Structural and mechanical properties of CuZr/AlN nanocomposites

Powder metallurgy method was used to prepare copper alloy nanocomposites （CuZr/AlN） with high strength and conductivity. Optical microscopy, high-resolution transmission electron microscopy and other methods were adopted to study the impact of different sintering technologies on the structural and mechanical properties as well as the impact of solution and aging treatments on the mechanical properties of CuZr/AlN. The result shows that the specimen has a dense structure, and the size of the crystal grain is around 0.2 μm. The Brinell hardness of the specimen increases with the increase in re-pressing pressure and sintering temperature. The Brinell hardness of specimen also increases with the increase in zirconium content. However, above 0.5%（mass fraction） of zirconium content, the Brinell hardness of the nanocomposites is reduced. The buckling strength of the specimens increases with the increase in re-pressing pressure and sintering temperature. The buckling strength is the highest when the zirconium content is 0.5%. The Brinell hardness is lower after solution and aging treatments at 900 ℃. The Brinell hardness of the CuZr/AlN series specimen after the aging treatment at 500 ℃ or 600 ℃ increases. The specimen was also over aged at 700 ℃.

磁控溅射AlN/Cu纳米复合涂层的性能研究

采用双靶反应磁控溅射方法制备了Cu含量不同的AlN/Cu纳米复合涂层。采用X射线衍射(XRD)、纳米压痕、X射线光电子能谱(XPS)等方法观察和分析了涂层的结构、力学性能以及内部化学结合状态。XRD结果表明所有涂层中的AlN均为(002)择优取向的六方纤锌矿结构,Cu含量≥4.7%原子比涂层中可以观察到Cu(111)峰的存在。纳米压痕结果表明:Cu含量的多少影响涂层的力学性能,如硬度H、弹性模量E。Cu含量为17.0%时,H=27.3 GPa、E=264.9 GPa,H/E=0.103;随着压入深度从80 nm增加至250 nm,弹性回复值从78.2%降至67.9%。XPS分析表明:对于17.0%Cu含量的涂层而言,电子结合能位于73.5,932.3和933.4 eV处的峰分别对应着Al-N键、Cu-Cu键和Cu-Al键。Cu-Al键的存在说明AlN相与Cu相在两相界面处存在一定的相互化学作用。

高强高导纳米复合材料Cu AlN的组织与力学性能研究（英文）

采用粉末冶金方法制备高强高导铜合金基纳米复合材料(Cu/AlN),用光学显微镜、TEM和SEM等方法研究不同工艺条件如温度、压力、复压压力及复烧温度对复合材料组织与性能的影响。结果表明:烧结后的试样密度随压力、烧结温度的升高而增大;试样布氏硬度随复压制压力和烧结温度的升高而升高;试样布氏硬度开始随着纳米AlN颗粒的含量增加而升高,但当纳米AlN颗粒质量分数大于0.5%时,复合材料的布氏硬度开始下降。试样的抗弯强度随复压制压力和烧结温度的升高而提高。