Compound casting is an efficient method for bonding dissimilar metals,in which a dramatic reaction can occur between the melt and solid.The centrifugal casting process,a type of compound casting,was applied to cast Al...Compound casting is an efficient method for bonding dissimilar metals,in which a dramatic reaction can occur between the melt and solid.The centrifugal casting process,a type of compound casting,was applied to cast Al/Mg dissimilar bimetals.Magnesium melt was poured at 700 °C,with melt-to-solid volume ratios(Vm/Vs) of 1.5 and 3,into a preheated hollow aluminum cylinder.The preheating temperatures of the solid part were 320,400,and 450 °C,and the constant rotational speed was 1,600 rpm.The cast parts were kept inside the casting machine until reaching the cooling temperature of 150 °C.The result showed that an increase in preheating temperature from 320 to 450 °C led to an enhanced reaction layer thickness.In addition,an increase in the Vm/Vs from 1.5 to 3 resulted in raising the interface thickness from 1.2 to 1.8 mm.Moreover,the interface was not continuously formed when a Vm/Vs of 3 was selected.In this case,the force of contraction overcame the resultant acting force on the interface.An interface formed at the volume ratio of 1.5 was examined using scanning electron microscopy(SEM) equipped with energy-dispersive X-ray spectroscopy(EDS),and the results demonstrated the formation of Al_(3)Mg_(2),Al_(12)Mg_(17) and(δ+Al_(12)Mg_(17)) eutectic structures in the interface.展开更多
The interface structure and electronic properties of Fe(110)/Al(110) are investigated by the first-principles plane-wave pseudopotential method. The interface segregation position of Si and Mg is determined, and the e...The interface structure and electronic properties of Fe(110)/Al(110) are investigated by the first-principles plane-wave pseudopotential method. The interface segregation position of Si and Mg is determined, and the effect of Mg and Si on the interface binding of Fe(110)/Al(110) is analyzed by combining the work of separation and charge density. The results show that the Fe(110)/Al(110) interface energy of FeHollow coordination is smaller and the interface structure is more stable. The Fe(110)/Al(110) interface separation surface in the form of Fe-Hollow coordination appears at the sub interface layer on the side of Al(110)near the interface. The interface structure of Mg and Si segregation is similar to that of undoped alloy elements.The calculations also suggest that Mg and Si segregate on the Al(110) side of the interface and occupy the Al lattice on the Al(110) side. The segregation of Mg and Si elements will reduce the interface binding, primarily because the Fe-Si bond and Fe-Mg bond are weaker than Fe-Al bond.展开更多
A Fe/Al clad tube was prepared by explosive welding.Then the bonding characteristic of the interface was investigated by compression,flattening and compression-shear test.The test results exhibit that the clad tubes p...A Fe/Al clad tube was prepared by explosive welding.Then the bonding characteristic of the interface was investigated by compression,flattening and compression-shear test.The test results exhibit that the clad tubes possessing good bonding interface have higher shear strength than that of pure aluminum and can bear both axial and radial deformation.The original interface between aluminum layer and ferrite layer was observed by scanning electron microscopy(SEM).The results show that the clad tubes with good bonding properties possess the interface in wave and straight shape.The Fe/Al clad tube was used to manufacture the T-shape by hydro-bulging.It is found that the good-bonding interface of the Fe/Al clad tube plays a dominant role in the formation of the T-shape.展开更多
