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Ga掺杂对Cu_3SbSe_4热电性能的影响 被引量:4
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作者 陈萝娜 刘叶烽 +4 位作者 张继业 杨炯 邢娟娟 骆军 张文清 《物理学报》 SCIE EI CAS CSCD 北大核心 2017年第16期231-238,共8页
采用熔融-淬火方法制备了Cu_(2.95)Ga_xSb_(1-x)Se_4(x=0,0.01,0.02和0.04)样品,系统地研究了Ga在Sb位掺杂对Cu_3SbSe_4热电性能的影响.研究结果表明,少量的Ga掺杂(x=0.01)可以有效提高空穴浓度,抑制本征激发,改善样品的电输运性能.掺G... 采用熔融-淬火方法制备了Cu_(2.95)Ga_xSb_(1-x)Se_4(x=0,0.01,0.02和0.04)样品,系统地研究了Ga在Sb位掺杂对Cu_3SbSe_4热电性能的影响.研究结果表明,少量的Ga掺杂(x=0.01)可以有效提高空穴浓度,抑制本征激发,改善样品的电输运性能.掺Ga样品在625 K时功率因子达到最大值10μW/cm·K^2,比未掺Ga的Cu_(2.95)SbSe_4样品提高了约一倍.但是随着Ga掺杂浓度的进一步提高,缺陷对载流子的散射增强,同时载流子有效质量增大,导致载流子迁移率急剧下降.因此Ga含量增加反而使样品的电性能恶化.在热输运方面,Ga掺杂可以有效降低双极扩散对热导率的贡献,同时掺杂引入的点缺陷对高频声子有较强的散射作用,因此高温区的热导率明显降低.最终该体系在664 K时获得最大ZT值0.53,比未掺Ga的样品提高了近50%. 展开更多
关键词 Ga掺杂 cu3sbse4 热电性能
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Enhanced figure of merit for famatinite Cu_(3)SbSe_(4)via band structure tuning and hierarchical architecture
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作者 Lijun Zhao Haolin Ye +9 位作者 Xinmeng Wu Jian Yang Lihua Yu Zhongqi Shi Shahid Hussain Guanjun Qiao Junhua Xu Bangzhi Ge Li Wang Chongjian Zhou 《Journal of Materiomics》 SCIE CSCD 2023年第6期1263-1272,共10页
The p-type Te-free Cu_(3)SbSe_(4)with famatinite structure is a potential candidate for thermoelectric materials due to the low cost and eco-friendly constituent elements.However,its strong bipolar effect and high lat... The p-type Te-free Cu_(3)SbSe_(4)with famatinite structure is a potential candidate for thermoelectric materials due to the low cost and eco-friendly constituent elements.However,its strong bipolar effect and high lattice thermal conductivity(klat)are the main challenges for its performance enhancement.Herein,we report a new strategy to enhance its figure of merit zT~0.86 at 673 K for Cu_(3)Sb_(0.95)Fe_(0.05)Se_(2.8)S_(1.2)via band structure tuning and hierarchical architecture.Firstly,S substituted Se atoms in lattice can widen the band gap to alleviate the bipolar effect.Secondly,Fe doping in Sb site significantly increases the density of states,thus increasing the carrier effective mass,and obtaining a remarkably high Seebeck coefficient of~560 mV/K at 300 K.Moreover,the induced hierarchical architecture defects resulting in a minimum klat of~0.48 W·m^(-1)·K^(-1)at 673 K.Consequently,the improved Seebeck coefficient combined with low thermal conductivity leads to an enhanced zT. 展开更多
关键词 cu3sbse4-Based materials DEFECTS Band gap Thermoelectric properties Solid solution
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