A physics-based analytical expression that predicts the charge,electrical field and potential distributions along the gated region of the GaN HEMT channel has been developed.Unlike the gradual channel approximation(GC...A physics-based analytical expression that predicts the charge,electrical field and potential distributions along the gated region of the GaN HEMT channel has been developed.Unlike the gradual channel approximation(GCA),the proposed model considers the non-uniform variation of the concentration under the gated region as a function of terminal applied volt-ages.In addition,the model can capture the influence of mobility and channel temperature on the charge distribution trend.The comparison with the hydrodynamic(HD)numerical simulation showed a high agreement of the proposed model with numerical data for different bias conditions considering the self-heating and quantization of the electron concentration.The ana-lytical nature of the model allows us to reduce the computational and time cost of the simulation.Also,it can be used as a core expression to develop a complete physics-based transistorⅣmodel without GCA limitation.展开更多
A Si doped AlGaN/GaN HEMT structure with high Al content (x=43%) in the barrier layer is grown on sapphire substrate by RF-MBE.The structural and electrical properties of the heterostructure are investigated by the tr...A Si doped AlGaN/GaN HEMT structure with high Al content (x=43%) in the barrier layer is grown on sapphire substrate by RF-MBE.The structural and electrical properties of the heterostructure are investigated by the triple axis X-ray diffraction and Van der Pauw-Hall measurement,respectively.The observed prominent Bragg peaks of the GaN and AlGaN and the Hall results show that the structure is of high quality with smooth interface.The high 2DEG mobility in excess of 1260cm2/(V·s) is achieved with an electron density of 1.429×10 13cm -2 at 297K,corresponding to a sheet-density-mobility product of 1.8×10 16V -1·s -1.Devices based on the structure are fabricated and characterized.Better DC characteristics,maximum drain current of 1.0A/mm and extrinsic transconductance of 218mS/mm are obtained when compared with HEMTs fabricated using structures with lower Al mole fraction in the AlGaN barrier layer.The results suggest that the high Al content in the AlGaN barrier layer is promising in improving material electrical properties and device performance.展开更多
Electrical properties of an AIlnN/GaN high-electron mobility transistor (HEMT) on a sapphire substrate are investigated in a cryogenic temperature range from 295 K down to 50 K. It is shown that drain saturation cur...Electrical properties of an AIlnN/GaN high-electron mobility transistor (HEMT) on a sapphire substrate are investigated in a cryogenic temperature range from 295 K down to 50 K. It is shown that drain saturation current and conductance increase as transistor operation temperature decreases. A self-heating effect is observed over the entire range of temperature under high power consumption. The dependence of channel electron mobility on electron density is investigated in detail. It is found that aside from Coulomb scattering, electrons that have been pushed away from the AIInN/GaN interface into the bulk GaN substrate at a large reverse gate voltage are also responsible for the electron mobility drop with the decrease of electron density.展开更多
Nano Technology is the branch of technology that deals with dimensions and tolerances in terms of nanometers. In this paper, the electrical characteristics analysis is determined for the Nano-GaN HEMT and Micro-GaN HE...Nano Technology is the branch of technology that deals with dimensions and tolerances in terms of nanometers. In this paper, the electrical characteristics analysis is determined for the Nano-GaN HEMT and Micro-GaN HEMT and also power spectrum density is determined for GaN Nano-HEMT by reducing the gate length Lg in nm range. The GaN Nano HEMT is producing high current comparing to Micro GaN HEMT. Accuracy of the proposed analytical model results is verified with simulation results.展开更多
In this paper, we propose a two-dimensional(2D) analytic model for the channel potential and electric field distribution of the RESURF AlGaN/GaN high electron mobility transistors(HEMTs). The model is constructed by t...In this paper, we propose a two-dimensional(2D) analytic model for the channel potential and electric field distribution of the RESURF AlGaN/GaN high electron mobility transistors(HEMTs). The model is constructed by two-dimensional Poisson's equation with appropriate boundary conditions. In the RESURF AlGaN/GaN HEMTs, we utilize the RESURF effect generated by doped negative charge in the AlGaN layer and introduce new electric field peaks in the device channels,thus, homogenizing the distribution of electric field in channel and improving the breakdown voltage of the device. In order to reveal the influence of doped negative charge on the electric field distribution, we demonstrate in detail the influences of the charge doping density and doping position on the potential and electric field distribution of the RESURF AlGaN/GaN HEMTs with double low density drain(LDD). The validity of the model is verified by comparing the results obtained from the analytical model with the simulation results from the ISE software. This analysis method gives a physical insight into the mechanism of the AlGaN/GaN HEMTs and provides reference to modeling other AlGaN/GaN HEMTs device.展开更多