35% SiCp/2024 Al(volume fraction) composite was prepared by powder metallurgy method. The microstructures of Si Cp/Al interfaces and precipitate phase/Al interfaces were characterized by HRTEM, and the interface con...35% SiCp/2024 Al(volume fraction) composite was prepared by powder metallurgy method. The microstructures of Si Cp/Al interfaces and precipitate phase/Al interfaces were characterized by HRTEM, and the interface conditions were evaluated by tensile modules of elasticity and Brinell hardness measurement. The results show that the overall Si Cp/Al interface condition in this experiment is good and three kinds of Si Cp/Al interfaces are present in the composites, which include vast majority of clean planer interfaces, few slight reaction interfaces and tiny amorphous interfaces. The combination mechanism of Si C and Al in the clean planer interface is the formation of a semi-coherent interface by closely matching of atoms and there are no fixed or preferential crystallographic orientation relationships between Si C and Al. MgAl2O4 spinel particles act as an intermediate to form semi-coherent interface with SiC and Al respectively at the slight reaction interfaces. When the composite is aged at 190 °C for 9 h after being solution-treated at 510 °C for 2 h, numerous discoid-shaped and needle-shaped nanosized precipitates dispersively exist in the composite and are semi-coherent of low mismatch with Al matrix. The Brinell hardness of composites arrives peak value at this time.展开更多
A nickel-based coating was deposited on the pure Al substrate by immersion plating,and the Al/Cu bimetals were prepared by diffusion bonding in the temperature range of 450-550 ℃.The interce microstructure and fractu...A nickel-based coating was deposited on the pure Al substrate by immersion plating,and the Al/Cu bimetals were prepared by diffusion bonding in the temperature range of 450-550 ℃.The interce microstructure and fracture surface of Al/Cu joints were studied by scanning electron microscopy(SEM) and X-ray diffraction(XRD).The mechanical properties of the Al/Cu bimetals were measured by tensile shear and microhardness tests.The results show that the Ni interiayer can effectively eliminate the formation of Al-Cu intermetallic compounds.The Al/Ni interface consists of the Al3Ni and Al3Ni2 phases,while it is Ni-Cu solid solution at the Ni/Cu interce.The tensile shear strength of the joints is improved by the addition of Ni interiayer.The joint with Ni interiayer annealed at 500 ℃ exhibits a maximum value of tensile shear strength of 34.7 MPa.展开更多
Mg/Al bimetal combines the advantages of both aluminum and magnesium and has broad application prospects in automotive, aerospace,weapons, digital products and so on. The compound casting has the characteristics of lo...Mg/Al bimetal combines the advantages of both aluminum and magnesium and has broad application prospects in automotive, aerospace,weapons, digital products and so on. The compound casting has the characteristics of low cost, easy to achieve metallurgical combination and suitable for the preparation of complex bimetallic parts. However, bimetallic joint strength is low due to differences of physical properties between Al and Mg, oxide film on metallic surface and interfacial Al-Mg IMCs, which is closely related to the interfacial microstructure and properties. Therefore, how to control the interface of the bimetal to achieve performance enhancement is the focus and difficulty in this field. At present, there are mainly the following strengthening methods. First, the “zincate galvanizing” and “electrolytic polishing+anodic oxidation” technology were exert on the surface of Al alloy to remove and break the oxide film, which improved the wettability between Al and Mg. Second, the undesirable Al-Mg IMCs were reduce or elimination by adding the interlayers(Zn, Ni and Ni-Cu). Thirdly, the evolution process of interfacial microstructure was changed and fine strengthening phases were formed by adding Si element to Al alloy or rare earth element to Mg alloy. Fourthly, mechanical vibration and ultrasonic vibration were applied in the process of the filling and solidification to refine and homogenize the interfacial structure. Finally, some other methods, including secondary rolling, thermal modification, heat treatment and constructing exterior 3D morphology, also can be used to regulate the interfacial microstructure and compositions. The above strengthening methods can be used alone or in combination to achieve bimetallic strengthening. Finally, the future development direction of the Mg/Al bimetal is prospected, which provides some new ideas for the development and application of the Mg/Al bimetal.展开更多
