Sawing Performance Comparison of Brazed and Sintered Diamond Wires

Great attention has been paid on fabricating diamond wire by using the brazing diamond because of its strong chemical bonding strength and controllability of grits distribution. Although several serving performances of brazed diamond wire have been reported, seldom do these studies refer to its process characteristics. Sawing performances of a brazed diamond wire are investigated and compared with those of a sintered diamond wire on a wire saw machine. The surface topographies of beads selected from the two wires are micro observed before sawing. The sawing tests are carried out in constant feed rate feeding（CFF） and constant normal force feeding（CNFF）. In CFF test, sawing force, power, and the cut depths of positions on contact curve are measured. Then, coupled with the observations of beads topographies, sawing force and its ratio, relations of power against material removal rate, and contact curve linearity are compared and discussed. In CNFF test, the sawing rates of the two wires are investigated. The results indicate that the brazed wire performs with lower sawing force（less 16% of tangential force and 28% of normal force）, more energy efficiency（nearly one-fifth of sawing power is saved）, at a higher sawing rate （the rate is doubled） and with better contact curve linearity as compared with the sintered wire. This proposed research experimentally evaluates the sawing performances of brazed diamond wire from the aspect of process parameters, which can provide a basis for popularizing the brazed diamond wire.

Research on Cutting Force of Ultrasonic Diamond Wire Saw

Based on impulse and vibration machining theories,a mathematical model of cutting force for the electroplated diamond ultrasonic wire saw was established using superposition principle.The differences between the cutting forces with and without ultrasonic effect were analyzed theoretically and experimentally.The results indicate that the cutting force of diamond wire increases along with the spindle speed decrease and the lateral pressure increase.The force in ultrasonic vibration cutting is about 20% to 30% less than that in conventional cutting.Also,the cutting trajectory of single diamond grit in sawing process is simulated,and the reason that the ultrasonic vibration can reduce the cutting force is explained further.

Research on Cutting Trajectory of Electroplated Diamond Wire Saw

The cutting process of electroplated diamond wire saw was researched on the basis of impulse and vibration machining theories. The different contact states in the cutting process were analyzed by using the finite element method. It shows that the cutting stress is uniformly distributed along the direction of the workpiece width in the steady state. A mathematical equation of sawing trajectory was established by using the superposition principle and the cutting experiment of wire saw to calculate the cutting trajectory. The comparison of the theoretical trajectory with the calculated one indicates that the error is less than 15%. The research results provide a theoretic basis for optimization of the saw's cutting process parameters.

Cutting Characteristics of CFRP Boards Using Electroplated Diamond Wire Tools

CFRP （carbon fiber reinforced plastic）, which is composed of carbon fibers in a resin matrix, is an extremely strong and light composite material that has found use in the aerospace and automotive industries. CFRP boards are very difficult to machine using common machining processes. Various machining artifacts, such as burrs and delamination, occur frequently when machining CFRP. Adequate techniques for machining CFRP have not yet been established. Recently, electroplated diamond wire machining technology has found use in cutting hard, brittle materials such as silicon and sapphire. In this study, we used an electroplated diamond wire saw to cut a CFRP workpiece. We quantified the cutting forces imposed on the workpiece and observed the surface state of the workpiece after cutting. We demonstrated that an electroplated diamond wire tool is suitable for the high-quality machining of CFRP boards.

Study on swarf when sawing granite with diamond wire

The diamond wire-sawing process was developed to cut granite in both quarries and block processing plants.In this paper,swarf was collected from different areas along the sawing arc when sawing three granites.The particle size distribution and the morphology of the swarf were investigated systematically,along with the swarf formation mechanism in sawing.Granite swarf formation was dominated by transgranular fractures based on the morphology of sawn granite chips and the analysis of sawn chip size.A long cutting arc increased the movement among the swarf,tool,and workpiece,thereby inducing a secondary fracture in the sawn chip.

Challenges in Processing Diamond Wire Cut and Black Silicon Wafers in Large-Scale Manufacturing of High Efficiency Solar Cells

Texturing of diamond wire cut wafers using a standard wafer etch process chemistry has always been a challenge in solar cell manufacturing industry. This is due to the change in surface morphology of diamond wire cut wafers and the abundant presence of amorphous silicon content, which are introduced from wafer manufacturing industry during sawing of multi-crystalline wafers using ultra-thin diamond wires. The industry standard texturing process for multi-crystalline wafers cannot deliver a homogeneous etched silicon surface, thereby requiring an additive compound, which acts like a surfactant in the acidic etch bath to enhance the texturing quality on diamond wire cut wafers. Black silicon wafers on the other hand require completely a different process chemistry and are normally textured using a metal catalyst assisted etching technique or by plasma reactive ion etching technique. In this paper, various challenges associated with cell processing steps using diamond wire cut and black silicon wafers along with cell electrical results using each of these wafer types are discussed.

