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泡沫基材-Ni-石墨烯复合镀层制备及电催化析氢性能研究 被引量:1
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作者 秦海森 刘丽 +2 位作者 张凤 孙大明 彭云 《表面技术》 EI CAS CSCD 北大核心 2024年第2期221-229,共9页
目的 采用电沉积技术在泡沫基材上沉积制备Ni-石墨烯复合镀层,期望借助泡沫基材的三维多孔结构和石墨烯的超高比表面积来改变复合材料的表面状态,进而获得高镀层的电催化析氢性能。方法 采用电沉积技术将石墨烯作为第二相粒子沉积,制备... 目的 采用电沉积技术在泡沫基材上沉积制备Ni-石墨烯复合镀层,期望借助泡沫基材的三维多孔结构和石墨烯的超高比表面积来改变复合材料的表面状态,进而获得高镀层的电催化析氢性能。方法 采用电沉积技术将石墨烯作为第二相粒子沉积,制备了泡沫基材-Ni-石墨烯复合电极,通过SEM和EDS研究了其微观形貌及成分,并利用电化学工作站完成了镀层电极的极化曲线、交流阻抗和电解水稳定性测试,使用控制变量法探究了镀层厚度、镀液石墨烯浓度和基材形貌对镀层电催化析氢活性的影响。结果 SEM和EDS表征发现,镀层表面形貌受镀液中石墨烯浓度影响较大,石墨烯作为第二相嵌入镀层后,明显改变了复合镀层的表面形貌,其存在形态为颗粒状,在150 mg·L^(–1)时颗粒堆积最多。进一步利用电化学分析技术探究了镀层厚度、镀液石墨烯浓度和基材形貌对电极电催化析氢性能的影响,发现在一定范围内,不同厚度镀层的电催化析氢活性基本相同;石墨烯质量浓度为150mg·L^(–1)时制得的电极的电催化析氢性能最优,析氢过电位为211.2m V(vs.RHE),且电解水稳定性良好;泡沫基材镀层的电催化析氢活性明显优于平板基材镀层。结论 石墨烯的引入和泡沫基材三维多孔结构均增大了复合镀层的比表面积,是电极表现良好的电催化析氢活性的关键。 展开更多
关键词 电沉积 石墨烯 泡沫基材 ni基复合镀层 析氢活性
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ALLOYING EFFECT OF Ni AND Cr ON THE WETTABILITY OF COPPER ON W SUBSTRATE 被引量:5
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作者 X.H. Yang P. Xiao S.H. Liang J.T. Zou Z.K. Fan 《Acta Metallurgica Sinica(English Letters)》 SCIE EI CAS CSCD 2008年第5期369-379,共11页
By the sessile drop technique, the wettability of Cu/W systems with the additions of Ni and Cr has been studied under vacuum atmosphere. Effects of Ni and Cr contents and wetting temperatures on the wettability and th... By the sessile drop technique, the wettability of Cu/W systems with the additions of Ni and Cr has been studied under vacuum atmosphere. Effects of Ni and Cr contents and wetting temperatures on the wettability and the wetting mechanisms of copper on W substrate have been investigated in detail. The results show that the wetting angles of Cu on the W substrate are decreased with an increase in the content of Ni or Cr, and also decrease with raising the wetting temperatures. SEM, EPMA, and X-ray diffraction have been used to analyze the interracial characteristics of the CuNi/W and CuCr/W systems. The results reveal that there is a transition layer about 2- 3μm in the interface of Cu-4.0 wt pct Ni/W, in which the interrnetallic phase Ni4W is precipitated. As to CuCr/W system, no reaction occurs at the interface. The two factors are that the contents of Cr and Ni and the infiltration temperature must be chosen appropriately in order to control the interfacial dissolution and reaction when the Cu- W alloys are prepared by the infiltration method. 展开更多
关键词 WETTABILITY Contact angles Cu Cr ni W substrate
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Investigation on plasma-sprayed ZrO_2 thermal barrier coating on nickel alloy substrate 被引量:2
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作者 卢安贤 常鹰 蔡小梅 《Journal of Central South University of Technology》 EI 2002年第4期225-228,共4页
