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碳纳米管增强Cu-Ni复合镀层制备及其性能 被引量:4
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作者 樊艳娥 杨绿 +2 位作者 张进 吴怀超 王玥 《表面技术》 EI CAS CSCD 北大核心 2019年第12期114-124,共11页
目的提升Cu-Ni复合镀层的硬度、摩擦磨损与抗腐蚀性能。方法在五水硫酸铜镀液中添加六水合硫酸镍和碳纳米管(CNT),采用电共沉积方法制备Cu-Ni、Cu-Ni/CNT复合镀层。利用显微硬度测试仪、摩擦磨损试验机测试CNT增强复合镀层(Cu-Ni/CNT)... 目的提升Cu-Ni复合镀层的硬度、摩擦磨损与抗腐蚀性能。方法在五水硫酸铜镀液中添加六水合硫酸镍和碳纳米管(CNT),采用电共沉积方法制备Cu-Ni、Cu-Ni/CNT复合镀层。利用显微硬度测试仪、摩擦磨损试验机测试CNT增强复合镀层(Cu-Ni/CNT)的硬度和摩擦磨损性能。借助扫描电子显微镜(SEM)、能谱仪(EDS)表征镀层的表面形貌、元素分布及磨斑表面特征。在模拟海水(3.5%NaCl)溶液中测试镀层的电化学阻抗谱(Nyquist)和Tafel曲线。结果Ni、Cu共沉积时,更多Ni原子被Cu原子置换,镀层硬度相比于纯镍镀层略有下降,但是Cu-Ni固溶体形成后固溶强化使耐磨损性增强。CNT共沉积镶嵌在Cu-Ni复合镀层中,其晶粒细化和弥散强化效应使镀层硬度提高,在考察范围内,最高达到560.59HV。当Cu-Ni共沉积镀液中加入0.08%(质量分数)CNT时,复合镀层中CNT的物理屏蔽使其具有最高的腐蚀电位(-436.08 mV)、最低的自腐蚀速率与最好的抗腐蚀性能,其镀层电阻(Rc)为1573Ω·cm2;相比于纯Ni镀层,腐蚀抑制效率为95.86%;镀层平均摩擦系数最低,为0.52,耐磨性最佳。结论共沉积时,适当配比CNT的加入可有效增强Cu-Ni复合镀层的硬度、摩擦磨损性能和抗腐蚀性能。 展开更多
关键词 电沉积 CNT cu-ni复合镀层 显微硬度 摩擦磨损性能 抗腐蚀性能 电化学阻抗谱
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在碱性溶液中Cu-Ni合金镀层钝化膜的半导体性能研究 被引量:6
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作者 吴红艳 王毅 +3 位作者 钟庆东 周琼宇 朱振宇 杜海龙 《腐蚀科学与防护技术》 CAS CSCD 北大核心 2012年第5期385-391,共7页
用电化学方法测量Cu-Ni合金镀层在1 mol/L的NaOH溶液中的Tafel、EIS和Mott-Schottky曲线,研究了镀层钝化膜的电化学性能,并借助点缺陷模型(PDM)计算了钝化膜的受主浓度、平带电位及阳离子空位扩散系数.结果表明:Cu-Ni合金镀层表面钝化... 用电化学方法测量Cu-Ni合金镀层在1 mol/L的NaOH溶液中的Tafel、EIS和Mott-Schottky曲线,研究了镀层钝化膜的电化学性能,并借助点缺陷模型(PDM)计算了钝化膜的受主浓度、平带电位及阳离子空位扩散系数.结果表明:Cu-Ni合金镀层表面钝化膜具有p型半导体性质.受主浓度和平带电位随成膜电位的负移而增大.随着合金镀层Cu含量的增加,受主浓度和钝化膜阻抗减小,钝化膜耐蚀性降低.不同Cu含量的Cu-Ni合金镀层阳极氧化后的钝化膜阳离子空位扩散系数为10-14cm2/s. 展开更多
关键词 cu-ni镀层 钝化膜 极化 半导体性 扩散系数
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Corrosion properties of stainless steel 316L/Ni-Cu-P coatings in warm acidic solution
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作者 方信贤 周衡志 薛亚军 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2015年第8期2594-2600,共7页
In order to improve corrosion resistance of stainless steel 316L in warm acidic solution, Ni?Cu?P coatings with high copper and phosphorus contents were deposited onto stainless steel 316L substrates via electroless... In order to improve corrosion resistance of stainless steel 316L in warm acidic solution, Ni?Cu?P coatings with high copper and phosphorus contents were deposited onto stainless steel 316L substrates via electroless plating. The structure of the film and its resistance to corrosion in a warm acidic environment were investigated using scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), X-ray diffraction spectrometry (XRD), polarization curves, electrochemical impedance spectroscopy (EIS), and dipping corrosion tests, respectively. The results demonstrate that Ni?Cu?P coatings consist of two types of nodules, which are 19.98% Cu and 39.17% Cu (mass fraction) respectively. The corrosion resistance of the 316L substrate when subjected to a warm acidic solution is significantly improved by the addition of the new type of the Ni?Cu?P coating. The as-plated coatings demonstrate better corrosion resistance than annealed coatings. As-plated coatings and those annealed at 673 K are found to corrode selectively, while pitting is observed to be the main corrosion mechanism of coatings annealed at 773 and 873 K. 展开更多
关键词 Ni-Cu-P coating stainless steel 316L corrosion resistance corrosion mechanism warm acidic solution
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Wetting of molten Sn-3.5Ag-0.5Cu on Ni-P(-SiC) coatings deposited on high volume faction SiC/Al composite 被引量:5
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作者 Xiang-zhao ZHANG Xiao-lang WU +4 位作者 Gui-wu LIU Wen-qiang LUO Ya-jie GUO Hai-cheng SHAO Guan-jun QIAO 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2018年第9期1784-1792,共9页
The wetting of molten Sn-3.5Ag-0.5Cu alloy on the Ni-P(-SiC)coated SiCp/Al substrates was investigated by electroless Ni plating process,and the microstructures of the coating and the interfacial behavior of wetting s... The wetting of molten Sn-3.5Ag-0.5Cu alloy on the Ni-P(-SiC)coated SiCp/Al substrates was investigated by electroless Ni plating process,and the microstructures of the coating and the interfacial behavior of wetting systems were analyzed.The SiC particles are evenly distributed in the coating and enveloped with Ni.No reaction layer is observed at the coating/SiCp/Al composite interfaces.The contact angle increases from^19°with the Ni-P coating to 29°,43°and 113°with the corresponding Ni-P-3SiC,Ni-P-6SiC and Ni-P-9SiC coatings,respectively.An interaction layer containing Cu,Ni,Sn and P forms at the Sn-Ag-Cu/Ni-P-(0,3,6)SiC coated SiCp/Al interfaces,and the Cu-Ni-Sn and Ni-Sn-P phases are detected in the interaction layer.Moreover,the molten Sn-Ag-Cu can penetrate into the Ni-P(-SiC)coatings through the Ni-P/SiC interface and dissolve them to contact the SiCp/Al substrate. 展开更多
关键词 Ni coating Sn-Ag-Cu alloy SiCp/Al composite WETTING microstructures interface
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