Experimental Study on the Machining Technology of ZrO_2 Ceramics Using Diamond Wire Saw with Ultrasonic Vibration

The influence of different technological parameter on material remove rate and surface quality of ZrO2 ceramics is studied using the cutting machining method of electroplate diamond wire saw with ultrasonic vibration.Experimental results show that,compared with the same experiment condition without ultrasonic vibration,this cutting method has the advantages of high material remove rate,good surface quality,little brokenness and so on.

Polycrystalline diamond mini-cubes for sawing applications

Diamond grits are indispensable for sawing granite or concrete.Each year about 1 000 tons of diamond grits are consumed for such purposes.In all cases,mono crystalline diamond is used.However, polycrystalline grits(polygrits) are generally better performed than mono grits as abrasives.For example,poly grits of cubic boron nitride(e.g.Borazon(?) CBN-550 of Diamond Innovations) can cut faster and they last longer than mono grits(e.g.Borazon(?) CBN-500). Polygrits of alumina(e.g.Cubitron(?) of 3M) also out perform by far glassy grits(e.g.white alumina).For diamond superabrasives,micron polygrits formed by shock waves may polish as fast as mono grits of the same size,but without causing as much scratches due to the presence of smaller sintered grains.The improved performance of poly grits is attributed to their ability to micro chipping that renews the sharp cutting corners from time to time.By contrast,mono grits tend to round off at low cutting force or macro fracture at high cutting force,so they may lose the cutting ability rapidly. For sawing granite with mesh sizes 40/50 or coarser,poly grits of diamond have not been available until recently.In this research,we have made polygrits in mini cube with sizes of 18/20,20/25,and 30/40.Turbo grinders and wire saws were made by brazing both mono grits and polygrits on steel substrates.Cutting performance on granite demonstrated that grinding speed was faster with turbo grinder,and the surface finish was smoother with wire saw for poly grits than mono ones. Polygrits and mono grits of diamond were mixed for comparison(upper left).Polygrits of mini cubes were brazed on the pearl of a wire saw(upper right).Mono diamond grits were brazed on a turbo grinder(bottom diagrams ).

线锯用金刚石微粉表面化学镀镍工艺及性能研究

金刚石微粉性能是提升金刚石线锯性能的关键因素。用化学镀方法在线锯用金刚石微粉表面镀镍,通过正交试验研究金刚石粒度、次亚磷酸钠浓度、镀液pH值和镀液温度对化学镀镀层沉积速率、镀层密度、镀层耐腐蚀性能、镀层致密度等性能的影响。结果表明:M1/2、M6/12、M20/30三种不同粒度金刚石微粉,在次亚磷酸钠浓度为25~35g/L、化学镀液pH值为3~11、化学镀温度为30℃~90℃时,针对镀层沉积速率、镀层密度和镀层耐腐蚀性的最佳工艺参数不同;不同粒度的金刚石微粉在相同工艺条件下化学镀镍,金刚石微粉粒度越大,镀层越均匀致密;金刚石微粉化学镀镍各工艺参数之间相互作用,共同影响镀层性能。对于不同粒度的金刚石微粉,各因素对镀层性能的影响权重不同,因此针对不同粒度、不同镀层性能需求的金刚石微粉应采取不同的镀覆工艺参数。

基于金刚线切片的钙钛矿/硅叠层太阳电池

提出一种免空穴传输层的策略,将自组装单分子层材料作为钙钛矿活性层的添加剂,通过一步旋涂法直接将钙钛矿薄膜制备在导电基底表面,其中薄膜的质量与均一性都得到改善。进一步地,将该方法应用在低成本的商用金刚线切片上,可在高粗糙度的硅表面制备出覆盖度高、形貌致密、无空洞的钙钛矿薄膜。在光电性能方面,用该方法得到的单结钙钛矿太阳电池的光电转换效率为21%,填充因子高达83%,两端钙钛矿/硅叠层太阳电池的光电转换效率为28%。