The matrix accumulative roll bonding technology (MARB) can improve the matrix performance of metal composite and strengthen the bonding quality of the interface./n this research, for the fwst time, the technology of...The matrix accumulative roll bonding technology (MARB) can improve the matrix performance of metal composite and strengthen the bonding quality of the interface./n this research, for the fwst time, the technology of MARB was proposed. A sound Cu/AI bonding composite was obtained using the MARB process and the bonding characteristic of the interface was studied using scanning electricity microscope (SEM) and energy-dispersive spectroscopy (EDS). The result indicated that accumulation cycles and diffusion annealing temperature were the most important factors for fabricating a Cu/AI composite material. The substrate aluminum was strengthened by MARB, and a high quality Cu/AI composite with sound interface was obtained as well.展开更多
Cu/Al bar clad material was fabricated by a drawing process and a subsequent heat treatment.During these processes,intermetallic compounds have been formed at the interface of Cu/Al and have affected its bonding prope...Cu/Al bar clad material was fabricated by a drawing process and a subsequent heat treatment.During these processes,intermetallic compounds have been formed at the interface of Cu/Al and have affected its bonding property.Microstructures of Cu/Al interfaces were observed by OM,SEM and EDX Analyser in order to investigate the bonding properties of the material.According to the microstructure a series of diffusion layers were observed at the interface and the thicknesses of diffusion layers have increased with aging time as a result of the diffusion bonding.The interfaces were composed of 3-ply diffusion layers and their compositions were changed with aging time at 400 °C.These compositional compounds were revealed to be η2,(θ+η2),(α+θ) intermetallic phases.It is evident from V-notch impact tests that the growth of the brittle diffusion layers with the increasing aging time directly influenced delamination distance between the Cu sleeve and the Al core.It is suggested that the proper holding time at 400 °C for aging as post heat treatment of a drawn Cu/Al bar clad material would be within 1 h.展开更多
The properties of Sc-dopedθ′(Al_(2)Cu)/Al interface in Al−Cu alloys were investigated by first-principles calculations.Sc-doped semi-coherent and coherentθ′(Al_(2)Cu)/Al interfaces(Sc doped in Al slab(S1 site),Sc ...The properties of Sc-dopedθ′(Al_(2)Cu)/Al interface in Al−Cu alloys were investigated by first-principles calculations.Sc-doped semi-coherent and coherentθ′(Al_(2)Cu)/Al interfaces(Sc doped in Al slab(S1 site),Sc doped inθ′slab(S2 site))were modeled based on calculated results and reported experiments.Through the analysis of interfacial bonding strength,it is revealed that the doping of Sc at S1 site can significantly decrease the interface energy and increase the work of adhesion.In particular,the doped coherent interface with Sc at S1 site which is occupied by interstitial Cu atoms has very good bonding strength.The electronic structure shows the strong Al—Cu bonds at the interfaces with Sc at S1 site,and the Al—Al bonds at the interfaces with Sc at S2 site are formed.The formation of strong Al—Cu and Al—Al bonds plays an important role in the enhancement of doped interface strength.展开更多
Cu/Al clad strips are prepared using solid?liquid cast-rolling bonding(SLCRB)technique with a d160mm×150mm twin-roll experimental caster.The extent of interfacial reactions,composition of the reaction products,an...Cu/Al clad strips are prepared using solid?liquid cast-rolling bonding(SLCRB)technique with a d160mm×150mm twin-roll experimental caster.The extent of interfacial reactions,composition of the reaction products,and their micro-morphology evolution in the SLCRB process are investigated with scanning electron microscope(SEM),energy dispersive spectrometer(EDS),and X-ray diffraction(XRD).In the casting pool,initial aluminized coating is first generated on the copper strip surface,with the diffusion layer mainly consisting ofα(Al)+CuAl2and growing at high temperatures,with the maximum thickness of10μm.After sequent rolling below the kiss point,the diffusion layer is broken by severe elongation,which leads to an additional crack bond process with a fresh interface of virgin base metal.The average thickness is reduced from10to5μm.The reaction products,CuAl2,CuAl,and Cu9Al4,are dispersed along the rolling direction.Peeling and bending test results indicate that the fracture occurs in the aluminum substrate,and the morphology is a dimple pattern.No crack or separation is found at the bonding interface after90°-180°bending.The presented method provides an economical way to fabricate Cu/Al clad strip directly.展开更多