A new surface-potential-based model for A1GaN/A1N/GaN high electron mobility transistor (HEMT) is proposed in this paper. Since the high polarization effects caused by AlN interlayer favorably influence the two dime...A new surface-potential-based model for A1GaN/A1N/GaN high electron mobility transistor (HEMT) is proposed in this paper. Since the high polarization effects caused by AlN interlayer favorably influence the two dimensional electron gas (2DEG) and scattering mechanisms, we first add spontaneous and piezoelectric charge terms to the source equation of surface-potential, and a mobility model for A1GaN/A1N/GaN HEMT is rewritten. Compared with TCAD simulations, the DC characteristics of A1GaN/AIN/GaN HEMT are faithfully reproduced by the new model.展开更多
A complete and accurate surface potential based large-signal model for compound semiconductor HEMTs is presented. A surface potential equation resembling the one used in conventional MOSFET models is achieved. The ana...A complete and accurate surface potential based large-signal model for compound semiconductor HEMTs is presented. A surface potential equation resembling the one used in conventional MOSFET models is achieved. The analytic solutions from the traditional surface potential theory that developed in MOSFET models are inherited. For core model derivation, a novel method is used to realize a direct application of the standard surfacepotentialmodelofMOSFETsforHEMTmodeling,withoutbreakingthemathematicstructure.Thehigh-order derivatives of I–V /C–V remain continuous, making the model suitable for RF large-signal applications. Furthermore, the self-heating effects and the transconductance dispersion are also modelled. The model has been verified through comparison with measured DC IV, Gummel symmetry test, CV, minimum noise figure, small-signal Sparameters up to 66 GHz and single-tone input power sweep at 29 GHz for a 475 m0.1 m InGaAs/GaAs power pHEMT, fabricated at a commercial foundry.展开更多
We carry out a thermal storage research on GaN HEMT at 350℃for 48 h,and a recess phenomenon is observed in the low voltage section of Schottky forward characteristics.The decrease of 2DEG density will be responsible ...We carry out a thermal storage research on GaN HEMT at 350℃for 48 h,and a recess phenomenon is observed in the low voltage section of Schottky forward characteristics.The decrease of 2DEG density will be responsible for the recess phenomenon.Because the conventional method is not suitable for this kind of curve,a revised approach is presented by analyzing the back-to-back Schottky junction energy band to extract Schottky parameters, which leads to a consistent fit effect.展开更多
In this paper, a charge sheet surface potential based model for strained-Si nMOSFETs is presented and validated with numerical simulation. The model considers sub band splitting in the 2-DEG at the top heterointerface...In this paper, a charge sheet surface potential based model for strained-Si nMOSFETs is presented and validated with numerical simulation. The model considers sub band splitting in the 2-DEG at the top heterointerface in SiGe layer and also the dependence of electron concentration at heterointerface with the gate oxide. The model is scalable with strained-Si material parameters with physically derived flat-band voltages. An explicit relation for surface potential as a function of terminal voltages is developed. The model is derived from regional charge-based approach, where regional solutions are physically derived. The model gives an accurate description of drain current both in the weak and strong inversion regions of operation. The results obtained from the model developed are benchmarked with commercial numerical device simulator and is found to be in excellent agreement.展开更多
In this paper, we present a two-dimensional (2D) fully analytical model with consideration of polarization effect for the channel potential and electric field distributions of the gate field-plated high electron mob...In this paper, we present a two-dimensional (2D) fully analytical model with consideration of polarization effect for the channel potential and electric field distributions of the gate field-plated high electron mobility transistor (FP-HEMT) on the basis of 2D Poisson's solution. The dependences of the channel potential and electric field distributions on drain bias, polarization charge density, FP structure parameters, A1GaN/GaN material parameters, etc. are investigated. A simple and convenient approach to designing high breakdown voltage FP-HEMTs is also proposed. The validity of this model is demonstrated by comparison with the numerical simulations with Silvaco-Atlas. The method in this paper can be extended to the development of other analytical models for different device structures, such as MIS-HEMTs, multiple-FP HETMs, slant-FP HEMTs, etc.展开更多