The thermal barrier coatings with NiCrAlY alloy bonding layer, NiCrAlY Y 2O 3 stabilized ZrO 2 transition layer and Y 2O 3 stabilized ZrO 2 ceramic layer are prepared on nickel alloy substrates using the plasma spray ... The thermal barrier coatings with NiCrAlY alloy bonding layer, NiCrAlY Y 2O 3 stabilized ZrO 2 transition layer and Y 2O 3 stabilized ZrO 2 ceramic layer are prepared on nickel alloy substrates using the plasma spray technique. The relationship among the composition, structure and property of the coatings are investiga ted by means of optical microscope, scanning electronic microscope and the experiments of thermal shock resistance cycling and high temperature oxidation resistance. The results show that the structure design of introdu cing a transition layer between Ni alloy substrate and ZrO 2 ceramic coating guarantees the high quality and properties of the coatings; ZrO 2 coatings doped with a little SiO 2 possesses better thermal shock resistance and more excellent hot corrosion resistance as compared with ZrO 2 coating materials without SiO 2 ;the improvement in performance of ZrO 2 coating doped with SiO 2 is due to forming more dense coating structure by self closing effects of the flaws and pores in the ZrO 2 coatings. 展开更多
关键词 plasma spray ni alloy substrate transition layer ZrO2 ceramic layer thermal barrier coating
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Microstructure of Ni /WC Surface Composite Layer on Gray Iron Substrate 被引量:2
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作者 杨贵荣 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS 2011年第5期861-866,共6页
The surface infiltrated composite (Ni/WC) layers on gray iron substrate were fabricated through a vacuum infiltration casting technique (VICT) using Ni-based composite powder with different WC particles content as... The surface infiltrated composite (Ni/WC) layers on gray iron substrate were fabricated through a vacuum infiltration casting technique (VICT) using Ni-based composite powder with different WC particles content as raw materials.The microstructures of surface infiltrated composite layer,the interface structures between surface composite layer and the substrate,the changes of macro-hardness with the increasing of WC content and the micro-hardness distribution are investigated.The infiltrated composite layer includes a surface composite layer and a transition layer,and the thickness of the transition layer decreases with the increasing content of WC.The thickness of transition layer with 20%WC content in the surface infiltrated composite layer was 170 μm which was the thickest for all transition layers with different WC content.The surface composite layer was mainly composed of WC,W2C,FeB and NiB,along with Ni-Cr-Fe,Ni (Cr) solid solution,Ni (Si) solid solution and Ni (Fe) solid