在Gleeble 1500D热模拟机上对Al2O3/Cu-WC复合材料进行热压缩实验,研究变形温度为350-750℃、应变速率为0.01-5 s 1条件下的热变形行为。结果表明:Al2O3/Cu-WC复合材料高温流变应力—应变曲线主要以动态再结晶软化机制为特征,峰值应力...在Gleeble 1500D热模拟机上对Al2O3/Cu-WC复合材料进行热压缩实验,研究变形温度为350-750℃、应变速率为0.01-5 s 1条件下的热变形行为。结果表明:Al2O3/Cu-WC复合材料高温流变应力—应变曲线主要以动态再结晶软化机制为特征,峰值应力随变形温度的降低或应变速率的升高而增加;热变形过程中的稳态流变应力可用双曲正弦本构关系式来描述,其激活能为229.17 kJ/mol。根据材料动态模型,计算并建立Al2O3/Cu-WC复合材料的热加工图,据此确定热变形流变失稳区及热变形过程的最佳工艺参数,其热加工温度为650-750℃,应变速率为0.1-1 s 1。展开更多
The effects of additives(polyethylene glycol(PEG),sodium dodecyl sulfate(SDS))and WC nano-powder on the microstructure,relative density,hardness and electrical conductivity of electroplated WC−Cu composite were invest...The effects of additives(polyethylene glycol(PEG),sodium dodecyl sulfate(SDS))and WC nano-powder on the microstructure,relative density,hardness and electrical conductivity of electroplated WC−Cu composite were investigated.The preparation mechanism was also studied.The microstructure of samples was analyzed by XRD,SEM,EDS,TEM and HRTEM.The synergistic effect of PEG and SDS made the WC−Cu composite more compact during the electroplating process.The hardness of WC−Cu composites increased with the increase in WC content,while the electrical conductivity decreased with the increase in WC content.The density of samples tended to increase initially and then decreased with increase in the additive content.When the electroplating solution contained 10 g/L WC nanopowder,0.2 g/L PEG and 0.1 g/L SDS,the WC−Cu composite exhibited hardness of HV 221 and electric conductivity of 53.7 MS/m.Therefore,the results suggest that WC−Cu composite with excellent properties can be obtained by optimizing the content of additives and WC particles.展开更多
文摘在Gleeble 1500D热模拟机上对Al2O3/Cu-WC复合材料进行热压缩实验,研究变形温度为350-750℃、应变速率为0.01-5 s 1条件下的热变形行为。结果表明:Al2O3/Cu-WC复合材料高温流变应力—应变曲线主要以动态再结晶软化机制为特征,峰值应力随变形温度的降低或应变速率的升高而增加;热变形过程中的稳态流变应力可用双曲正弦本构关系式来描述,其激活能为229.17 kJ/mol。根据材料动态模型,计算并建立Al2O3/Cu-WC复合材料的热加工图,据此确定热变形流变失稳区及热变形过程的最佳工艺参数,其热加工温度为650-750℃,应变速率为0.1-1 s 1。
文摘The effects of additives(polyethylene glycol(PEG),sodium dodecyl sulfate(SDS))and WC nano-powder on the microstructure,relative density,hardness and electrical conductivity of electroplated WC−Cu composite were investigated.The preparation mechanism was also studied.The microstructure of samples was analyzed by XRD,SEM,EDS,TEM and HRTEM.The synergistic effect of PEG and SDS made the WC−Cu composite more compact during the electroplating process.The hardness of WC−Cu composites increased with the increase in WC content,while the electrical conductivity decreased with the increase in WC content.The density of samples tended to increase initially and then decreased with increase in the additive content.When the electroplating solution contained 10 g/L WC nanopowder,0.2 g/L PEG and 0.1 g/L SDS,the WC−Cu composite exhibited hardness of HV 221 and electric conductivity of 53.7 MS/m.Therefore,the results suggest that WC−Cu composite with excellent properties can be obtained by optimizing the content of additives and WC particles.