A new depletion-mode gate recessed A1GaN/InGaN/GaN-high electron mobility transistor (HEMT) with 10 nm thickness of InGaN-channel is proposed. A growth of A1GaN over GaN leads to the formation of two- dimensional el...A new depletion-mode gate recessed A1GaN/InGaN/GaN-high electron mobility transistor (HEMT) with 10 nm thickness of InGaN-channel is proposed. A growth of A1GaN over GaN leads to the formation of two- dimensional electron gas (2DEG) at the heterointerface. High 2DEG density (ns) is achieved at the heterointerface due to a strain induced piezoelectric effect between A1GaN and GaN layers. The electrons are confined in the InGaN-channel without spilling over into the buffer layer, which also reduces the buffer leakage current. From the input transfer characteristics the threshold voltage is obtained as -4.5 V and the device conducts a current of 2 A/mm at a drain voltage of 10 V. The device also shows a maximum output current density of 1.8 A/ram at Vds of 3 V. The microwave characteristics like transconductance, cut-off frequency, max frequency of oscillation and Mason's Unilateral Gain of the device are studied by AC small-signal analysis using a two-port network. The stability and power performance of the device are analyzed by the Smith chart and polar plots respectively. To our knowledge this proposed InGaN-channel HEMT structure is the first of its kind.展开更多
The performance of AlInSb/InSb heterostructure with various parameters is considered with T-Cad simulation.As the heterojunctions are having more advantageous properties that is a real support for so many application ...The performance of AlInSb/InSb heterostructure with various parameters is considered with T-Cad simulation.As the heterojunctions are having more advantageous properties that is a real support for so many application such as solar cells,semiconductor cells and transistors.Special properties of semiconductors are discussed here with various parameters that are depending up on the performance of accurate device[Pardeshi H.,Pati S.K.,Raj G.,Mohankumar N.,Sarkar C.K.,J.Semicond.33(12):124001-1–124001-7,2012].The maximum drain current density is achieved with improving the density of two-dimensional electron gas(2DEG)and with high velocity.High electron mobility transistor(HEMT)structure is used with the different combinations of layers which have different bandgaps.Parameters such as electron mobility,bandgap,dielectric constant,etc.,are considered differently for each layer[Zhang A.,Zhang L.,Tang Z.,IEEE Trans.Electron Devices 61(3):755–761,2014].The high electron mobility electrons are now widely used in so many applications.The proposed work of AlInSb/InSb heterostructure implements the same process which will be a promise for future research works.展开更多
基金This work was supported by the National Natural Science Foundation of China(NSFC)under Grant 61774141.
文摘A physics-based analytical expression that predicts the charge,electrical field and potential distributions along the gated region of the GaN HEMT channel has been developed.Unlike the gradual channel approximation(GCA),the proposed model considers the non-uniform variation of the concentration under the gated region as a function of terminal applied volt-ages.In addition,the model can capture the influence of mobility and channel temperature on the charge distribution trend.The comparison with the hydrodynamic(HD)numerical simulation showed a high agreement of the proposed model with numerical data for different bias conditions considering the self-heating and quantization of the electron concentration.The ana-lytical nature of the model allows us to reduce the computational and time cost of the simulation.Also,it can be used as a core expression to develop a complete physics-based transistorⅣmodel without GCA limitation.
文摘A Si doped AlGaN/GaN HEMT structure with high Al content (x=43%) in the barrier layer is grown on sapphire substrate by RF-MBE.The structural and electrical properties of the heterostructure are investigated by the triple axis X-ray diffraction and Van der Pauw-Hall measurement,respectively.The observed prominent Bragg peaks of the GaN and AlGaN and the Hall results show that the structure is of high quality with smooth interface.The high 2DEG mobility in excess of 1260cm2/(V·s) is achieved with an electron density of 1.429×10 13cm -2 at 297K,corresponding to a sheet-density-mobility product of 1.8×10 16V -1·s -1.Devices based on the structure are fabricated and characterized.Better DC characteristics,maximum drain current of 1.0A/mm and extrinsic transconductance of 218mS/mm are obtained when compared with HEMTs fabricated using structures with lower Al mole fraction in the AlGaN barrier layer.The results suggest that the high Al content in the AlGaN barrier layer is promising in improving material electrical properties and device performance.