The microstructural characteristic of 1070AI matrix composites reinforced by 0.15 祄 AI2O3 particles whose volume fraction was 40% was investigated by TEM and HREM. The results showed that the interface between the ma...The microstructural characteristic of 1070AI matrix composites reinforced by 0.15 祄 AI2O3 particles whose volume fraction was 40% was investigated by TEM and HREM. The results showed that the interface between the matrix and reinforcements was clean and bonded well, without any interfacial reaction products. There were some preferential crystallographic orientation relationships between Al matrix and AI2O3 particle because of the lattice imperfection on the surface of Al2O3 particles.展开更多
TiAl is diffusion bonded with Ti, TC4 Alloy and 40Cr Steel by heating in vacuum, and analysis of interfaces shows stratified Ti 3Al forms in TiAl/Ti interface closest to TiAl base, and the α phase and the α+β phase...TiAl is diffusion bonded with Ti, TC4 Alloy and 40Cr Steel by heating in vacuum, and analysis of interfaces shows stratified Ti 3Al forms in TiAl/Ti interface closest to TiAl base, and the α phase and the α+β phase arise closest to Ti base at lower temperature and higher temperature respectively; Structure of TiAl/TC4 interface is TiAl/γ+α 2/Ti 3Al/α-Ti/TC4 at lower temperature and TiAl/γ+β+α 2/TC4 at high temperature; in TiAl/40Cr steel interface, obvious decarbonised layer on steel side while TiC and reaction phase with Fe Al Ti system form on TiAl side.展开更多
Phase structure characteristics near the interface of Fe3Al/Q235 diffusion bonding are investigated by means of X raydiffraction (XRD), transmission electronic microscope (TEM) and electron diffraction, etc. The test ...Phase structure characteristics near the interface of Fe3Al/Q235 diffusion bonding are investigated by means of X raydiffraction (XRD), transmission electronic microscope (TEM) and electron diffraction, etc. The test results indicatedthat obviously a diffusion transition zone forms near the interface of Fe3Al/Q235 under the condition of heatingtemperature 1050~1100℃, holding time 60 min and pressure 9.8 MPa, which indicated that the diffusion interfaceof Fe3Al/Q235 was combined well. The diffusion transition zone consisted of Fe3Al and a-Fe(Al) solid solution.Microhardness near the diffusion transition zone was HM 480~540. There was not brittle phase of high hardness inthe interface transition zone. This is favorable to enhance toughness of Fe3Al/Q235 diffusion joint.展开更多
文摘Compound casting is an efficient method for bonding dissimilar metals,in which a dramatic reaction can occur between the melt and solid.The centrifugal casting process,a type of compound casting,was applied to cast Al/Mg dissimilar bimetals.Magnesium melt was poured at 700 °C,with melt-to-solid volume ratios(Vm/Vs) of 1.5 and 3,into a preheated hollow aluminum cylinder.The preheating temperatures of the solid part were 320,400,and 450 °C,and the constant rotational speed was 1,600 rpm.The cast parts were kept inside the casting machine until reaching the cooling temperature of 150 °C.The result showed that an increase in preheating temperature from 320 to 450 °C led to an enhanced reaction layer thickness.In addition,an increase in the Vm/Vs from 1.5 to 3 resulted in raising the interface thickness from 1.2 to 1.8 mm.Moreover,the interface was not continuously formed when a Vm/Vs of 3 was selected.In this case,the force of contraction overcame the resultant acting force on the interface.An interface formed at the volume ratio of 1.5 was examined using scanning electron microscopy(SEM) equipped with energy-dispersive X-ray spectroscopy(EDS),and the results demonstrated the formation of Al_(3)Mg_(2),Al_(12)Mg_(17) and(δ+Al_(12)Mg_(17)) eutectic structures in the interface.