solution.The transition layer was composed of Ni (Cr) solid solution,Ni (Fe) solid solution,Ni (Si) solid solution,Fe (Ni) solid solution and eutectic.The surface macro-hardness and micro-hardness of the infiltrated layer had been evaluated.The macro-hardness of the surface composite layer decreases with the WC content increasing,and the average macro-hardness is HRC60.The distribution of micro-hardness presents gradient change.The average micro-hardness of the infiltrated layer is about HV1000. 展开更多
关键词 ni/WC surface composite layer vacuum infiltration casting technique gray iron substrate MICROSTRUCTURE hardness of the infiltrated composite layer
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SAM AND XPS STUDIES ON SURFACE SEGREGATION OF SUBSTRATE ELEMENTS IN Au-Ni-KOVAR ALLOY SYSTEM 被引量:1
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作者 QI Yunxin TANG Wentai XIA Jianguo Nei Mongol Institute of Metallic Materials,Baotou,ChinaLI Wang ZHAN Zhenzong Institute of Physical and Chemical Engineering Research,Tianjin,China 《Acta Metallurgica Sinica(English Letters)》 SCIE EI CAS CSCD 1991年第9期219-224,共6页
The surface segregation of substrate elements through the Au layer in the Au-Ni-Kovar sys- tem specimens heated at 250—350℃ for 0.5—1.5 h has been studied by SAM and XPS. Visual evidence of the mechanism for Ni and... The surface segregation of substrate elements through the Au layer in the Au-Ni-Kovar sys- tem specimens heated at 250—350℃ for 0.5—1.5 h has been studied by SAM and XPS. Visual evidence of the mechanism for Ni and Co surface segregation of the complicated sys- tem has been given,i.e.Ni and Co penetrated the gold layer mainly by grain boundary diffu- sion and then covered the Au layer by surface diffusion.The strdy results of the chemical states of surface segregation elements not only indicate that oxygen adsorption and oxidation reaction are the driving force for the surface segregation of Ni and Co,but also show that the above segregation can result in water absorption on surfaces. 展开更多
关键词 Au-ni-Kovar alloy system surface segregation substrate element SAM XPS
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Preparation of CeO_2 Buffer Layer on Cube Textured Nickel Substrate by Reactive Sputtering
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作者 Zhang Hua Yang Jian Gu Hongwei Liu Huizhou Qu Fei 《Journal of Rare Earths》 SCIE EI CAS CSCD 2006年第2期205-205,共1页
The buffer layer CeO2 films were grown on cube textured metallic Ni substrates by using reactive magnetrun sputtering. Ar/H2 mixed atmosphere, which effectively inhibited the formation of NiO, was used as pre-depositi... The buffer layer CeO2 films were grown on cube textured metallic Ni substrates by using reactive magnetrun sputtering. Ar/H2 mixed atmosphere, which effectively inhibited the formation of NiO, was used as pre-depositing gas before CeO2 films were grown in Ar and 02. At 700 ℃ under the total pressure of 26 Pa,the pure c-axis orientation tilm was obtained. X-ray θ-2θscan, pole figure and φ-scan were used to observe the microstructure of the buffer layer. The resuits show that CeO2 film has strong cube texture and the FWHM is 9°. In addition, the CeO2 film is dense and crack-free. 展开更多
