热处理对CuMoCr合金力学性能的影响

测试了CuMoCr经不同工艺热处理后的力学性能,并利用金相及透射电镜(TEM)对合金的组织进行分析,研究了热处理对力学性能的影响。结果表明:热处理能改变合金的硬度,而对冲击韧度影响不大,该合金经500℃×3 h时效后可获得较高硬度。

时效处理对CuMoCr合金硬度及导电率的影响

测试了时效处理前后CuMoCr合金的硬度及导电率,探讨了时效处理对CuMoCr合金硬度及导电率的影响。结果表明:时效处理能改变CuMoCr合金的硬度和导电率,当该合金经500℃保温4h时效后可获得较高硬度和导电率,其值分别为227HV和24.6 MS/m。

Influence of deformation and heat treatment on electrical conductivity of CuMoCr alloy

The solution heat treatment,cold deformation and subsequent aging were performed on CuMoCr alloy.And the influence of deformation and aging treatment on the electrical conductivity of CuMoCr alloy was studied through metallograph,transmission electron microscopy(TEM) and electrical conductivity measurement.Results show that deformation without subsequent aging can reduce the electrical conductivity of CuMoCr alloy,but deformation followed by the optimum aging treatment can effectively improve the electrical conductivity of CuMoCr alloy.Aging at 500 ℃ for 4 h after 80% deformation,the much better electrical conductivity of CuMoCr alloy can be obtained.Reduction of Cr content in the Cu matrix could be the reason for the enhancement of electrical conductivity.

高压真空断路器用熔渗法CuMoCr触头材料的制备工艺

介绍了高压真空断路器用熔渗法CuMoCr触头材料的制备工艺。研究了原材料预处理温度对Cu粉、Mo粉含氧量的影响,以及Cu粉与MoCr粉的混合比例对熔渗后坯件体积变化的影响,并对结果进行了分析。