金刚石串珠绳锯切割煤层卸压增透效应研究

为探讨金刚石串珠绳锯割缝对缝槽周围煤层的卸压增透效应,首先建立基于缝槽顶板受力的两端固支梁力学模型,分析顶板梁的受力特征及缝槽顶板下沉接触底板(简称触底)特性,然后采用自行设计的物理相似模拟试验平台开展相似模拟试验,分析不同工艺参数绳锯割缝后缝槽上下方煤岩层应力、位移变化规律,基于FLAC^(3D)数值模拟和开发的煤层瓦斯渗透率计算程序,分析随割煤工作面推进缝槽周围煤岩体的应力和渗透率分布特征和周期演化规律。研究表明:绳锯割缝使缝槽周围应力重新分布,缝槽顶板随着割缝工作面的推进经过顶板悬露、顶板触底,连续缓沉3种演化形态;顶板未触底时,缝槽上下方形成“U”形卸压区,最大挠度在顶板中心位置,也是最先触底部位,顶板触底之后,缝槽中间位置出现应力恢复,减弱绳锯割缝的卸压增透效果;串珠绳锯的直径越大,顶板发生触底的极限跨度越大,缝槽触底越晚,卸压效果越好;相同割缝直径增加第2条割缝,两缝槽卸压区连成一起,卸压效果相互促进,减弱两缝作用下的应力恢复现象,增大了卸压范围;缝槽推进距离足够长时,由于顶板触底,缝槽两边的卸压增透效果更好,割缝卸压的影响范围从左到右划分为应力集中区、卸压区、应力恢复区、卸压区、应力集中区,对应的卸压区和应力恢复区都有较好的增透效果。

晶硅太阳能电池制备过程中硅渣和金刚石线切割硅废料的回收利用研究进展

随着晶硅太阳能电池的快速发展,晶体硅片的需求大幅增加。晶体硅片在生产制备过程中,大量的硅以硅渣和金刚石线切割硅废料的形式流失。硅渣和金刚石线切割硅废料中硅的回收再循环利用对降低晶硅太阳能电池的成产成本、有效解决晶体硅片短缺以及环境污染等问题具有重要意义。本文通过对从硅渣和金刚石线切割硅废料中回收制备高纯硅的现有工艺和研究进展进行综述,对不同回收工艺的优势、缺陷以及改进措施进行分析,有助于研究人员选择合理的高纯硅回收策略,为晶硅太阳能电池产业的低成本、绿色可持续发展提供参考。

无润滑条件下工艺参数对Al6063金刚石线切表面粗糙度影响

金刚石线锯因具有超高的硬度和耐磨性,常用于切削各种硬质材料,因加工过程摩擦较为剧烈,通常加冷却润滑介质,但一些特殊需求下,铝合金需要线切时无法施加冷却液。基于单因素试验法,在无润滑条件下进行了Al6063材料的线锯试验,分析了加工表面不同区域粗糙度的分布规律以及配重、线速度与进给速度对加工表面粗糙度的影响规律。结果表明,加工面中间位置表面粗糙度最大;在试验范围内配重越大,对应的表面粗糙度值越小;金刚石线锯线速度越大,其表面粗糙度值越小;进给速度越小,所对应的表面粗糙度值越小。试验结果对提高加工表面质量有实际参考价值。

光伏单晶硅细线超薄切片加工研究进展

分析光伏单晶硅切片加工的原理和现状,金刚石线锯母线直径已降低至37μm,G12半片光伏单晶硅片的切片厚度已减小到110μm。阐述光伏硅晶体高出片率切片加工的主要技术途径是锯切硅片厚度减薄和金刚石线锯直径减小。分别讨论锯切硅片表面裂纹损伤和断裂强度、金刚石线锯间和硅片间的液桥作用以及机器视觉检测对光伏单晶硅高出片率切片加工的影响。对光伏单晶硅高出片率切片加工面临的关键技术提出展望:1)开发低成本钨丝金刚石线锯;2)研发新型冷却润滑液和冷却润滑技术;3)研发切片加工新工艺;4)建立电镀金刚石线锯表面磨粒分布状态与切片加工性能之间的量化关系。