基金the National Natural Science Foundation of China(No.51871030)the Higher Education Science Foundation of Jiangsu Province of China (No.17KJA430006)。
文摘The interface structure and electronic properties of Fe(110)/Al(110) are investigated by the first-principles plane-wave pseudopotential method. The interface segregation position of Si and Mg is determined, and the effect of Mg and Si on the interface binding of Fe(110)/Al(110) is analyzed by combining the work of separation and charge density. The results show that the Fe(110)/Al(110) interface energy of FeHollow coordination is smaller and the interface structure is more stable. The Fe(110)/Al(110) interface separation surface in the form of Fe-Hollow coordination appears at the sub interface layer on the side of Al(110)near the interface. The interface structure of Mg and Si segregation is similar to that of undoped alloy elements.The calculations also suggest that Mg and Si segregate on the Al(110) side of the interface and occupy the Al lattice on the Al(110) side. The segregation of Mg and Si elements will reduce the interface binding, primarily because the Fe-Si bond and Fe-Mg bond are weaker than Fe-Al bond.
基金Project(BA2006067)supported by Achievement Transitional Foundation of Jiangsu Province,China
文摘A Fe/Al clad tube was prepared by explosive welding.Then the bonding characteristic of the interface was investigated by compression,flattening and compression-shear test.The test results exhibit that the clad tubes possessing good bonding interface have higher shear strength than that of pure aluminum and can bear both axial and radial deformation.The original interface between aluminum layer and ferrite layer was observed by scanning electron microscopy(SEM).The results show that the clad tubes with good bonding properties possess the interface in wave and straight shape.The Fe/Al clad tube was used to manufacture the T-shape by hydro-bulging.It is found that the good-bonding interface of the Fe/Al clad tube plays a dominant role in the formation of the T-shape.
基金Project(51371077)supported by the National Natural Science Foundation of China
文摘35% SiCp/2024 Al(volume fraction) composite was prepared by powder metallurgy method. The microstructures of Si Cp/Al interfaces and precipitate phase/Al interfaces were characterized by HRTEM, and the interface conditions were evaluated by tensile modules of elasticity and Brinell hardness measurement. The results show that the overall Si Cp/Al interface condition in this experiment is good and three kinds of Si Cp/Al interfaces are present in the composites, which include vast majority of clean planer interfaces, few slight reaction interfaces and tiny amorphous interfaces. The combination mechanism of Si C and Al in the clean planer interface is the formation of a semi-coherent interface by closely matching of atoms and there are no fixed or preferential crystallographic orientation relationships between Si C and Al. MgAl2O4 spinel particles act as an intermediate to form semi-coherent interface with SiC and Al respectively at the slight reaction interfaces. When the composite is aged at 190 °C for 9 h after being solution-treated at 510 °C for 2 h, numerous discoid-shaped and needle-shaped nanosized precipitates dispersively exist in the composite and are semi-coherent of low mismatch with Al matrix. The Brinell hardness of composites arrives peak value at this time.
基金Projects (51274054,51375070,51271042) supported by the National Natural Science Foundation of ChinaProjects (2013M530913) supported by the China Postdoctoral Science Foundation
文摘A nickel-based coating was deposited on the pure Al substrate by immersion plating,and the Al/Cu bimetals were prepared by diffusion bonding in the temperature range of 450-550 ℃.The interce microstructure and fracture surface of Al/Cu joints were studied by scanning electron microscopy(SEM) and X-ray diffraction(XRD).The mechanical properties of the Al/Cu bimetals were measured by tensile shear and microhardness tests.The results show that the Ni interiayer can effectively eliminate the formation of Al-Cu intermetallic compounds.The Al/Ni interface consists of the Al3Ni and Al3Ni2 phases,while it is Ni-Cu solid solution at the Ni/Cu interce.The tensile shear strength of the joints is improved by the addition of Ni interiayer.The joint with Ni interiayer annealed at 500 ℃ exhibits a maximum value of tensile shear strength of 34.7 MPa.
