper powder plated by silver with full packaging structure can not be oxidized even at

微米级镍-银双金属粉镀层结构及其抗氧化性

采用化学镀法在镍粉表面包覆一层金属银,然后将这种包覆粉进行真空热处理,即可制得具有抗氧化作用的微米级镍-银双金属粉末。用SEM、XRD、粒度分析和热重分析表征不同包覆厚度的双金属粉和原始镍粉的表面形貌、包覆结构及其抗氧化性。结果表明:镍粉表面包覆的银越多,双金属粉形状越规则,表面包覆层越致密,双金属粉的抗氧化温度也就越高,颗粒表面银含量为76%(质量分数,下同)时,其抗氧化温度可以达到850℃。