关键词 CeO2 buffer layer reactive sputtering cube texture ni substrate rare earths
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Deposition and characterization of YBCO/CeO2/YSZ/CeO2 multilayers on biaxially textured Ni substrates
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作者 王淑芳 赵嵩卿 +6 位作者 刘震 周岳亮 陈正豪 吕惠宾 金奎娟 程波林 杨国桢 《Chinese Physics B》 SCIE EI CAS CSCD 2006年第2期444-448,共5页
CeO2/YSZ/CeO2 buffer layers were deposited on biaxially textured Ni substrates by pulsed laser deposition. The influence of the processing parameters on the texture development of the seed layer CeO2 was investigated.... CeO2/YSZ/CeO2 buffer layers were deposited on biaxially textured Ni substrates by pulsed laser deposition. The influence of the processing parameters on the texture development of the seed layer CeO2 was investigated. Epitaxial films of YBCO were then grown in situ on the CeO2/YSZ (yttria-stabilized ZrO2)/CeO2-buffered Ni substrates. The resulting YBCO conductors exhibited self-fleld critical current density Jc of more than 1 MA/cm^2 at 77K and superconducting transition temperature Tc of about 91K. 展开更多
关键词 YBCO films buffer layers pulsed laser deposition biaxially textured ni substrates
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Mn_(3)O_(4)-Ni/C@FeOOH复合材料的界面构筑及其在电解水制氢中的应用
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作者 王清翔 邓腾 唐红梅 《能源研究与管理》 2024年第2期54-60,共7页
为制备一种高效、低能耗的电解水制氢催化剂,采用溶剂热法制备了Ni掺杂的前驱体Mn-Ni MIL,再通过高温热处理法将其碳化成Mn_(3)O_(4)-Ni/C基底,随后以水浴沉积法将无定型结构FeOOH超细颗粒负载在Mn_(3)O_(4)-Ni/C基底表面,得到同时含Mn... 为制备一种高效、低能耗的电解水制氢催化剂,采用溶剂热法制备了Ni掺杂的前驱体Mn-Ni MIL,再通过高温热处理法将其碳化成Mn_(3)O_(4)-Ni/C基底,随后以水浴沉积法将无定型结构FeOOH超细颗粒负载在Mn_(3)O_(4)-Ni/C基底表面,得到同时含Mn、Ni、Fe 3种金属元素的复合材料Mn_(3)O_(4)-Ni/C@FeOOH。基于Mn_(3)O_(4)-Ni/C@FeOOH复合材料的形貌和结构表征可知,其保留了前驱体的八面体形貌,其中Ni以金属单质形式均匀分布在碳质基底中,且FeOOH的负载保证了材料的高比表面积,为后续的催化反应提供充足的活性位点。电化学性能测试结果显示所得复合材料Mn_(3)O_(4)-Ni/C@FeOOH的碱性电解水阳极析氧催化活性优良,在驱动电流密度10 mA/cm2时所需的过电势为288 mV,与其复合前的单独组分Mn_(3)O_(4)-Ni/C(334 mV)和FeOOH(342 mV)相比,分别提升了14%和16%。通过界面构筑合成的Mn_(3)O_(4)-Ni/C@FeOOH复合材料具有低成本、长周期稳定的竞争优势,在商业应用方面前景广阔。 展开更多
关键词 Mn_(3)O_(4) ni掺杂 碳质基底 FEOOH 碱性电解水
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Fabrication of Y_2O_3 buffer layer on polished Ni substrates for YBCO superconducting tape
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作者 刘慧舟 杨坚 +2 位作者 屈飞 张华 古宏伟 《广东有色金属学报》 2005年第2期483-487,共5页