基金Project supported by the National Natural Science Foundation of China (Grant No. 61204018)
文摘Electrical properties of an AIlnN/GaN high-electron mobility transistor (HEMT) on a sapphire substrate are investigated in a cryogenic temperature range from 295 K down to 50 K. It is shown that drain saturation current and conductance increase as transistor operation temperature decreases. A self-heating effect is observed over the entire range of temperature under high power consumption. The dependence of channel electron mobility on electron density is investigated in detail. It is found that aside from Coulomb scattering, electrons that have been pushed away from the AIInN/GaN interface into the bulk GaN substrate at a large reverse gate voltage are also responsible for the electron mobility drop with the decrease of electron density.
文摘Nano Technology is the branch of technology that deals with dimensions and tolerances in terms of nanometers. In this paper, the electrical characteristics analysis is determined for the Nano-GaN HEMT and Micro-GaN HEMT and also power spectrum density is determined for GaN Nano-HEMT by reducing the gate length Lg in nm range. The GaN Nano HEMT is producing high current comparing to Micro GaN HEMT. Accuracy of the proposed analytical model results is verified with simulation results.
基金Project supported by the National Basic Research Program of China(Grant No.2015CB351906)the National Natural Science Foundation of China(Grant No.61774114)+1 种基金the Key Program of the National Natural Science Foundation of China(Grant No.61334002)the 111 Project,China(Grant No.B12026)
文摘In this paper, we propose a two-dimensional(2D) analytic model for the channel potential and electric field distribution of the RESURF AlGaN/GaN high electron mobility transistors(HEMTs). The model is constructed by two-dimensional Poisson's equation with appropriate boundary conditions. In the RESURF AlGaN/GaN HEMTs, we utilize the RESURF effect generated by doped negative charge in the AlGaN layer and introduce new electric field peaks in the device channels,thus, homogenizing the distribution of electric field in channel and improving the breakdown voltage of the device. In order to reveal the influence of doped negative charge on the electric field distribution, we demonstrate in detail the influences of the charge doping density and doping position on the potential and electric field distribution of the RESURF AlGaN/GaN HEMTs with double low density drain(LDD). The validity of the model is verified by comparing the results obtained from the analytical model with the simulation results from the ISE software. This analysis method gives a physical insight into the mechanism of the AlGaN/GaN HEMTs and provides reference to modeling other AlGaN/GaN HEMTs device.
基金supported by the Major State Basic Research Development Program of China(No.2010CB327403)the Zhejiang Provincial Key Science and Technology Innovation Team(No.Gk110908002)the National Science Foundation of China(No.61102027)
文摘A new surface-potential-based model for A1GaN/A1N/GaN high electron mobility transistor (HEMT) is proposed in this paper. Since the high polarization effects caused by AlN interlayer favorably influence the two dimensional electron gas (2DEG) and scattering mechanisms, we first add spontaneous and piezoelectric charge terms to the source equation of surface-potential, and a mobility model for A1GaN/A1N/GaN HEMT is rewritten. Compared with TCAD simulations, the DC characteristics of A1GaN/AIN/GaN HEMT are faithfully reproduced by the new model.
文摘A complete and accurate surface potential based large-signal model for compound semiconductor HEMTs is presented. A surface potential equation resembling the one used in conventional MOSFET models is achieved. The analytic solutions from the traditional surface potential theory that developed in MOSFET models are inherited. For core model derivation, a novel method is used to realize a direct application of the standard surfacepotentialmodelofMOSFETsforHEMTmodeling,withoutbreakingthemathematicstructure.Thehigh-order derivatives of I–V /C–V remain continuous, making the model suitable for RF large-signal applications. Furthermore, the self-heating effects and the transconductance dispersion are also modelled. The model has been verified through comparison with measured DC IV, Gummel symmetry test, CV, minimum noise figure, small-signal Sparameters up to 66 GHz and single-tone input power sweep at 29 GHz for a 475 m0.1 m InGaAs/GaAs power pHEMT, fabricated at a commercial foundry.