电镀金刚石线锯的基线镀前脱除缺陷黄铜保护镀层技术的研究

以镀铜碳钢丝为基线,在其表面电镀镍与金刚石复合层制成金刚石线锯,用于高硬脆材料的切割。线锯高速切割时易发生扭转,若所镀复合层与基线结合力不佳则易分层导致线锯报废。现有技术制备的线锯存在复合层与基线结合力不适合高速切割的缺陷。在探讨其成因的基础上,设计了物理法基线镀前脱除缺陷黄铜保护镀层工艺和装置,可选择性脱除缺陷黄铜镀层,用于制备电镀金刚石线锯。结果表明:该技术可脱除基线表面的缺陷黄铜镀层,提高复合层与基线的结合力,制备的金刚石线锯可满足扭转、折断和破断试验的要求,适合高速切割。

《金刚石线母线钢丝》的标准研究

介绍制定行业标准《金刚石线母线钢丝》的任务来源、工作程序和编制准则,对标准中10个章节的主要条款进行解释说明。标准主要内容包括术语与定义、标记方法、订货内容、尺寸外形长度及允许偏差、技术及性能要求、试验方法、检验规则、包装标志、贮存与运输、质量保证书。行业标准制定与发布,避免了用户与下游客户之间质量异议,规范生产、销售、使用的秩序。

金刚石颗粒表面镍镀层化学改性研究

为消除金刚线生产过程中分散剂对工艺的负面影响,探索新的金刚线镀镍工艺。首先,使用H_(2)O_(2)对镀镍金刚石颗粒表面进行羟基化;然后,将其同二甲基十八烷基[3-(三甲氧基硅)丙基]氯化铵进行反应,制备表面带正电的金刚石颗粒;最后,对金刚线的制备工艺进行优化。研究结果表明:反应后金刚石颗粒的表面电位从−7.50 mV转变至14.10 mV以上,最高可达30.68 mV。其最佳制备条件为原砂与H_(2)O_(2)的质量比为2∶1,处理时间为1 h;金刚石颗粒与季铵盐的质量比为1∶2,处理时间为4 h。在电镀过程中,经表面化学修饰的金刚石颗粒能够在没有分散剂的条件下,均匀地向阴极迁移,其上砂量增多20%以上。

超声辅助金刚石线锯复合切割技术的研究进展

硬脆材料与复合材料等高性能材料在多个领域广泛应用,其切割主要采用金刚石线锯加工技术。近年来,对切割加工质量和效率的要求不断提高,超声辅助金刚石线锯复合切割技术逐渐发展起来。超声辅助金刚石线锯复合切割技术提高了锯切效率和加工表面质量,延长了锯丝服役寿命,是未来的重要发展方向。文章从超声辅助金刚石线锯复合切割技术的加工原理、加工质量和影响因素等方面概述了该技术的研究现状,并对未来需进一步研究的问题和发展方向进行了展望。

金刚石线锯成形切割工程陶瓷圆弧试验研究

针对工程陶瓷圆形零件难以成形加工的问题,提出了一种金刚石线锯成形加工工程陶瓷圆弧件的新方法,以圆弧面的径向跳动为衡量圆度指标,采用单因素实验法分析了线速度、转台转速和张紧力等工艺参数对圆弧件形状精度圆度、加工效率、线弓角度、表面粗糙度、表面形貌的影响规律。试验结果得出:在本试验参数范围内,线速度越大圆弧面的圆度越好、加工效率越高、线弓角度越小、表面粗糙度越好、表面质量越好;转台转速越小圆弧面的圆度越好、加工效率越高、线弓角度越小、表面粗糙度越好、表面质量越好;张紧力越大圆弧面的圆度越好、加工效率越高、线弓角度越小、表面粗糙度越好、表面质量越好。

基于超声毛细效应的电镀金刚石线切割工作液供给基础研究

薄片化、细线化是太阳能硅片切割的重要发展趋势,有利于光伏行业降本增效、降低发电的度电成本。细线化切割导致硅片间距小于100μm,薄片化则降低硅片抗弯能力,因此硅片间极易发生硅片吸附贴合现象,从而增加了硅片破裂风险。为此,提出将超声波毛细效应用于电镀金刚石线硅片切割,以减少和抑制晶圆吸附。为探究平板间超声波毛细作用规律进而指导工业应用,分别研究了平行板间距、平板与超声水槽底面间距、平板间不平行、表面活性剂、工作液温度和超声作用时间对超声波毛细现象的影响规律。研究结论为工业应用提供了指导,有助于抑制晶圆吸附,减小晶圆弯曲度,降低细线切割硅片的表面裂纹损伤,提高其断裂强度。