Highly cube textured Ni tapes are produced by heavy cold rolling and recrystallization annealing. The textured nickel tapes have been proven to be suitable substrates for YBCO superconducting tape. Nevertheless, rolli... Highly cube textured Ni tapes are produced by heavy cold rolling and recrystallization annealing. The textured nickel tapes have been proven to be suitable substrates for YBCO superconducting tape. Nevertheless, rolling damage and grain boundary grooves on Ni influence the epitaxial growth of highly textured buffer and YBCO layers. The polishing of the Ni substrate surface may play a crucial role in making it beneficial to epitaxial film deposition. In our work, several polishing methods were adopted on Ni to reduce the depth of rolling damage and grain boundary grooves. On the polished Ni substrates, textured Y2O3 buffer layers were deposited using RF sputtering. XRD results show that in-plane texture of Y2O3 films will minish with the decreasing of the Ni substrate surface roughness. AFM results show that average grain size of the Y2O3 film is biggest and surface is coarse in film on flatter Ni surface. 展开更多
关键词 超导体 缓冲器 Y2O3 退火处理
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Deposition of Diamond Films on Copper Substrate
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作者 马志斌 邬钦崇 +3 位作者 舒兴胜 汪建华 王传新 黎向锋 《Plasma Science and Technology》 SCIE EI CAS CSCD 2000年第2期207-212,共6页
The direct deposition of diamond films on copper substrate has been suffered fromadhesion problems due to the mismatch of the thermal expansion coefficients of diamond andcopper. In this paper nuclei with valuable den... The direct deposition of diamond films on copper substrate has been suffered fromadhesion problems due to the mismatch of the thermal expansion coefficients of diamond andcopper. In this paper nuclei with valuable density were directly introduced thirough a submicrondiamond powder layer. The diamond grits partially were buried in the copper substrate leadingto better adhesion. Another method with nickel intermediate layer for enhancing the adhesionwas studied here in detail. It was suggested that Cu-Ni eutectic between the copper substrate andNi interlayer might contribute to the adhesion improvement. The quality of the diamond filmsdeposited wlth rnckel interlayer was investigated by scanning electron microscopy and Ramanspectroscopy. 展开更多
关键词 ni OO Deposition of Diamond Films on Copper substrate
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SAC0307-xNi/Ni焊点的IMC及镍镀层的消耗 被引量:8
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作者 王玲玲 孙凤莲 +1 位作者 王丽凤 赵智力 《焊接学报》 EI CAS CSCD 北大核心 2009年第11期53-56,共4页
利用扫描电镜(SEM)对焊点SAC0307/Ni(Sn-0.3Ag-0.7Cu/Ni)和SAC0307-0.05Ni/Ni(Sn-0.3Ag-0.7Cu-0.05 Ni/Ni)经过180℃老化后的界面金属间化合物(IMC)的微观结构及镍镀层的消耗进行了研究.结果表明,回流焊后,SAC0307/Ni和SAC0307-0.05Ni/N... 利用扫描电镜(SEM)对焊点SAC0307/Ni(Sn-0.3Ag-0.7Cu/Ni)和SAC0307-0.05Ni/Ni(Sn-0.3Ag-0.7Cu-0.05 Ni/Ni)经过180℃老化后的界面金属间化合物(IMC)的微观结构及镍镀层的消耗进行了研究.结果表明,回流焊后,SAC0307/Ni和SAC0307-0.05Ni/Ni焊点的IMC层均为(Cu1-xNix)6Sn5,且随着老化时间的延长,IMC层的厚度均逐渐增加,化合物类型没有变化,但IMC的化学组成有所改变.SAC0307-0.05Ni/Ni焊点中IMC层形貌为蠕虫状,厚度比不加镍时有所降低.回流焊后两种钎料焊盘的镍层消耗几乎相同,但老化384 h后SAC0307/Ni的焊盘镍层的剩余厚度明显比SAC0307-0.05Ni/Ni的小.因此,钎料中添加适量的镍可以有效地降低焊盘镍层在时效过程中的消耗速率,即显著提高镍焊盘的抗老化能力. 展开更多