基金the supports provided by the National Natural Science Foundation of China (Grant Nos.52271102,52075198 and 52205359)the China Post-doctoral Science Foundation (Grant No.2021M691112)the Analytical and Testing Center,HUST。
文摘Mg/Al bimetal combines the advantages of both aluminum and magnesium and has broad application prospects in automotive, aerospace,weapons, digital products and so on. The compound casting has the characteristics of low cost, easy to achieve metallurgical combination and suitable for the preparation of complex bimetallic parts. However, bimetallic joint strength is low due to differences of physical properties between Al and Mg, oxide film on metallic surface and interfacial Al-Mg IMCs, which is closely related to the interfacial microstructure and properties. Therefore, how to control the interface of the bimetal to achieve performance enhancement is the focus and difficulty in this field. At present, there are mainly the following strengthening methods. First, the “zincate galvanizing” and “electrolytic polishing+anodic oxidation” technology were exert on the surface of Al alloy to remove and break the oxide film, which improved the wettability between Al and Mg. Second, the undesirable Al-Mg IMCs were reduce or elimination by adding the interlayers(Zn, Ni and Ni-Cu). Thirdly, the evolution process of interfacial microstructure was changed and fine strengthening phases were formed by adding Si element to Al alloy or rare earth element to Mg alloy. Fourthly, mechanical vibration and ultrasonic vibration were applied in the process of the filling and solidification to refine and homogenize the interfacial structure. Finally, some other methods, including secondary rolling, thermal modification, heat treatment and constructing exterior 3D morphology, also can be used to regulate the interfacial microstructure and compositions. The above strengthening methods can be used alone or in combination to achieve bimetallic strengthening. Finally, the future development direction of the Mg/Al bimetal is prospected, which provides some new ideas for the development and application of the Mg/Al bimetal.
基金the National Natural Science Foundation of China (No. 50375019).
文摘The matrix accumulative roll bonding technology (MARB) can improve the matrix performance of metal composite and strengthen the bonding quality of the interface./n this research, for the fwst time, the technology of MARB was proposed. A sound Cu/AI bonding composite was obtained using the MARB process and the bonding characteristic of the interface was studied using scanning electricity microscope (SEM) and energy-dispersive spectroscopy (EDS). The result indicated that accumulation cycles and diffusion annealing temperature were the most important factors for fabricating a Cu/AI composite material. The substrate aluminum was strengthened by MARB, and a high quality Cu/AI composite with sound interface was obtained as well.
基金Project supported by the Fundamental Materials Development funded by the Korean Ministry of Knowledge Economy
文摘Cu/Al bar clad material was fabricated by a drawing process and a subsequent heat treatment.During these processes,intermetallic compounds have been formed at the interface of Cu/Al and have affected its bonding property.Microstructures of Cu/Al interfaces were observed by OM,SEM and EDX Analyser in order to investigate the bonding properties of the material.According to the microstructure a series of diffusion layers were observed at the interface and the thicknesses of diffusion layers have increased with aging time as a result of the diffusion bonding.The interfaces were composed of 3-ply diffusion layers and their compositions were changed with aging time at 400 °C.These compositional compounds were revealed to be η2,(θ+η2),(α+θ) intermetallic phases.It is evident from V-notch impact tests that the growth of the brittle diffusion layers with the increasing aging time directly influenced delamination distance between the Cu sleeve and the Al core.It is suggested that the proper holding time at 400 °C for aging as post heat treatment of a drawn Cu/Al bar clad material would be within 1 h.