基金Project supported by the National Natural Science Foundation of China(Nos.60890191,60976059)the National Basic Research Program of China(No.2010CB327500).
文摘We carry out a thermal storage research on GaN HEMT at 350℃for 48 h,and a recess phenomenon is observed in the low voltage section of Schottky forward characteristics.The decrease of 2DEG density will be responsible for the recess phenomenon.Because the conventional method is not suitable for this kind of curve,a revised approach is presented by analyzing the back-to-back Schottky junction energy band to extract Schottky parameters, which leads to a consistent fit effect.
文摘In this paper, a charge sheet surface potential based model for strained-Si nMOSFETs is presented and validated with numerical simulation. The model considers sub band splitting in the 2-DEG at the top heterointerface in SiGe layer and also the dependence of electron concentration at heterointerface with the gate oxide. The model is scalable with strained-Si material parameters with physically derived flat-band voltages. An explicit relation for surface potential as a function of terminal voltages is developed. The model is derived from regional charge-based approach, where regional solutions are physically derived. The model gives an accurate description of drain current both in the weak and strong inversion regions of operation. The results obtained from the model developed are benchmarked with commercial numerical device simulator and is found to be in excellent agreement.
基金Project supported by the National Natural Science Foundation of China(Grant Nos.61204085 and 61334002)the Fundamental Research Funds for the Central Universities,China(Grant No.K5051225013)
文摘In this paper, we present a two-dimensional (2D) fully analytical model with consideration of polarization effect for the channel potential and electric field distributions of the gate field-plated high electron mobility transistor (FP-HEMT) on the basis of 2D Poisson's solution. The dependences of the channel potential and electric field distributions on drain bias, polarization charge density, FP structure parameters, A1GaN/GaN material parameters, etc. are investigated. A simple and convenient approach to designing high breakdown voltage FP-HEMTs is also proposed. The validity of this model is demonstrated by comparison with the numerical simulations with Silvaco-Atlas. The method in this paper can be extended to the development of other analytical models for different device structures, such as MIS-HEMTs, multiple-FP HETMs, slant-FP HEMTs, etc.
文摘A new depletion-mode gate recessed A1GaN/InGaN/GaN-high electron mobility transistor (HEMT) with 10 nm thickness of InGaN-channel is proposed. A growth of A1GaN over GaN leads to the formation of two- dimensional electron gas (2DEG) at the heterointerface. High 2DEG density (ns) is achieved at the heterointerface due to a strain induced piezoelectric effect between A1GaN and GaN layers. The electrons are confined in the InGaN-channel without spilling over into the buffer layer, which also reduces the buffer leakage current. From the input transfer characteristics the threshold voltage is obtained as -4.5 V and the device conducts a current of 2 A/mm at a drain voltage of 10 V. The device also shows a maximum output current density of 1.8 A/ram at Vds of 3 V. The microwave characteristics like transconductance, cut-off frequency, max frequency of oscillation and Mason's Unilateral Gain of the device are studied by AC small-signal analysis using a two-port network. The stability and power performance of the device are analyzed by the Smith chart and polar plots respectively. To our knowledge this proposed InGaN-channel HEMT structure is the first of its kind.
文摘The performance of AlInSb/InSb heterostructure with various parameters is considered with T-Cad simulation.As the heterojunctions are having more advantageous properties that is a real support for so many application such as solar cells,semiconductor cells and transistors.Special properties of semiconductors are discussed here with various parameters that are depending up on the performance of accurate device[Pardeshi H.,Pati S.K.,Raj G.,Mohankumar N.,Sarkar C.K.,J.Semicond.33(12):124001-1–124001-7,2012].The maximum drain current density is achieved with improving the density of two-dimensional electron gas(2DEG)and with high velocity.High electron mobility transistor(HEMT)structure is used with the different combinations of layers which have different bandgaps.Parameters such as electron mobility,bandgap,dielectric constant,etc.,are considered differently for each layer[Zhang A.,Zhang L.,Tang Z.,IEEE Trans.Electron Devices 61(3):755–761,2014].The high electron mobility electrons are now widely used in so many applications.The proposed work of AlInSb/InSb heterostructure implements the same process which will be a promise for future research works.