关键词 SAC0307-xni 钎料 镍盘 金属间化合物 老化
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YBCO厚膜用高变形率Ni基带中的加工和退火织构 被引量:5
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作者 刘春芳 吴宣 +5 位作者 王飞云 杨志军 冯勇 张平样 吴晓祖 周廉 《稀有金属材料与工程》 SCIE EI CAS CSCD 北大核心 1999年第5期269-272,共4页
系统研究了高变形率Ni基带中的加工和退火织构。用高纯Ni板(99.99%)为初始坯料进行高变形率室温轧制,加工率分别为80%,89%,93%和95%。对加工率为95%的试样在750℃,800℃,850℃,900℃,950℃和1000℃进行5h再结晶退火。用... 系统研究了高变形率Ni基带中的加工和退火织构。用高纯Ni板(99.99%)为初始坯料进行高变形率室温轧制,加工率分别为80%,89%,93%和95%。对加工率为95%的试样在750℃,800℃,850℃,900℃,950℃和1000℃进行5h再结晶退火。用X射线衍射、极图、取向分布函数等方法分析;讨论了Ni基带加工织相,再结晶退火织构的形成和发展。结果表明:随总冷加工率的增加,在Ni基带的加工织构中,沿β取向线的{112}<111>和{123}<634>织构成分增加,{110}<112>绿构成分较低;总冷加工率为95%的试样中,随再结晶退火温度的增加,立方级构的体积分数逐渐增加,φ扫描的FWHM变窄;当再结晶退火温度较低时,立方织相成分偏离正常位置12°~13°,随退火温度的增加,如在1000℃退火,立方织相成分偏离正常位置程度逐渐缩小,变成sharp立方织构。 展开更多
关键词 YBCO厚膜 高变形率 ni基带 加工 退火织构
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热处理对NiCrWB-WC复合涂层组织和性能的影响 被引量:6
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作者 伍超群 周克崧 +2 位作者 刘敏 邓畅光 邓春明 《金属热处理》 EI CAS CSCD 北大核心 2007年第7期47-50,共4页
采用超音速火焰喷涂技术(HVAF)在铜基体上制备了镍基-碳化钨复合涂层,用X射线衍射仪、光学显微镜、扫描电镜、MM-200型磨损试验机等分析研究了热处理前后涂层的组织结构变化、结合强度、硬度、耐磨性等性能。结果表明,随着热处理温度的... 采用超音速火焰喷涂技术(HVAF)在铜基体上制备了镍基-碳化钨复合涂层,用X射线衍射仪、光学显微镜、扫描电镜、MM-200型磨损试验机等分析研究了热处理前后涂层的组织结构变化、结合强度、硬度、耐磨性等性能。结果表明,随着热处理温度的提高,涂层中出现新的相组成,涂层与铜基体之间的结合由机械结合转变为冶金结合,涂层硬度和耐磨性有所增加,但两者无明显的线性关系。 展开更多
关键词 镍基复合涂层 超音速火焰喷涂技术(HVAF) 铜基体
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YBCO厚膜用立方织构Ni基带的X射线衍射研究 被引量:3
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作者 刘春芳 吴宣 +4 位作者 吴欢 冯勇 张平祥 吴晓祖 周廉 《稀有金属材料与工程》 SCIE EI CAS CSCD 北大核心 1998年第5期259-262,共4页
用冷轧和再结晶退火技术制备了YBCO超导厚膜用的立方织构Ni基带。并且,对所制备的立方织构Ni基带进行了X射线衍射研究。提出并讨论了Ni基带立方织构质量评价实验中容易出现的问题。
关键词 YBCO 厚膜 立方织构 X射线衍射 镍基带 超导体
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SU-8光刻胶与Ni基底结合性的分子模拟 被引量:4
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作者 杜立群 郭照沛 张晓蕾 《高分子材料科学与工程》 EI CAS CSCD 北大核心 2010年第3期168-171,共4页
运用分子动力学模拟软件Materials Studio针对SU-8胶与Ni基底的结合性进行模拟分析,计算了不同前烘温度下SU-8胶与Ni(100)面的结合能,发现在343K的前烘温度下,光刻胶与基底的界面结合能达到最大,说明此时界面结合最好。通过对SU-8胶与N... 运用分子动力学模拟软件Materials Studio针对SU-8胶与Ni基底的结合性进行模拟分析,计算了不同前烘温度下SU-8胶与Ni(100)面的结合能,发现在343K的前烘温度下,光刻胶与基底的界面结合能达到最大,说明此时界面结合最好。通过对SU-8胶与Ni基底的相互作用能分析,发现影响结合能的主要因素是两种分子之间的范德华力,其中色散力起主要作用,其值是排斥力的近两倍。 展开更多
关键词 SU-8光刻胶 ni基底 结合能 分子动力学模拟
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涂层导体用Ni-7%W合金基带的织构分析 被引量:2
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作者 祝永华 索红莉 +5 位作者 赵跃 高忙忙 马麟 高培阔 王建宏 周美玲 《中国有色金属学报》 EI CAS CSCD 北大核心 2009年第11期2024-2028,共5页
