The high-temperature deformation behavior of Cu-Ni-Si-P alloy was investigated by using the hot compression test in the temperature range of 600-800 ℃ and strain rate of 0.01-5 s-1. The hot deformation activation ene...The high-temperature deformation behavior of Cu-Ni-Si-P alloy was investigated by using the hot compression test in the temperature range of 600-800 ℃ and strain rate of 0.01-5 s-1. The hot deformation activation energy, Q, was calculated and the hot compression constitutive equation was established. The processing maps of the alloy were constructed based on the experiment data and the forging process parameters were then optimized based on the generated maps for forging process determination. The flow behavior and the microstructural mechanism of the alloy were studied. The flow stress of the Cu-Ni-Si-P alloy increases with increasing strain rate and decreasing deformation temperature, and the dynamic recrystallization temperature of alloy is around 700 ℃. The hot deformation activation energy for dynamic recrystallization is determined as 485.6 kJ/mol. The processing maps for the alloy obtained at strains of 0.3 and 0.5 were used to predict the instability regimes occurring at the strain rate more than 1 s-1 and low temperature （〈650 ℃）. The optimum range for the alloy hot deformation processing in the safe domain obtained from the processing map is 750-800 ℃ at the strain rate of 0.01-0.1 s i The characteristic microstructures predicted from the processing map agree well with the results of microstructural observations.展开更多
基金Project(51101052) supported by the National Natural Science Foundation of China
文摘The high-temperature deformation behavior of Cu-Ni-Si-P alloy was investigated by using the hot compression test in the temperature range of 600-800 ℃ and strain rate of 0.01-5 s-1. The hot deformation activation energy, Q, was calculated and the hot compression constitutive equation was established. The processing maps of the alloy were constructed based on the experiment data and the forging process parameters were then optimized based on the generated maps for forging process determination. The flow behavior and the microstructural mechanism of the alloy were studied. The flow stress of the Cu-Ni-Si-P alloy increases with increasing strain rate and decreasing deformation temperature, and the dynamic recrystallization temperature of alloy is around 700 ℃. The hot deformation activation energy for dynamic recrystallization is determined as 485.6 kJ/mol. The processing maps for the alloy obtained at strains of 0.3 and 0.5 were used to predict the instability regimes occurring at the strain rate more than 1 s-1 and low temperature （〈650 ℃）. The optimum range for the alloy hot deformation processing in the safe domain obtained from the processing map is 750-800 ℃ at the strain rate of 0.01-0.1 s i The characteristic microstructures predicted from the processing map agree well with the results of microstructural observations.
文摘为全面掌握Cu-Ni-Si-P合金的加工特性及再结晶的退火制度,并指导产业化生产,对CuNi-Si-P合金的冷加工特性展开研究,且通过对不同厚度退火后试样进行抗拉强度、延伸率的测试和组织观察,确定出新型Cu-Ni-Si-P合金的再结晶退火制度.试验结果表明,Cu-Ni-Si-P合金具有明显的加工硬化特征;合金的抗拉强度随加工率的增大,呈先快速增大后趋于平稳的趋势,而延伸率和导电率,则呈现相反的变化规律;变形量越大,则相应的开始再结晶温度越低;综合优化出Cu-Ni-SiP合金在80%加工率的再结晶退火温度制度为460℃×1 h.