基金the financia supports from the National Key Research and Development Program of China (No. 2019YFB2006500)the National Natura Science Foundation of China (Nos. 52171024 51771234, 51601228)。
文摘The properties of Sc-dopedθ′(Al_(2)Cu)/Al interface in Al−Cu alloys were investigated by first-principles calculations.Sc-doped semi-coherent and coherentθ′(Al_(2)Cu)/Al interfaces(Sc doped in Al slab(S1 site),Sc doped inθ′slab(S2 site))were modeled based on calculated results and reported experiments.Through the analysis of interfacial bonding strength,it is revealed that the doping of Sc at S1 site can significantly decrease the interface energy and increase the work of adhesion.In particular,the doped coherent interface with Sc at S1 site which is occupied by interstitial Cu atoms has very good bonding strength.The electronic structure shows the strong Al—Cu bonds at the interfaces with Sc at S1 site,and the Al—Al bonds at the interfaces with Sc at S2 site are formed.The formation of strong Al—Cu and Al—Al bonds plays an important role in the enhancement of doped interface strength.
基金Project(51474189)supported by the National Natural Science Foundation of ChinaProject(QN2015214)supported by the Educational Commission of Hebei Province,China
文摘Cu/Al clad strips are prepared using solid?liquid cast-rolling bonding(SLCRB)technique with a d160mm×150mm twin-roll experimental caster.The extent of interfacial reactions,composition of the reaction products,and their micro-morphology evolution in the SLCRB process are investigated with scanning electron microscope(SEM),energy dispersive spectrometer(EDS),and X-ray diffraction(XRD).In the casting pool,initial aluminized coating is first generated on the copper strip surface,with the diffusion layer mainly consisting ofα(Al)+CuAl2and growing at high temperatures,with the maximum thickness of10μm.After sequent rolling below the kiss point,the diffusion layer is broken by severe elongation,which leads to an additional crack bond process with a fresh interface of virgin base metal.The average thickness is reduced from10to5μm.The reaction products,CuAl2,CuAl,and Cu9Al4,are dispersed along the rolling direction.Peeling and bending test results indicate that the fracture occurs in the aluminum substrate,and the morphology is a dimple pattern.No crack or separation is found at the bonding interface after90°-180°bending.The presented method provides an economical way to fabricate Cu/Al clad strip directly.
基金This research is supported by the National Natural Science Foundation of China (under Grant No.59771014 and No.50071019). The help of the National Advanced Material Open Research Lab of Tsinghua University is gratefully acknowledged.
文摘The microstructural characteristic of 1070AI matrix composites reinforced by 0.15 祄 AI2O3 particles whose volume fraction was 40% was investigated by TEM and HREM. The results showed that the interface between the matrix and reinforcements was clean and bonded well, without any interfacial reaction products. There were some preferential crystallographic orientation relationships between Al matrix and AI2O3 particle because of the lattice imperfection on the surface of Al2O3 particles.
文摘TiAl is diffusion bonded with Ti, TC4 Alloy and 40Cr Steel by heating in vacuum, and analysis of interfaces shows stratified Ti 3Al forms in TiAl/Ti interface closest to TiAl base, and the α phase and the α+β phase arise closest to Ti base at lower temperature and higher temperature respectively; Structure of TiAl/TC4 interface is TiAl/γ+α 2/Ti 3Al/α-Ti/TC4 at lower temperature and TiAl/γ+β+α 2/TC4 at high temperature; in TiAl/40Cr steel interface, obvious decarbonised layer on steel side while TiC and reaction phase with Fe Al Ti system form on TiAl side.
基金The work was supported by the Visiting Scholar Foundation of National Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, People's Republic of China.
文摘Phase structure characteristics near the interface of Fe3Al/Q235 diffusion bonding are investigated by means of X raydiffraction (XRD), transmission electronic microscope (TEM) and electron diffraction, etc. The test results indicatedthat obviously a diffusion transition zone forms near the interface of Fe3Al/Q235 under the condition of heatingtemperature 1050~1100℃, holding time 60 min and pressure 9.8 MPa, which indicated that the diffusion interfaceof Fe3Al/Q235 was combined well. The diffusion transition zone consisted of Fe3Al and a-Fe(Al) solid solution.Microhardness near the diffusion transition zone was HM 480~540. There was not brittle phase of high hardness inthe interface transition zone. This is favorable to enhance toughness of Fe3Al/Q235 diffusion joint.