采用先进的放电等离子烧结技术(SPS)制备Ni7W合金初始坯锭,通过优化高能球磨和烧结工艺以及后续和热处理工艺制备出高度立方织构的Ni7W合金基带。利用电子背散射衍射(EBSD)技术对Ni7W合金基带的晶粒取向、晶界特征等信息进行采集和分析... 采用先进的放电等离子烧结技术(SPS)制备Ni7W合金初始坯锭,通过优化高能球磨和烧结工艺以及后续和热处理工艺制备出高度立方织构的Ni7W合金基带。利用电子背散射衍射(EBSD)技术对Ni7W合金基带的晶粒取向、晶界特征等信息进行采集和分析,对其织构进行了表征。该基带无需抛光,即可获得高花样质量的电子背散射衍射图像。EBSD测试结果表明:该Ni7W基带表面10°以内立方织构晶粒质量分数高达99.4%,10°以内晶界长度质量分数为93.6%,具有高质量的立方织构。 展开更多
关键词 ni-7%W基带(ni7W) 立方织构 涂层导体
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Ni-5%W合金基带的电化学抛光 被引量:3
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作者 朱海 吴向阳 +2 位作者 彭东辉 韩婕 徐静安 《电镀与精饰》 CAS 北大核心 2014年第7期16-19,共4页
为改善Ni-5%W合金基带表面质量,以磷酸-硫酸和添加剂为电解液,采用均匀实验设计方法进行电解抛光,利用原子力显微镜对样品表面形貌进行表征,并用DPS(Data Process System)软件对抛光结果进行逐步回归优化。结果表明,在室温下,采用磷酸(8... 为改善Ni-5%W合金基带表面质量,以磷酸-硫酸和添加剂为电解液,采用均匀实验设计方法进行电解抛光,利用原子力显微镜对样品表面形貌进行表征,并用DPS(Data Process System)软件对抛光结果进行逐步回归优化。结果表明,在室温下,采用磷酸(85%)、硫酸(98%)和有机添加剂,以体积比为4∶3∶3的抛光液抛光效果较好,抛光后基带表面均方根粗糙度在25μm×25μm范围内可降低到5nm以下。 展开更多
关键词 涂层导体 ni-5%W合金基带 电化学抛光 均匀设计
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放电等离子烧结法制备涂层导体用Ni合金复合长带 被引量:1
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作者 高培阔 索红莉 +5 位作者 高忙忙 赵跃 马麟 刘敏 王建宏 邱火勤 《中国有色金属学报》 EI CAS CSCD 北大核心 2010年第12期2387-2393,共7页
采用放电等离子烧结技术(SPS)制备出表层为Ni-5%W(摩尔分数)合金、芯层为Ni-12%W(摩尔分数)合金的复合坯锭,经热轧和冷轧后获得长度为10m的复合基带。结果表明:冷轧基带界面连接性良好,能够满足大变形量冷轧工艺的要求。对复合基带的厚... 采用放电等离子烧结技术(SPS)制备出表层为Ni-5%W(摩尔分数)合金、芯层为Ni-12%W(摩尔分数)合金的复合坯锭,经热轧和冷轧后获得长度为10m的复合基带。结果表明:冷轧基带界面连接性良好,能够满足大变形量冷轧工艺的要求。对复合基带的厚度及织构均匀性分析表明,在全长度范围内基带的厚度为(75±3)μm,其外层立方织构含量均在97%(<10°)以上,与商业化Ni5W基带水平相当。同时,对其力学性能与磁性能进行分析,结果表明复合长带的屈服强度为240MPa,饱和磁化强度仅为Ni5W基带的40%。采用复合坯锭路线在规模化生产高性能复合基带方面具有一定的应用潜力。 展开更多
关键词 复合基带 立方织构 涂层导体 ni合金基带
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国产Ni-5%W合金基带电化学抛光工艺优化研究 被引量:2
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作者 李志刚 朱海 +4 位作者 韩坤 韩婕 吴向阳 彭东辉 徐静安 《电镀与精饰》 CAS 北大核心 2015年第6期6-9,共4页
采用均匀实验设计方法,研究了Ni-5%W合金基带在磷酸-硫酸及添加剂体系中的电化学抛光工艺条件,利用DPS(Data Processing System)软件对抛光工艺进行逐步回归优化,同时根据回归后的特征方程组进行实验验证,并用金相显微镜、原子力显微镜... 采用均匀实验设计方法,研究了Ni-5%W合金基带在磷酸-硫酸及添加剂体系中的电化学抛光工艺条件,利用DPS(Data Processing System)软件对抛光工艺进行逐步回归优化,同时根据回归后的特征方程组进行实验验证,并用金相显微镜、原子力显微镜对基带表面形貌进行表征。结果表明,通过两次回归拟合,在25μm×25μm范围内,基带表面均方根粗糙度可降低到3 nm以下,且实验值与预报值相对误差为2.36%。 展开更多
关键词 ni-5%W合金基带 均匀设计 回归拟合 电化学抛光
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半固着磨具在非晶态Ni-Pd-P合金薄膜铜片衬底精密研磨中的应用 被引量:3
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作者 邓乾发 袁巨龙 +2 位作者 文东辉 陶黎 王志伟 《表面技术》 EI CAS CSCD 北大核心 2009年第4期1-3,6,共4页
非晶态Ni-Pd-P合金薄膜具有非常好的热传导性和耐磨性,因而被广泛用作防护镀层。铜片由于其良好的导电性能被选为生长非晶态Ni-Pd-P合金薄膜的衬底材料。主要研究半固着磨具精密研磨非晶态Ni-Pd-P合金薄膜铜片衬底,以铜片衬底的表面粗... 非晶态Ni-Pd-P合金薄膜具有非常好的热传导性和耐磨性,因而被广泛用作防护镀层。铜片由于其良好的导电性能被选为生长非晶态Ni-Pd-P合金薄膜的衬底材料。主要研究半固着磨具精密研磨非晶态Ni-Pd-P合金薄膜铜片衬底,以铜片衬底的表面粗糙度和材料去除率为评价指标,探讨了研磨过程中不同的工艺参数对铜片表面粗糙度和材料去除率的影响。结果表明:用800#SiC半固着磨具对铜片衬底进行研磨加工,10min后铜片表面粗糙度Ra可由0.553μm减小到0.28μm,同时表面无深划痕。加工后的铜片再经金刚石研磨膏抛光可快速获得满足Ni-Pd-P合金薄膜生长用的铜片衬底表面。 展开更多
关键词 铜片衬底 半固着磨具 表面粗糙度 材料去除率 ni—Pd—P合金 薄膜
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